JPH0131802B2 - - Google Patents

Info

Publication number
JPH0131802B2
JPH0131802B2 JP57194413A JP19441382A JPH0131802B2 JP H0131802 B2 JPH0131802 B2 JP H0131802B2 JP 57194413 A JP57194413 A JP 57194413A JP 19441382 A JP19441382 A JP 19441382A JP H0131802 B2 JPH0131802 B2 JP H0131802B2
Authority
JP
Japan
Prior art keywords
piezoelectric element
main surfaces
adhesive layer
insulating substrates
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57194413A
Other languages
Japanese (ja)
Other versions
JPS5985119A (en
Inventor
Masanori Fujita
Mitsuyuki Sugita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seikosha KK
Original Assignee
Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seikosha KK filed Critical Seikosha KK
Priority to JP19441382A priority Critical patent/JPS5985119A/en
Publication of JPS5985119A publication Critical patent/JPS5985119A/en
Publication of JPH0131802B2 publication Critical patent/JPH0131802B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02Details
    • H03H9/05Holders; Supports
    • H03H9/10Mounting in enclosures
    • H03H9/1007Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1035Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by two sealing substrates sandwiching the piezoelectric layer of the BAW device

Description

【発明の詳細な説明】 本発明は、厚みすべり振動子を行なう圧電振動
子に関するものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a piezoelectric vibrator that functions as a thickness-shear vibrator.

従来、厚みすべり圧電振動子の一例としてAT
カツトの水晶振動子は気密端子の2本の端子ピン
に保持バネを溶接などにより固着し、2本の保持
バネの間に水晶片を支持し、保持バネ、水晶片と
接触しない状態でキヤツプを被せ、気密端子のベ
ースとキヤツプとを封止していた。このため部品
点数が多くなり、構成が複雑であつた。また製
造、組立が煩雑であり、外形形状が大きくなると
いう欠点を持つていた。さらに水晶片は2点にて
支持されるため衝撃に弱いという不都合もあつ
た。
Conventionally, AT is an example of a thickness-shear piezoelectric vibrator.
In the cut crystal unit, a holding spring is fixed to two terminal pins of an airtight terminal by welding, etc., a crystal piece is supported between the two holding springs, and the cap is held in place without contacting the holding spring or the crystal piece. The base of the terminal and the cap were sealed together. This resulted in a large number of parts and a complex configuration. In addition, manufacturing and assembly are complicated, and the external shape is large. Furthermore, since the crystal piece is supported at two points, there is also the disadvantage that it is susceptible to impact.

本発明は上記欠点を除去するものであり、構成
が簡単で部品点数が少なく、製造、組立が容易で
あり、衝撃に強く、外形形状の小さい厚みすべり
圧電振動子を提供することを目的とするものであ
る。
The present invention eliminates the above-mentioned drawbacks, and aims to provide a thin-thickness sliding piezoelectric vibrator that has a simple structure, a small number of parts, is easy to manufacture and assemble, is resistant to impact, and has a small external shape. It is something.

以下本発明の実施例を詳細に説明する。 Examples of the present invention will be described in detail below.

第1図において、1は厚みすべり振動子の一例
としてのATカツト水晶振動子であり、厚みすべ
封振動を行う水晶片2が、その外周端部に対応す
る接着層3,4にスペーサ5,6を介在させた状
態で、接着層3,4により絶縁性の平板状基板
7,8間に封着されているものである。
In FIG. 1, reference numeral 1 denotes an AT-cut crystal resonator as an example of a thickness-shear resonator, in which a crystal piece 2 that performs thickness-shear vibration is attached to adhesive layers 3 and 4 corresponding to its outer peripheral edge with spacers 5, Insulating flat substrates 7 and 8 are sealed by adhesive layers 3 and 4 with substrates 6 interposed therebetween.

水晶片2は、第2図示のように、両主面に駆動
電極2aと外周端部に延伸する引出し電極2bと
が蒸着により形成してあるものであるが、この実
施例では、両主面が凸状に形成され、厚みすべり
振動の振動エネルギを中央部に集中させ、外周端
部の振動変位を極めて小さくしてある。
As shown in the second figure, the crystal piece 2 has drive electrodes 2a and extraction electrodes 2b extending to the outer peripheral end formed on both main surfaces by vapor deposition. is formed in a convex shape, concentrating the vibration energy of thickness shear vibration in the center, and minimizing vibration displacement at the outer peripheral end.

水晶片2の凸面状の主面中央部が基板7,8と
非接触になるように接着層3,4そのものを厚く
すると、接着強度、気密性能の点で問題となる。
このため接着層3,4の間にスペーサ5,6を介
在させた構成とし、所要の接着強度と気密性能を
確保している。
If the adhesive layers 3 and 4 themselves are made thick so that the central portion of the convex main surface of the crystal piece 2 does not come into contact with the substrates 7 and 8, problems arise in terms of adhesive strength and airtightness.
For this reason, spacers 5 and 6 are interposed between the adhesive layers 3 and 4 to ensure the required adhesive strength and airtightness.

