JPH01295479A - Manufacture of metal base substrate - Google Patents
Manufacture of metal base substrateInfo
- Publication number
- JPH01295479A JPH01295479A JP12665888A JP12665888A JPH01295479A JP H01295479 A JPH01295479 A JP H01295479A JP 12665888 A JP12665888 A JP 12665888A JP 12665888 A JP12665888 A JP 12665888A JP H01295479 A JPH01295479 A JP H01295479A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- ceramic
- copper
- resin
- metal base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 47
- 239000002184 metal Substances 0.000 title claims abstract description 47
- 239000000758 substrate Substances 0.000 title claims abstract description 28
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 60
- 229910052802 copper Inorganic materials 0.000 claims abstract description 59
- 239000010949 copper Substances 0.000 claims abstract description 59
- 239000000919 ceramic Substances 0.000 claims abstract description 43
- 238000007747 plating Methods 0.000 claims abstract description 35
- 238000000034 method Methods 0.000 claims abstract description 26
- 229920005989 resin Polymers 0.000 claims abstract description 25
- 239000011347 resin Substances 0.000 claims abstract description 25
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract description 17
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 9
- 239000003822 epoxy resin Substances 0.000 claims description 9
- 229920000647 polyepoxide Polymers 0.000 claims description 9
- 229920001721 polyimide Polymers 0.000 claims description 4
- 239000009719 polyimide resin Substances 0.000 claims description 4
- 239000007921 spray Substances 0.000 claims description 4
- 238000005498 polishing Methods 0.000 claims description 2
- 238000005507 spraying Methods 0.000 abstract description 7
- 239000000463 material Substances 0.000 abstract description 6
- 230000005855 radiation Effects 0.000 abstract 2
- 239000011148 porous material Substances 0.000 description 16
- 230000000873 masking effect Effects 0.000 description 11
- 239000004033 plastic Substances 0.000 description 7
- 229920003023 plastic Polymers 0.000 description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 230000017525 heat dissipation Effects 0.000 description 6
- 238000007751 thermal spraying Methods 0.000 description 6
- 239000004020 conductor Substances 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 239000004744 fabric Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
- 229910052742 iron Inorganic materials 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- 229910001374 Invar Inorganic materials 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000010828 elution Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910052596 spinel Inorganic materials 0.000 description 1
- 239000011029 spinel Substances 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、熱放散性にすぐれた金属ベース基板の製造方
法に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for manufacturing a metal base substrate with excellent heat dissipation properties.
（従来の技術）
従来、プリント配線板として用いられる基板は紙基材フ
ェノール樹脂積層板、ガラス布基材エポキシ樹脂積層板
、あるいはガラス布基材ポリイミド樹脂積層板などのプ
ラスチック系基板が用いられてきた。ところが、近年電
子機器の高密度化、高出力化の進歩はめざましく、それ
に伴なって基板材料にも種々の特性が新たに求められる
ようになってきてた。(Prior Art) Conventionally, substrates used as printed wiring boards have been plastic substrates such as paper-based phenol resin laminates, glass cloth-based epoxy resin laminates, or glass cloth-based polyimide resin laminates. Ta. However, in recent years, there has been remarkable progress in increasing the density and output of electronic devices, and as a result, various new characteristics have been required of substrate materials.
中でも、基板に実装された電子部品から発生する熱をい
かに効率よく放散するかということは特に大きな問題で
ある。Among these, a particularly big problem is how to efficiently dissipate heat generated from electronic components mounted on a board.
このような要求に対しては従来のプラスチック系基板で
は熱伝導性が低いために対応できず、金属ベース基板が
用いられている。−船釣に金属ベース基板とはアルミニ
ウム、銅、鉄などの金属板の表面にガラス布基材エポキ
シ樹脂、ガラス布基材ポリイミド樹脂などの絶縁層を形
成し、その上に銅箔からなる導体層を形成したものであ
る。Conventional plastic-based substrates cannot meet these demands because of their low thermal conductivity, so metal-based substrates are used. - What is a metal base board for boat fishing? An insulating layer made of glass cloth base epoxy resin, glass cloth base polyimide resin, etc. is formed on the surface of a metal plate made of aluminum, copper, iron, etc., and on top of that is a conductor made of copper foil. It is made up of layers.
