JPH0132797Y2 - - Google Patents
Info
- Publication number
- JPH0132797Y2 JPH0132797Y2 JP14520683U JP14520683U JPH0132797Y2 JP H0132797 Y2 JPH0132797 Y2 JP H0132797Y2 JP 14520683 U JP14520683 U JP 14520683U JP 14520683 U JP14520683 U JP 14520683U JP H0132797 Y2 JPH0132797 Y2 JP H0132797Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- laminated
- electromagnetic shielding
- shielding material
- board device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000463 material Substances 0.000 claims description 26
- 239000004020 conductor Substances 0.000 claims description 10
- 239000011888 foil Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000009931 harmful effect Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14520683U JPS6052698U (ja) | 1983-09-20 | 1983-09-20 | 回路基板装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14520683U JPS6052698U (ja) | 1983-09-20 | 1983-09-20 | 回路基板装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6052698U JPS6052698U (ja) | 1985-04-13 |
| JPH0132797Y2 true JPH0132797Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1989-10-05 |
Family
ID=30323581
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14520683U Granted JPS6052698U (ja) | 1983-09-20 | 1983-09-20 | 回路基板装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6052698U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
-
1983
- 1983-09-20 JP JP14520683U patent/JPS6052698U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6052698U (ja) | 1985-04-13 |