JPH0131802B2 - - Google Patents

Info

Publication number
JPH0131802B2
JPH0131802B2 JP57194413A JP19441382A JPH0131802B2 JP H0131802 B2 JPH0131802 B2 JP H0131802B2 JP 57194413 A JP57194413 A JP 57194413A JP 19441382 A JP19441382 A JP 19441382A JP H0131802 B2 JPH0131802 B2 JP H0131802B2
Authority
JP
Japan
Prior art keywords
piezoelectric element
main surfaces
adhesive layer
insulating substrates
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57194413A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5985119A (ja
Inventor
Masanori Fujita
Mitsuyuki Sugita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seikosha KK
Original Assignee
Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seikosha KK filed Critical Seikosha KK
Priority to JP19441382A priority Critical patent/JPS5985119A/ja
Publication of JPS5985119A publication Critical patent/JPS5985119A/ja
Publication of JPH0131802B2 publication Critical patent/JPH0131802B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1035—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by two sealing substrates sandwiching the piezoelectric layer of the BAW device

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP19441382A 1982-11-05 1982-11-05 厚みすべり圧電振動子 Granted JPS5985119A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19441382A JPS5985119A (ja) 1982-11-05 1982-11-05 厚みすべり圧電振動子

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19441382A JPS5985119A (ja) 1982-11-05 1982-11-05 厚みすべり圧電振動子

Publications (2)

Publication Number Publication Date
JPS5985119A JPS5985119A (ja) 1984-05-17
JPH0131802B2 true JPH0131802B2 (enrdf_load_stackoverflow) 1989-06-28

Family

ID=16324184

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19441382A Granted JPS5985119A (ja) 1982-11-05 1982-11-05 厚みすべり圧電振動子

Country Status (1)

Country Link
JP (1) JPS5985119A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03184411A (ja) * 1989-12-13 1991-08-12 Murata Mfg Co Ltd 圧電振動部品

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52123888A (en) * 1976-04-12 1977-10-18 Matsushima Kogyo Kk Thickness slip quartz oscillator
JPS5748089Y2 (enrdf_load_stackoverflow) * 1976-07-02 1982-10-22
JPS5433714A (en) * 1977-08-19 1979-03-12 Mitsubishi Electric Corp Automatic playing envelope generating system

Also Published As

Publication number Publication date
JPS5985119A (ja) 1984-05-17

Similar Documents

Publication Publication Date Title
KR0171921B1 (ko) 전자부품과 그 제조방법
JPS6258923U (enrdf_load_stackoverflow)
US4160928A (en) Case assembly for piezoelectric resonator
JPH0131802B2 (enrdf_load_stackoverflow)
JPH0131804B2 (enrdf_load_stackoverflow)
JPH04133480A (ja) 光半導体装置用ステム
JP3968782B2 (ja) 電子部品用パッケージおよび当該パッケージを用いた圧電振動デバイスおよび圧電振動デバイスの製造方法
JPH0131803B2 (enrdf_load_stackoverflow)
JP3164891B2 (ja) 水晶振動子とその製造方法
JP3164890B2 (ja) 水晶振動子とその製造方法
JPH0131801B2 (enrdf_load_stackoverflow)
JPS5821216Y2 (ja) 小型圧電振動子の支持構造
JPS6359281B2 (enrdf_load_stackoverflow)
JP2004104117A (ja) 電子部品用パッケージおよび当該パッケージを用いた圧電振動デバイス
JP2001144580A (ja) 水晶振動子
JPS5967710A (ja) 厚みすべり圧電振動子
WO2018047876A1 (ja) 水晶振動子及びその製造方法
JP4477541B2 (ja) 回路基板とその製造方法およびそれを用いた電子部品
JPS6216573B2 (enrdf_load_stackoverflow)
JP3660613B2 (ja) チップ型サージ吸収素子の製造方法
JPS5831048B2 (ja) 水晶振動子封入体
JPH0548370A (ja) 水晶フイルター素子
JP2001093998A (ja) パッケージ
JPS5844652Y2 (ja) 振動子の支持構造
JPS59176918A (ja) 水晶振動子