このようにすると絶縁層を介して熱伝導性のよい金属板
が存在するために従来のプラスチック系基板に比べると
熱伝導性は高くなる。In this case, since the metal plate with good thermal conductivity is present through the insulating layer, the thermal conductivity is higher than that of conventional plastic substrates.
しかし、このような構成の金属ベース基板においては、
基板上の電子部品より発生する熱が金属ベースまで伝わ
るには、熱伝導性の低いプラスチックを主体とする絶縁
層を通過しなければならない、したがって、基板全体の
熱伝導性はこの絶縁層で著しく低下し、金属ベースの高
熱伝導性を有効に生かしているとはいい難い。However, in a metal base substrate with such a configuration,
In order for the heat generated by the electronic components on the board to reach the metal base, it must pass through an insulating layer that is mainly made of plastic, which has low thermal conductivity. Therefore, the thermal conductivity of the entire board is significantly reduced by this insulating layer. It cannot be said that the high thermal conductivity of the metal base is effectively utilized.
このようなことから、金属ベース基板の絶縁層としてこ
れまでのプラスチック系からセラミック系で形成しよう
とする考えがあり、古くから検討されている。すなわち
、ベースとなる金属板の表面にアルミナなどのセラミッ
クを溶射してセラミック溶射層の絶縁層を形成する方法
である。このようにすると絶縁層がプラスチック系に比
べると高熱伝導性となるために金属ベースの高熱伝導性
を有効に生かすことができ、基板全体の熱伝導性は著し
く向上する。For this reason, there is an idea of forming the insulating layer of a metal base substrate from a ceramic material instead of the conventional plastic material, and this has been considered for a long time. That is, this is a method of thermally spraying ceramic such as alumina onto the surface of a metal plate serving as a base to form an insulating layer of a ceramic sprayed layer. In this way, the insulating layer has higher thermal conductivity than a plastic-based insulating layer, so the high thermal conductivity of the metal base can be effectively utilized, and the thermal conductivity of the entire substrate is significantly improved.
（発明が解決しようとする課題）
ところが、このようなセラミック溶射を利用した金属ベ
ース基板には種々の問題点が存在する。(Problems to be Solved by the Invention) However, there are various problems with metal base substrates using such ceramic spraying.
第１の問題点は、セラミック溶射層に存在する気孔の問
題である。セラミック溶射はその方式によりガス溶射法
、プラズマ溶射法などがあるが、その原理はセラミック
を高温で溶融状態にし、高速で被溶射体に衝突させて固
化、たい積させるものである。したがって、減圧下での
溶射などにより多少少なくはなるものの本質的に気孔が
存在する。このような気孔を有するセラミック溶射層を
絶縁層として利用すると特に吸湿時の絶縁特性の低下が
大きく、信頼性の高い金属ベースは得られない。The first problem is the problem of pores that exist in the ceramic sprayed layer. Ceramic thermal spraying methods include gas thermal spraying and plasma thermal spraying, but the principle is that ceramic is molten at high temperature and collided with the object to be thermally sprayed at high speed to solidify and accumulate. Therefore, pores are essentially present, although the number of pores may be reduced by thermal spraying under reduced pressure. If a ceramic sprayed layer having such pores is used as an insulating layer, the insulating properties will be greatly deteriorated especially when moisture is absorbed, and a highly reliable metal base cannot be obtained.
第２の問題点は、導体層の形成である。セラミック溶射
を利用した金属ベース基板においてその導体層の形成は
一般的には、セラミック溶射層の上にさらに銅を溶射し
て形成することが考えられている。ところが、この方法
では銅溶射層もやはり気孔を含むものであるためにｗ４
箔などによって形成される導体層に比べると電気抵抗が
高く、溶射層の厚さを厚くしなければならず、その分コ
ストアップにつながる。別の方法としてセラミック溶射
層に無電解銅めっきを施す方法がある。この場合、問題
となるのはベースである金属板のマスキングである。す
なわち、アルミニウム、鉄などの金属板をそのまま無電
解銅めっき槽に投入すると、金属板の部分にも銅めっき
槽が形成される。The second problem is the formation of the conductor layer. In a metal base substrate using ceramic spraying, the conductor layer is generally formed by further spraying copper on the ceramic spray layer. However, in this method, the copper sprayed layer also contains pores, so w4
The electrical resistance is higher than that of a conductive layer formed of foil or the like, and the sprayed layer must be thicker, which increases costs. Another method is to apply electroless copper plating to the ceramic sprayed layer. In this case, the problem is masking the base metal plate. That is, when a metal plate such as aluminum or iron is directly put into an electroless copper plating tank, a copper plating tank is also formed on the metal plate.
