JPH01281740A - 樹脂封止型電子部品の製造方法 - Google Patents

樹脂封止型電子部品の製造方法

Info

Publication number
JPH01281740A
JPH01281740A JP63109876A JP10987688A JPH01281740A JP H01281740 A JPH01281740 A JP H01281740A JP 63109876 A JP63109876 A JP 63109876A JP 10987688 A JP10987688 A JP 10987688A JP H01281740 A JPH01281740 A JP H01281740A
Authority
JP
Japan
Prior art keywords
support plate
resin
mold
sealing resin
slide mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP63109876A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0514422B2 (cg-RX-API-DMAC7.html
Inventor
Takaaki Yokoyama
隆昭 横山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanken Electric Co Ltd
Original Assignee
Sanken Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanken Electric Co Ltd filed Critical Sanken Electric Co Ltd
Priority to JP63109876A priority Critical patent/JPH01281740A/ja
Publication of JPH01281740A publication Critical patent/JPH01281740A/ja
Publication of JPH0514422B2 publication Critical patent/JPH0514422B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP63109876A 1988-05-07 1988-05-07 樹脂封止型電子部品の製造方法 Granted JPH01281740A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63109876A JPH01281740A (ja) 1988-05-07 1988-05-07 樹脂封止型電子部品の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63109876A JPH01281740A (ja) 1988-05-07 1988-05-07 樹脂封止型電子部品の製造方法

Publications (2)

Publication Number Publication Date
JPH01281740A true JPH01281740A (ja) 1989-11-13
JPH0514422B2 JPH0514422B2 (cg-RX-API-DMAC7.html) 1993-02-25

Family

ID=14521416

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63109876A Granted JPH01281740A (ja) 1988-05-07 1988-05-07 樹脂封止型電子部品の製造方法

Country Status (1)

Country Link
JP (1) JPH01281740A (cg-RX-API-DMAC7.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013074035A (ja) * 2011-09-27 2013-04-22 Mitsubishi Electric Corp 半導体装置の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013074035A (ja) * 2011-09-27 2013-04-22 Mitsubishi Electric Corp 半導体装置の製造方法

Also Published As

Publication number Publication date
JPH0514422B2 (cg-RX-API-DMAC7.html) 1993-02-25

Similar Documents

Publication Publication Date Title
US5935502A (en) Method for manufacturing plastic package for electronic device having a fully insulated dissipator
JPH0513536B2 (cg-RX-API-DMAC7.html)
US5133921A (en) Method for manufacturing plastic encapsulated electronic semiconductor devices
US5049055A (en) Mold assembly
JPH05235074A (ja) 半導体デバイス及びその製造方法
EP0069390A2 (en) Lead frame for plastic encapsulated semiconductor device
JPH01281740A (ja) 樹脂封止型電子部品の製造方法
JPH10256291A (ja) 熱散逸器を具備する電子装置用プラスチックパッケージの製造方法
JPH0637130A (ja) 半導体装置の製造方法
JPH0550132B2 (cg-RX-API-DMAC7.html)
JPH0548955B2 (cg-RX-API-DMAC7.html)
JPH0514423B2 (cg-RX-API-DMAC7.html)
JPH04729A (ja) 樹脂封止形電子部品の製造方法
JPH02122634A (ja) 樹脂封止型電子部品の製造方法
JP2841932B2 (ja) 樹脂封止型電子部品の製造方法
JPH0744193B2 (ja) 樹脂封止型電子部品の製造方法
JP2604054B2 (ja) 半導体装置の製造方法
JPH0720917Y2 (ja) 樹脂モ−ルド装置
JP2514818B2 (ja) 集積回路基板の樹脂封止方法
JPH0328067B2 (cg-RX-API-DMAC7.html)
JP3611612B2 (ja) 電子部品の樹脂封止成形用金型
JP2917556B2 (ja) 絶縁物封止型電子部品の製造方法
JPH0461131A (ja) 樹脂封止型電子部品の製造方法
JPH0378779B2 (cg-RX-API-DMAC7.html)
JPH0110182Y2 (cg-RX-API-DMAC7.html)

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees