JPH0134341Y2 - - Google Patents

Info

Publication number

JPH0134341Y2

JPH0134341Y2 JP17007682U JP17007682U JPH0134341Y2 JP H0134341 Y2 JPH0134341 Y2 JP H0134341Y2 JP 17007682 U JP17007682 U JP 17007682U JP 17007682 U JP17007682 U JP 17007682U JP H0134341 Y2 JPH0134341 Y2 JP H0134341Y2

Authority

JP

Japan

Prior art keywords

view

plan

conductor

chip

showing

Prior art date

1982-11-09

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

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• 239000003990 capacitor Substances 0.000 claims description 14
• 239000002131 composite material Substances 0.000 claims description 14
• 239000012212 insulator Substances 0.000 claims description 13
• 239000004020 conductor Substances 0.000 description 26
• 229910000859 α-Fe Inorganic materials 0.000 description 20
• 239000000463 material Substances 0.000 description 6
• 229910052751 metal Inorganic materials 0.000 description 5
• 239000002184 metal Substances 0.000 description 5
• 238000010586 diagram Methods 0.000 description 3
• 239000003989 dielectric material Substances 0.000 description 3
• PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
• 239000000919 ceramic Substances 0.000 description 2
• 238000009413 insulation Methods 0.000 description 2
• 238000010030 laminating Methods 0.000 description 2
• 239000000696 magnetic material Substances 0.000 description 2
• 230000035699 permeability Effects 0.000 description 2
• 238000005476 soldering Methods 0.000 description 2
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
• PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
• 239000003985 ceramic capacitor Substances 0.000 description 1
• 229910052802 copper Inorganic materials 0.000 description 1
• 239000010949 copper Substances 0.000 description 1
• NKZSPGSOXYXWQA-UHFFFAOYSA-N dioxido(oxo)titanium;lead(2+) Chemical compound [Pb+2].[O-][Ti]([O-])=O NKZSPGSOXYXWQA-UHFFFAOYSA-N 0.000 description 1
• JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
• HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 1
• 238000000034 method Methods 0.000 description 1
• 238000000465 moulding Methods 0.000 description 1
• 229910052759 nickel Inorganic materials 0.000 description 1
• 239000003973 paint Substances 0.000 description 1
• SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 1
• 238000007747 plating Methods 0.000 description 1
• 239000000843 powder Substances 0.000 description 1
• 229910001285 shape-memory alloy Inorganic materials 0.000 description 1
• 238000005245 sintering Methods 0.000 description 1
• 238000004544 sputter deposition Methods 0.000 description 1
• 239000010935 stainless steel Substances 0.000 description 1
• 229910001220 stainless steel Inorganic materials 0.000 description 1
• 229920003002 synthetic resin Polymers 0.000 description 1
• 239000000057 synthetic resin Substances 0.000 description 1
• 238000007740 vapor deposition Methods 0.000 description 1
• 238000004804 winding Methods 0.000 description 1