しかも、ここで最も問題となるのはめっき槽内での酸、
あるいはアルカリ性の処理液でこれらの金属が溶けてめ
っき処理液が汚染することである。Moreover, the biggest problem here is the acid in the plating tank.
Alternatively, these metals may dissolve in an alkaline processing solution and contaminate the plating solution.
したがって、これらの金属板はめっき処理に先立ってマ
スキングを施さなければならないが、その工程及びめっ
き後のマスキング除去工程は全体の製造工程を煩雑化す
るものである。Therefore, these metal plates must be masked prior to plating, but this process and the masking removal process after plating complicate the entire manufacturing process.
本発明は、このような欠点を改良し、工程が簡単でしか
も信頼性が高く高熱放散性の金属ベース基板を得る製造
方法を提供するものである。The present invention improves these drawbacks and provides a manufacturing method for obtaining a metal base substrate with simple steps, high reliability, and high heat dissipation.
（課題を解決するための手段）
すなわち、本発明は金属板にセラミツを溶射してこれを
絶縁層とする金属ベース基板の製造法において、ベース
となる金属板として銅板を用い、銅板にセラミックを溶
射してセラミック層を形成し、得られたセラミック溶射
層の気孔を熱硬化性樹脂で封孔後、その表面を研磨する
ことによって表面の樹脂層を除去して、さらに無電解銅
めっきにより銅めっき層を形成するものである。(Means for Solving the Problems) That is, the present invention is a method for manufacturing a metal base substrate in which ceramic is thermally sprayed onto a metal plate and used as an insulating layer. A ceramic layer is formed by thermal spraying, the pores of the resulting ceramic sprayed layer are sealed with a thermosetting resin, the surface is polished to remove the surface resin layer, and then copper is coated by electroless copper plating. It forms a plating layer.
金属板として銅板を用いることの大きな目的は、後の無
電解銅めっき工程を容易にするためである。The main purpose of using a copper plate as the metal plate is to facilitate the subsequent electroless copper plating process.
すなわち１、無電解銅めっきにおいては被めっき物は酸
あるいはアルカリの薬液処理を受ける。その中でアルミ
ニウム、鉄、４２合金、インバー合金などの金属は薬液
によって溶けたり、変質したり影響を受けやすい、また
、無電解めっき用の薬液もこれらの金属が溶は出すこと
によって著しく汚染されめっき性能の低下を招＜、シた
がって、このような金属と一体化したセラミック溶射層
に無電解銅めっきを施すには、金属板にはマスキング処
理が不可欠である。マスキング処理は、フォトマスキン
グあるいはマイラーテープを貼りつけたりする方法が用
いられるが、マスキング工程さらにはめっき後のマスキ
ング材の除去は工程を煩雑化する。そこで、金属板とし
て銅板を用いると無電解銅めっき工程において銅は薬液
を汚染したり、溶出する恐れもないためにマスキングを
施す必要がない。したがって、マスキング処理なしに無
電解銅めっきを行うことができる。また、このようにマ
スキング処理なしで無電解銅めっきを行うと銅板の表面
にも銅めっき層が付着するが、もともとが銅であるから
密着性は問題なく、しかも外観上何ら損なうものではな
い、このように金属板として銅板を用いることによって
工程を著しく簡素化できる。また、銅はアルミニウムに
比べて熱伝導性も高く熱放散性の向上の面からも有利で
あり、熱膨張係数も低いために基板の低熱膨張化にも有
利である。Namely, 1. In electroless copper plating, the object to be plated is subjected to acid or alkaline chemical treatment. Among them, metals such as aluminum, iron, 42 alloy, and invar alloy are easily dissolved, altered, or affected by chemical solutions, and chemical solutions for electroless plating can also be significantly contaminated by the dissolution of these metals. Therefore, in order to apply electroless copper plating to such a ceramic sprayed layer integrated with metal, a masking treatment is essential for the metal plate. For the masking process, photomasking or applying Mylar tape is used, but the masking process and the removal of the masking material after plating complicate the process. Therefore, when a copper plate is used as the metal plate, there is no need for masking because there is no fear that copper will contaminate the chemical solution or elute during the electroless copper plating process. Therefore, electroless copper plating can be performed without masking treatment. In addition, when electroless copper plating is performed without masking treatment, a copper plating layer will also adhere to the surface of the copper plate, but since the copper plate is originally copper, there is no problem with adhesion, and it does not impair the appearance in any way. By using a copper plate as the metal plate in this way, the process can be significantly simplified. Further, copper has higher thermal conductivity than aluminum, which is advantageous in terms of improving heat dissipation, and also has a low coefficient of thermal expansion, which is advantageous in reducing the thermal expansion of the substrate.
