JPH0129802Y2 - - Google Patents
Info
- Publication number
- JPH0129802Y2 JPH0129802Y2 JP15141983U JP15141983U JPH0129802Y2 JP H0129802 Y2 JPH0129802 Y2 JP H0129802Y2 JP 15141983 U JP15141983 U JP 15141983U JP 15141983 U JP15141983 U JP 15141983U JP H0129802 Y2 JPH0129802 Y2 JP H0129802Y2
- Authority
- JP
- Japan
- Prior art keywords
- multilayer ceramic
- ceramic substrate
- chip capacitor
- recess
- lcc
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000919 ceramic Substances 0.000 claims description 22
- 239000003990 capacitor Substances 0.000 claims description 19
- 239000000758 substrate Substances 0.000 claims description 18
- 239000004065 semiconductor Substances 0.000 claims description 10
- 239000000969 carrier Substances 0.000 claims description 5
- 238000005476 soldering Methods 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15141983U JPS6059561U (ja) | 1983-09-29 | 1983-09-29 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15141983U JPS6059561U (ja) | 1983-09-29 | 1983-09-29 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6059561U JPS6059561U (ja) | 1985-04-25 |
| JPH0129802Y2 true JPH0129802Y2 (fr) | 1989-09-11 |
Family
ID=30335548
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15141983U Granted JPS6059561U (ja) | 1983-09-29 | 1983-09-29 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6059561U (fr) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0714110B2 (ja) * | 1988-08-17 | 1995-02-15 | 株式会社村田製作所 | 多層セラミック基板 |
| JP4817110B2 (ja) * | 2005-12-26 | 2011-11-16 | 株式会社村田製作所 | 多層回路基板及びｉｃパッケージ |
| JP2017126710A (ja) * | 2016-01-15 | 2017-07-20 | 株式会社村田製作所 | 複合電子部品 |
-
1983
- 1983-09-29 JP JP15141983U patent/JPS6059561U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6059561U (ja) | 1985-04-25 |
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