JPH01287299A - 全面メッキ装置 - Google Patents
全面メッキ装置Info
- Publication number
- JPH01287299A JPH01287299A JP11783788A JP11783788A JPH01287299A JP H01287299 A JPH01287299 A JP H01287299A JP 11783788 A JP11783788 A JP 11783788A JP 11783788 A JP11783788 A JP 11783788A JP H01287299 A JPH01287299 A JP H01287299A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- plated
- anode
- sides
- tank
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 title claims abstract description 101
- 239000007788 liquid Substances 0.000 claims description 22
- 238000000034 method Methods 0.000 description 8
- 229910000679 solder Inorganic materials 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
- C25D17/08—Supporting racks, i.e. not for suspending
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11783788A JPH01287299A (ja) | 1988-05-13 | 1988-05-13 | 全面メッキ装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11783788A JPH01287299A (ja) | 1988-05-13 | 1988-05-13 | 全面メッキ装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01287299A true JPH01287299A (ja) | 1989-11-17 |
JPH0413439B2 JPH0413439B2 (en, 2012) | 1992-03-09 |
Family
ID=14721483
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11783788A Granted JPH01287299A (ja) | 1988-05-13 | 1988-05-13 | 全面メッキ装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01287299A (en, 2012) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03277796A (ja) * | 1990-03-27 | 1991-12-09 | Fuji Plant Kogyo Kk | 短尺板状被メッキ物への全面メッキ方法、装置および保持治具 |
JP2007107063A (ja) * | 2005-10-14 | 2007-04-26 | Taiyo Manufacturing Co Ltd | 表面処理装置及び表面処理方法 |
KR100956685B1 (ko) * | 2007-11-14 | 2010-05-10 | 삼성전기주식회사 | 도금장치 |
KR101357034B1 (ko) * | 2010-08-25 | 2014-02-03 | 아루멕쿠스 피이 가부시키가이샤 | 표면처리장치 |
-
1988
- 1988-05-13 JP JP11783788A patent/JPH01287299A/ja active Granted
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03277796A (ja) * | 1990-03-27 | 1991-12-09 | Fuji Plant Kogyo Kk | 短尺板状被メッキ物への全面メッキ方法、装置および保持治具 |
JP2007107063A (ja) * | 2005-10-14 | 2007-04-26 | Taiyo Manufacturing Co Ltd | 表面処理装置及び表面処理方法 |
KR100956685B1 (ko) * | 2007-11-14 | 2010-05-10 | 삼성전기주식회사 | 도금장치 |
KR101357034B1 (ko) * | 2010-08-25 | 2014-02-03 | 아루멕쿠스 피이 가부시키가이샤 | 표면처리장치 |
Also Published As
Publication number | Publication date |
---|---|
JPH0413439B2 (en, 2012) | 1992-03-09 |
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