なお、溶射するセラミックは溶射のしやすさ、電気絶縁
性の点からアルミナが好適であるが、その他にムライト
、スピネル、ジルコニアなどの電気絶縁性のセラミック
が用いられる。Note that alumina is preferred as the ceramic to be thermally sprayed from the viewpoint of ease of thermal spraying and electrical insulation, but electrically insulating ceramics such as mullite, spinel, and zirconia may also be used.
形成されたセラミック溶射層の気孔を封孔するのは、セ
ラミック溶射層の電気絶縁性、特に湿温時の特性を改良
するためである。セラミック溶射層に存在する気孔をそ
のまま放置しておくと吸湿時に気孔に容易に水分が入り
込むために絶縁特性が十分なものは得られない、そこで
、セラミック溶射層を樹脂で封孔することによってはじ
めて信鯨性の高い絶縁層となるのである。封孔する樹脂
は、電気１！ｌ緑特性、耐熱性などの点から積層板とし
て用いられているエポキシ樹脂あるいはポリイミド樹脂
が適しているが、その他にフェノール樹脂、不飽和ポリ
エステル樹脂、ビニルエステル樹脂や、シリコーン樹脂
、ビスマレイミド樹脂などの熱硬化性樹脂を用いること
ができる。The purpose of sealing the pores in the formed ceramic sprayed layer is to improve the electrical insulation properties of the ceramic sprayed layer, particularly its characteristics at humid temperatures. If the pores existing in the ceramic sprayed layer are left as they are, moisture will easily enter the pores when moisture is absorbed, making it impossible to obtain sufficient insulation properties.Therefore, we decided to seal the ceramic sprayed layer with resin. This results in an insulating layer with high reliability. The sealing resin is electricity 1! Epoxy resins or polyimide resins, which are used for laminates, are suitable for their green properties and heat resistance, but other resins include phenol resins, unsaturated polyester resins, vinyl ester resins, silicone resins, and bismaleimide resins. thermosetting resin can be used.
次に、封孔したセラミック溶射層の表面を研磨するのは
表面の樹脂層を除去するためである。すなわち、樹脂に
よって封孔したセラミック溶射層の表面にはどうしても
樹脂層が形成される。したがって、このままその表面に
導体層を形成すると熱伝導性の極めて低い樹脂層の存在
により基板全体の熱伝導性は著しく損なわれてしまう、
そこで、表面の樹脂層は除去しなければならないのであ
る。Next, the surface of the sealed ceramic sprayed layer is polished to remove the resin layer on the surface. That is, a resin layer is inevitably formed on the surface of the ceramic sprayed layer whose pores are sealed with resin. Therefore, if a conductive layer is formed on the surface of the board as it is, the thermal conductivity of the entire board will be significantly impaired due to the presence of the resin layer, which has extremely low thermal conductivity.
Therefore, the resin layer on the surface must be removed.
（作用）
従来、金属板の表面に電気絶縁性のセラミック溶射層を
形成して絶縁層とする金属ベース基板において、導体層
の形成には種々の問題点があった。(Function) Conventionally, in metal base substrates in which an electrically insulating ceramic sprayed layer is formed on the surface of a metal plate to serve as an insulating layer, there have been various problems in forming a conductor layer.
最も簡単な方法は、セラミック溶射層の表面に銅を溶射
して回路を形成する方法であるが、銅の溶射層も気孔を
含有するものであるために電気抵抗が高く、信鯨性の高
い微細な回路の形成が困難であった。そこで、無電解銅
めっきによりセラミック溶射層に銅めっきを形成する方
法が好ましいわけであるが、金属板のマスキング及びめ
っき後のマスキングの除去が工程を煩雑なものとする欠
点があった。The simplest method is to spray copper onto the surface of a ceramic sprayed layer to form a circuit, but since the copper sprayed layer also contains pores, it has high electrical resistance and is highly reliable. It was difficult to form fine circuits. Therefore, a method of forming copper plating on the ceramic sprayed layer by electroless copper plating is preferable, but it has the drawback that masking of the metal plate and removal of the masking after plating complicates the process.
