JPH0132364Y2 - - Google Patents
Info
- Publication number
- JPH0132364Y2 JPH0132364Y2 JP1985030456U JP3045685U JPH0132364Y2 JP H0132364 Y2 JPH0132364 Y2 JP H0132364Y2 JP 1985030456 U JP1985030456 U JP 1985030456U JP 3045685 U JP3045685 U JP 3045685U JP H0132364 Y2 JPH0132364 Y2 JP H0132364Y2
- Authority
- JP
- Japan
- Prior art keywords
- crystallized glass
- gold
- eutectic solder
- substrate
- terminal portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011521 glass Substances 0.000 claims description 13
- 229910000679 solder Inorganic materials 0.000 claims description 13
- 230000005496 eutectics Effects 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 9
- OFLYIWITHZJFLS-UHFFFAOYSA-N [Si].[Au] Chemical compound [Si].[Au] OFLYIWITHZJFLS-UHFFFAOYSA-N 0.000 claims description 4
- 238000005219 brazing Methods 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 239000010931 gold Substances 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 1
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 description 5
- LTPBRCUWZOMYOC-UHFFFAOYSA-N Beryllium oxide Chemical compound O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- -1 AI 2 O 3 Inorganic materials 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 229910000833 kovar Inorganic materials 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- NEIHULKJZQTQKJ-UHFFFAOYSA-N [Cu].[Ag] Chemical compound [Cu].[Ag] NEIHULKJZQTQKJ-UHFFFAOYSA-N 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000010344 co-firing Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985030456U JPH0132364Y2 (de) | 1985-03-04 | 1985-03-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985030456U JPH0132364Y2 (de) | 1985-03-04 | 1985-03-04 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61146958U JPS61146958U (de) | 1986-09-10 |
| JPH0132364Y2 true JPH0132364Y2 (de) | 1989-10-03 |
Family
ID=30530170
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985030456U Expired JPH0132364Y2 (de) | 1985-03-04 | 1985-03-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0132364Y2 (de) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55128899A (en) * | 1979-03-23 | 1980-10-06 | Ibm | Method of fabricating glass ceramic structure |
| JPS60170286A (ja) * | 1984-02-14 | 1985-09-03 | 富士通株式会社 | ガラスセラミツク基板の製造方法 |
| JPS60198763A (ja) * | 1984-03-22 | 1985-10-08 | Nec Corp | ピン付基板およびその製造方法 |
| JPS60198760A (ja) * | 1984-03-22 | 1985-10-08 | Nec Corp | ろう付け方法 |
-
1985
- 1985-03-04 JP JP1985030456U patent/JPH0132364Y2/ja not_active Expired
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55128899A (en) * | 1979-03-23 | 1980-10-06 | Ibm | Method of fabricating glass ceramic structure |
| JPS60170286A (ja) * | 1984-02-14 | 1985-09-03 | 富士通株式会社 | ガラスセラミツク基板の製造方法 |
| JPS60198763A (ja) * | 1984-03-22 | 1985-10-08 | Nec Corp | ピン付基板およびその製造方法 |
| JPS60198760A (ja) * | 1984-03-22 | 1985-10-08 | Nec Corp | ろう付け方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61146958U (de) | 1986-09-10 |
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