スペーサ5,6は、第3,4図に示すように、
水晶片2の外周部に対向可能なリング状部5a,
6aと、外方に延伸する引出し端子5b,6bと
から構成されていいる。スペーサ5,6の素材と
しては、水晶片2と熱膨脹係数の近い金属薄板が
望ましく、本例では鉄50%、ニツケル50%の鉄ニ
ツケル合金が用いられている。
The spacers 5 and 6 are, as shown in FIGS. 3 and 4,
A ring-shaped portion 5a that can face the outer periphery of the crystal piece 2,
6a, and pull-out terminals 5b, 6b extending outward. The material for the spacers 5 and 6 is preferably a metal thin plate having a thermal expansion coefficient similar to that of the crystal blank 2, and in this example, an iron-nickel alloy containing 50% iron and 50% nickel is used.

基板7,8には、水晶片と熱膨脹係数が近く通
気性のないセラミツク、ガラスなどの絶縁性材料
が適している。
For the substrates 7 and 8, an insulating material such as ceramic or glass, which has a coefficient of thermal expansion close to that of the crystal piece and has no air permeability, is suitable.

接着層3,4は、異方導電性接着剤にて形成さ
れたものである。この異方導電性接着剤は、絶縁
性接着剤に銀粉などを20〜40重量%程度混ぜたも
ので、厚み方向(押圧方向)にのみ導通を示し、
横方向には絶縁を示すものである。駆動電極2a
の引出し電極2bとスペーサ5,6のリング状部
5a,6aとが異方導電性接着剤である接着層
3,4によつて導通される。接着層3,4が異方
導電性接着剤により形成してあるから、水晶片2
の外周端において接着層3,4がはみ出して接触
しても短絡することはない。
The adhesive layers 3 and 4 are made of an anisotropically conductive adhesive. This anisotropic conductive adhesive is a mixture of an insulating adhesive and silver powder, etc. at a concentration of about 20 to 40% by weight, and exhibits conductivity only in the thickness direction (pressing direction).
The horizontal direction indicates insulation. Drive electrode 2a
The lead electrode 2b and the ring-shaped portions 5a, 6a of the spacers 5, 6 are electrically connected to each other by the adhesive layers 3, 4, which are anisotropic conductive adhesives. Since the adhesive layers 3 and 4 are made of an anisotropic conductive adhesive, the crystal piece 2
Even if the adhesive layers 3 and 4 protrude and come into contact with each other at the outer peripheral edge, there will be no short circuit.

水晶片2と基板7との間の空間および水晶片2
と基板8との間の空間は気密状態となつており、
真空あるいは不活性ガス置換されている。なお水
晶片2外周部に基板7,8に接するようにワツク
スなどを充填すれば気密性能をより向上させるこ
とができる。
Space between crystal piece 2 and substrate 7 and crystal piece 2
The space between and the substrate 8 is airtight,
Vacuum or inert gas replacement. Note that the airtightness can be further improved by filling the outer peripheral portion of the crystal piece 2 with wax or the like so as to be in contact with the substrates 7 and 8.

以上述べたように本発明によれば、圧電素子を
1対の基板間に狭持封着するに際し、この狭持封
着を異方導電性接着剤による接着層によつて行な
うとともに、接着層に外部接続用の引出し端子を
有するスペーサを介在させて介在させているか
ら、封着と同時にスペーサと圧電素子との導通が
計れ、しかもこの封着作業時に接着剤がはみ出し
たとしても短絡することがない。したがつて製造
組立が非常に容易になる。また、部品点数が少な
く構成が簡単であるから小型化できる。さらに、
耐衝撃性、気密性能に優れた厚みすべり圧電振動
子を提供することができる。
As described above, according to the present invention, when sandwiching and sealing a piezoelectric element between a pair of substrates, this sandwiching and sealing is performed using an adhesive layer made of an anisotropic conductive adhesive, and the adhesive layer Since a spacer with a pull-out terminal for external connection is interposed between the spacer and the piezoelectric element, conduction between the spacer and the piezoelectric element can be established at the same time as sealing, and even if the adhesive spills out during the sealing process, there will be no short circuit. There is no. Therefore, manufacturing and assembly becomes very easy. Further, since the number of parts is small and the configuration is simple, it can be made smaller. moreover,
It is possible to provide a thickness-shear piezoelectric vibrator with excellent impact resistance and airtightness.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の一実施例の断面図、第2図は
水晶片の正面図、第3,4図はスペーサの正面図
である。 1……水晶振動子、2……水晶片、2a……駆
動電極、2b……引出し電極、3,4……接着
層、5,6……スペーサ、5a,6a……リング
状部、5b,6b……引出し端子、7,8……基
板。
FIG. 1 is a sectional view of an embodiment of the present invention, FIG. 2 is a front view of a crystal piece, and FIGS. 3 and 4 are front views of a spacer. DESCRIPTION OF SYMBOLS 1... Crystal resonator, 2... Crystal piece, 2a... Drive electrode, 2b... Extraction electrode, 3, 4... Adhesive layer, 5, 6... Spacer, 5a, 6a... Ring-shaped part, 5b , 6b... Output terminal, 7, 8... Board.