そこで、本発明のごとく金属板として銅板を用いること
が有効である。つまり、金属板として銅板を用いると無
電解銅めっき時に銅板をマスキングする必要がなくなる
ためである。すなわち、金属板は銅であるので無電解銅
めっき時の薬液処理工程において銅の溶出あるいは他の
金属を用いたときのめっき液の汚染もないためである。Therefore, it is effective to use a copper plate as the metal plate as in the present invention. In other words, if a copper plate is used as the metal plate, there is no need to mask the copper plate during electroless copper plating. That is, since the metal plate is made of copper, there is no elution of copper in the chemical treatment process during electroless copper plating, or contamination of the plating solution when other metals are used.
したがって工程を簡素化できるのである。Therefore, the process can be simplified.
また、本発明においてセラミック溶射層はそのままでは
気孔が存在するために絶縁特性が不十分であるので樹脂
で封孔している。したがって、絶縁信鎖性も高いもので
ある。さらに、封孔後、表面の樹脂層を研磨することに
よって除去しているために回路を形成すめ銅めっき層と
セラミック溶射層、それからセラミック溶射層ベースと
なる銅板が直接熱伝導性の低い有機系材料を介さずに密
着しているために基板の熱放散性は高いものが得られる
。Furthermore, in the present invention, the ceramic sprayed layer as it is has insufficient insulation properties due to the presence of pores, so the pores are sealed with a resin. Therefore, the insulating chain properties are also high. Furthermore, after sealing, the resin layer on the surface is removed by polishing, so the circuit is formed using a copper plated layer, a ceramic sprayed layer, and a copper plate that is the base of the ceramic sprayed layer. Because they are in close contact with each other without intervening materials, the substrate has high heat dissipation properties.
（実施例） 本発明の実施例を第１図に基づき以下説明する。(Example) An embodiment of the present invention will be described below with reference to FIG.
厚さ１ｆｉのサンドブラスト処理した銅板の表面にプラ
ズマ溶射装置によりアルミナ（ホワイトアルミナ、ＡＩ
！０，９９．６％以上）を溶射して厚さ１００．ｃａｍ
のアルミナ溶射層を形成した。ひき続いて銅板の表面に
形成されたアルミナ溶射層にエポキシ樹脂（酸無水物硬
化タイプ、粘度４゜５ポイズ）を塗布し、１５０℃の乾
燥機に１時間投入してエポキシ樹脂を硬化した。得られ
たものは、アルミナ溶射層の気孔にエポキシ樹脂が含浸
し、気孔は完全に封孔されたものである。Alumina (white alumina, AI
! 0.99.6% or more) to a thickness of 100. cam
An alumina sprayed layer was formed. Subsequently, an epoxy resin (acid anhydride curing type, viscosity 4.5 poise) was applied to the alumina sprayed layer formed on the surface of the copper plate, and the epoxy resin was cured by putting it in a dryer at 150° C. for 1 hour. In the obtained product, the pores of the alumina sprayed layer were impregnated with the epoxy resin, and the pores were completely sealed.
次にエポキシ樹脂により封孔したアルミナ溶射層の表面
を表面研磨機により研磨した。この操作により表面のエ
ポキシ樹脂層は容易に除去することができ、表面は再び
アルミナ溶射層が露出した。Next, the surface of the sprayed alumina layer sealed with epoxy resin was polished using a surface polisher. By this operation, the epoxy resin layer on the surface could be easily removed, and the alumina sprayed layer was exposed again on the surface.
