JPH01281740A - 樹脂封止型電子部品の製造方法 - Google Patents

樹脂封止型電子部品の製造方法

Info

Publication number
JPH01281740A
JPH01281740A JP63109876A JP10987688A JPH01281740A JP H01281740 A JPH01281740 A JP H01281740A JP 63109876 A JP63109876 A JP 63109876A JP 10987688 A JP10987688 A JP 10987688A JP H01281740 A JPH01281740 A JP H01281740A
Authority
JP
Japan
Prior art keywords
support plate
resin
mold
sealing resin
slide mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP63109876A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0514422B2 (cg-RX-API-DMAC10.html
Inventor
Takaaki Yokoyama
隆昭 横山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanken Electric Co Ltd
Original Assignee
Sanken Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanken Electric Co Ltd filed Critical Sanken Electric Co Ltd
Priority to JP63109876A priority Critical patent/JPH01281740A/ja
Publication of JPH01281740A publication Critical patent/JPH01281740A/ja
Publication of JPH0514422B2 publication Critical patent/JPH0514422B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W90/756—

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP63109876A 1988-05-07 1988-05-07 樹脂封止型電子部品の製造方法 Granted JPH01281740A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63109876A JPH01281740A (ja) 1988-05-07 1988-05-07 樹脂封止型電子部品の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63109876A JPH01281740A (ja) 1988-05-07 1988-05-07 樹脂封止型電子部品の製造方法

Publications (2)

Publication Number Publication Date
JPH01281740A true JPH01281740A (ja) 1989-11-13
JPH0514422B2 JPH0514422B2 (cg-RX-API-DMAC10.html) 1993-02-25

Family

ID=14521416

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63109876A Granted JPH01281740A (ja) 1988-05-07 1988-05-07 樹脂封止型電子部品の製造方法

Country Status (1)

Country Link
JP (1) JPH01281740A (cg-RX-API-DMAC10.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013074035A (ja) * 2011-09-27 2013-04-22 Mitsubishi Electric Corp 半導体装置の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013074035A (ja) * 2011-09-27 2013-04-22 Mitsubishi Electric Corp 半導体装置の製造方法

Also Published As

Publication number Publication date
JPH0514422B2 (cg-RX-API-DMAC10.html) 1993-02-25

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees