JPH0128714Y2 - - Google Patents
Info
- Publication number
- JPH0128714Y2 JPH0128714Y2 JP19527882U JP19527882U JPH0128714Y2 JP H0128714 Y2 JPH0128714 Y2 JP H0128714Y2 JP 19527882 U JP19527882 U JP 19527882U JP 19527882 U JP19527882 U JP 19527882U JP H0128714 Y2 JPH0128714 Y2 JP H0128714Y2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- shield plate
- circuit board
- metal rod
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002184 metal Substances 0.000 claims description 26
- 229910052751 metal Inorganic materials 0.000 claims description 26
- 238000005476 soldering Methods 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 14
- 239000011889 copper foil Substances 0.000 description 14
- 229910000679 solder Inorganic materials 0.000 description 12
- 230000000694 effects Effects 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19527882U JPS59101461U (ja) | 1982-12-25 | 1982-12-25 | 電子部品の接地構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19527882U JPS59101461U (ja) | 1982-12-25 | 1982-12-25 | 電子部品の接地構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59101461U JPS59101461U (ja) | 1984-07-09 |
| JPH0128714Y2 true JPH0128714Y2 (ko) | 1989-08-31 |
Family
ID=30419467
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19527882U Granted JPS59101461U (ja) | 1982-12-25 | 1982-12-25 | 電子部品の接地構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59101461U (ko) |
-
1982
- 1982-12-25 JP JP19527882U patent/JPS59101461U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59101461U (ja) | 1984-07-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2850860B2 (ja) | 電子部品の製造方法 | |
| JPH0223024Y2 (ko) | ||
| JPH0412714Y2 (ko) | ||
| JPS594873B2 (ja) | 印刷配線板 | |
| JPH02198192A (ja) | 表面装着型デカップリングコンデンサ | |
| JP2639280B2 (ja) | 高密度回路モジュールの製造方法 | |
| JPH0128714Y2 (ko) | ||
| JPH0126154Y2 (ko) | ||
| JPS635220Y2 (ko) | ||
| CN217590758U (zh) | 一种滤波器 | |
| JPH0443437B2 (ko) | ||
| JPH0745992Y2 (ja) | 電子部品とシールドケースとの接地構造 | |
| JPS631093A (ja) | 電子部品搭載用基板装置 | |
| JPH0742162U (ja) | ハイブリッドｉｃの構造 | |
| JPH0244537Y2 (ko) | ||
| JP2501678Y2 (ja) | 回路基板装置 | |
| JPS601498Y2 (ja) | 端子接続構造 | |
| JPH0316295Y2 (ko) | ||
| JP2006179523A (ja) | 高周波モジュール | |
| JPS6020300Y2 (ja) | 印刷配線基板 | |
| JP2923087B2 (ja) | プリント基板の半田接合構造及びプリント基板の半田接合方法 | |
| JPS6236316Y2 (ko) | ||
| JPS62162395A (ja) | 高周波回路装置 | |
| JPS59125888U (ja) | シールド構造 | |
| JPH0658994B2 (ja) | 電子回路装置 |