さらに、表面を研磨したアルミナ溶射層を有する銅板も
無電解銅めっき槽に投入し、全面に厚さ３５μｍの銅め
っき槽を形成した。なお、無電解銅めっき工程でめっき
処理液の汚染はなく、銅板及びアルミナ溶射層への銅め
っきのつきまわり性は極めて良好であった。銅めっき層
を形成した後、得られたものは端面をダイヤモンドカッ
ターで切断し第１図に示す構造の金属ベース基板を得た
。Further, a copper plate having a polished alumina spray layer was also placed in an electroless copper plating bath to form a copper plating bath with a thickness of 35 μm on the entire surface. There was no contamination of the plating solution during the electroless copper plating process, and the coverage of the copper plating on the copper plate and the alumina sprayed layer was extremely good. After forming the copper plating layer, the end face of the obtained product was cut with a diamond cutter to obtain a metal base substrate having the structure shown in FIG.
このようにして得た金属ベース基板は、銅めっき層とア
ルミナ溶射層、及びアルミナ溶射層と銅板との密着性は
良好であり、従来のプラスチック系材料を絶縁層とする
金属ベース基板に比べて熱放散性は格段すぐれるもので
あった。The metal base substrate obtained in this way has good adhesion between the copper plating layer and the alumina sprayed layer, and between the alumina sprayed layer and the copper plate, and has better adhesion than conventional metal base substrates whose insulating layer is made of plastic material. The heat dissipation properties were significantly superior.
（発明の効果）
本発明の方法によれば、従来の金属ベースにおいて改良
が望まれている熱放散性は大きく向上することができる
とともに、セラミック溶射を利用した金属ベース基板の
製造において大きな問題である溶射層の気孔の封孔及び
導体層の形成を簡単な工程で行うことができ、量産性の
向上に極めて効果的なものである。(Effects of the Invention) According to the method of the present invention, the heat dissipation property, which is desired to be improved in conventional metal bases, can be greatly improved, and it also solves a major problem in manufacturing metal base substrates using ceramic spraying. It is possible to seal the pores of a certain thermally sprayed layer and form a conductor layer in a simple process, which is extremely effective in improving mass productivity.
第１図は、本発明の実施例で得られた金属ベース基板の
構成を示す断面模式図である。
符号の説明
１ 銅板 ２ アルミナ溶射層３ｍめっき
層
」
／３銅めっき層
−２アルミナ溶射層
−１銅板FIG. 1 is a schematic cross-sectional view showing the structure of a metal base substrate obtained in an example of the present invention. Explanation of symbols 1 Copper plate 2 Alumina sprayed layer 3m plating layer /3 Copper plating layer - 2 Alumina sprayed layer - 1 Copper plate
Claims (4)
ラミック層を形成する第１工程、該セラミック層に熱硬
化性樹脂を含浸して硬化する第２工程、熱硬化性樹脂を
含浸したセラミック層の表面を研磨して表面の樹脂層を
除去する第３工程、第３工程で得た熱硬化性樹脂含浸セ
ラミック層を有する銅板に無電解銅めっき液を施し全面
に銅めっき層を形成する第４工程からなることを特徴と
する金属ベース基板の製造方法。1. The first step is to thermally spray an electrically insulating ceramic onto one side of a copper plate to form a ceramic layer, the second step is to impregnate the ceramic layer with a thermosetting resin and harden it, and the second step is to form a ceramic layer impregnated with the thermosetting resin. A third step of polishing the surface to remove the resin layer on the surface, and a fourth step of applying an electroless copper plating solution to the copper plate having the thermosetting resin-impregnated ceramic layer obtained in the third step to form a copper plating layer on the entire surface. 1. A method for manufacturing a metal-based substrate, comprising the steps of:
るものである請求項１記載の金属ベース基板の製造方法
。2. 2. The method of manufacturing a metal base substrate according to claim 1, wherein the electrically insulating ceramic contains alumina as a main component.
の金属ベース基板の製造方法。3. The method for manufacturing a metal base substrate according to claim 1, wherein the thermosetting resin is an epoxy resin.
の金属ベース基板の製造方法。4. The method for manufacturing a metal base substrate according to claim 1, wherein the thermosetting resin is a polyimide resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12665888A JPH01295479A (en) | 1988-05-24 | 1988-05-24 | Manufacture of metal base substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12665888A JPH01295479A (en) | 1988-05-24 | 1988-05-24 | Manufacture of metal base substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01295479A true JPH01295479A (en) | 1989-11-29 |
Family
ID=14940668
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12665888A Pending JPH01295479A (en) | 1988-05-24 | 1988-05-24 | Manufacture of metal base substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01295479A (en) |
-
1988
- 1988-05-24 JP JP12665888A patent/JPH01295479A/en active Pending
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