Claims (1)

【特許請求の範囲】 1 駆動電極と、この駆動電極から外周端部へ延
出形成してある引出し電極とが両主面に形成して
ある厚みすべりを行なう圧電素子と、 上記圧電素子の上記両主面と対向して位置する
1対の平板状の絶縁性基板と、 上記圧電素子の上記両主面外周部と上記両絶縁
性基板との間を封止する異方導電性接着剤により
形成された接着層と、 上記圧電素子の上記両主面を上記両絶縁性基板
と非接触状態に保つために上記接着層中に埋設し
てあり、上記異方導電性接着剤を介して上記引出
し電極と電気的に接続しているリング状部と、こ
のリング状部から外方へ一体に延出形成された外
部接続用の引出し端子とを備えた1対の金属性ス
ペーサと、 からなることを特徴とする厚みすべり圧電振動
子。
[Scope of Claims] 1. A piezoelectric element that performs thickness sliding, in which a drive electrode and an extraction electrode extending from the drive electrode to an outer peripheral end are formed on both main surfaces; A pair of flat insulating substrates located opposite both main surfaces, and an anisotropically conductive adhesive sealing between the outer peripheries of both main surfaces of the piezoelectric element and both insulating substrates. The formed adhesive layer and the piezoelectric element are embedded in the adhesive layer in order to keep both main surfaces of the piezoelectric element in a non-contact state with both the insulating substrates, and the piezoelectric element is embedded in the adhesive layer through the anisotropic conductive adhesive. A pair of metal spacers comprising a ring-shaped part that is electrically connected to the extraction electrode, and an extraction terminal for external connection that is integrally formed and extends outward from the ring-shaped part. A thickness-slip piezoelectric vibrator characterized by:
JP19441382A 1982-11-05 1982-11-05 Thickness shear piezoelectric oscillator Granted JPS5985119A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19441382A JPS5985119A (en) 1982-11-05 1982-11-05 Thickness shear piezoelectric oscillator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19441382A JPS5985119A (en) 1982-11-05 1982-11-05 Thickness shear piezoelectric oscillator

Publications (2)

Publication Number Publication Date
JPS5985119A JPS5985119A (en) 1984-05-17
JPH0131802B2 true JPH0131802B2 (en) 1989-06-28

Family

ID=16324184

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19441382A Granted JPS5985119A (en) 1982-11-05 1982-11-05 Thickness shear piezoelectric oscillator

Country Status (1)

Country Link
JP (1) JPS5985119A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03184411A (en) * 1989-12-13 1991-08-12 Murata Mfg Co Ltd Piezoelectric vibrator component

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52123888A (en) * 1976-04-12 1977-10-18 Matsushima Kogyo Kk Thickness slip quartz oscillator
JPS537159B2 (en) * 1974-01-11 1978-03-15
JPS5433714A (en) * 1977-08-19 1979-03-12 Mitsubishi Electric Corp Automatic playing envelope generating system

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5748089Y2 (en) * 1976-07-02 1982-10-22

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS537159B2 (en) * 1974-01-11 1978-03-15
JPS52123888A (en) * 1976-04-12 1977-10-18 Matsushima Kogyo Kk Thickness slip quartz oscillator
JPS5433714A (en) * 1977-08-19 1979-03-12 Mitsubishi Electric Corp Automatic playing envelope generating system

Also Published As

Publication number Publication date
JPS5985119A (en) 1984-05-17

Similar Documents

Publication Publication Date Title
KR0171921B1 (en) Electronic component and method of fabricating the same
JPS6258923U (en)
US4160928A (en) Case assembly for piezoelectric resonator
JPH0131802B2 (en)
JPH0131804B2 (en)
JPH04133480A (en) Optical semiconductor device stem
JP3968782B2 (en) Electronic component package, piezoelectric vibration device using the package, and method of manufacturing piezoelectric vibration device
JPH0131803B2 (en)
JP3164891B2 (en) Quartz crystal resonator and its manufacturing method
JP3164890B2 (en) Quartz crystal resonator and its manufacturing method
JPH0131801B2 (en)
JPS5821216Y2 (en) Support structure of small piezoelectric vibrator
JPS6359281B2 (en)
JPH0936692A (en) Piezoelectric vibrator
JP4477541B2 (en) Circuit board, manufacturing method thereof, and electronic component using the same
JPS5967710A (en) Thickness shear piezoelectric oscillator
JP2004104117A (en) Package for electronic components, and piezoelectric vibration device using the package
JP2001160730A (en) Piezoelectric vibrator and surface mounted piezoelectric vibrator
JP2001144580A (en) Crystal vibrator
JPS62241414A (en) Piezoelectric vibrator
JPS59176918A (en) Crystal oscillator
JPS6216573B2 (en)
JP3660613B2 (en) Manufacturing method of chip type surge absorbing element
WO2018047876A1 (en) Crystal oscillator and method for manufacturing same
JPS5831048B2 (en) Crystal oscillator enclosure