JPH01302824A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPH01302824A
JPH01302824A JP63132973A JP13297388A JPH01302824A JP H01302824 A JPH01302824 A JP H01302824A JP 63132973 A JP63132973 A JP 63132973A JP 13297388 A JP13297388 A JP 13297388A JP H01302824 A JPH01302824 A JP H01302824A
Authority
JP
Japan
Prior art keywords
recognition pattern
area
bonding
pellet
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP63132973A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0533822B2 (enrdf_load_stackoverflow
Inventor
Koji Kikuchi
浩二 菊地
Kazuo Endo
遠藤　和夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP63132973A priority Critical patent/JPH01302824A/ja
Publication of JPH01302824A publication Critical patent/JPH01302824A/ja
Publication of JPH0533822B2 publication Critical patent/JPH0533822B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Bipolar Transistors (AREA)
  • Wire Bonding (AREA)
JP63132973A 1988-05-31 1988-05-31 半導体装置 Granted JPH01302824A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63132973A JPH01302824A (ja) 1988-05-31 1988-05-31 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63132973A JPH01302824A (ja) 1988-05-31 1988-05-31 半導体装置

Publications (2)

Publication Number Publication Date
JPH01302824A true JPH01302824A (ja) 1989-12-06
JPH0533822B2 JPH0533822B2 (enrdf_load_stackoverflow) 1993-05-20

Family

ID=15093821

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63132973A Granted JPH01302824A (ja) 1988-05-31 1988-05-31 半導体装置

Country Status (1)

Country Link
JP (1) JPH01302824A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6316735B1 (en) 1996-11-08 2001-11-13 Ricoh Company, Ltd. Semiconductor chip mounting board and a semiconductor device using same board

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52115177A (en) * 1976-03-24 1977-09-27 Hitachi Ltd Semiconductor device
JPS58152432A (ja) * 1982-03-05 1983-09-10 早瀬　政志 糸巻き付き移動ウキ

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52115177A (en) * 1976-03-24 1977-09-27 Hitachi Ltd Semiconductor device
JPS58152432A (ja) * 1982-03-05 1983-09-10 早瀬　政志 糸巻き付き移動ウキ

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6316735B1 (en) 1996-11-08 2001-11-13 Ricoh Company, Ltd. Semiconductor chip mounting board and a semiconductor device using same board

Also Published As

Publication number Publication date
JPH0533822B2 (enrdf_load_stackoverflow) 1993-05-20

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees