JPH0127997B2 - - Google Patents
Info
- Publication number
- JPH0127997B2 JPH0127997B2 JP4239280A JP4239280A JPH0127997B2 JP H0127997 B2 JPH0127997 B2 JP H0127997B2 JP 4239280 A JP4239280 A JP 4239280A JP 4239280 A JP4239280 A JP 4239280A JP H0127997 B2 JPH0127997 B2 JP H0127997B2
- Authority
- JP
- Japan
- Prior art keywords
- alumina ceramic
- melting point
- powder
- paste
- high melting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052751 metal Inorganic materials 0.000 claims description 30
- 239000002184 metal Substances 0.000 claims description 30
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 29
- 239000000843 powder Substances 0.000 claims description 20
- 238000005245 sintering Methods 0.000 claims description 17
- 239000000919 ceramic Substances 0.000 claims description 12
- 238000002844 melting Methods 0.000 claims description 12
- 230000008018 melting Effects 0.000 claims description 11
- 238000001465 metallisation Methods 0.000 claims description 11
- 239000000654 additive Substances 0.000 claims description 8
- 239000000203 mixture Substances 0.000 claims description 8
- 230000000996 additive effect Effects 0.000 claims description 7
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 6
- 239000011230 binding agent Substances 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 239000002904 solvent Substances 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 2
- 229910052681 coesite Inorganic materials 0.000 claims 1
- 229910052906 cristobalite Inorganic materials 0.000 claims 1
- 239000000377 silicon dioxide Substances 0.000 claims 1
- 235000012239 silicon dioxide Nutrition 0.000 claims 1
- 229910052682 stishovite Inorganic materials 0.000 claims 1
- 229910052905 tridymite Inorganic materials 0.000 claims 1
- 238000000034 method Methods 0.000 description 17
- 239000004020 conductor Substances 0.000 description 16
- 239000000758 substrate Substances 0.000 description 16
- 229910004298 SiO 2 Inorganic materials 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 238000010304 firing Methods 0.000 description 7
- 239000011812 mixed powder Substances 0.000 description 7
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- 229910017309 Mo—Mn Inorganic materials 0.000 description 5
- 239000012298 atmosphere Substances 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical class CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 239000001856 Ethyl cellulose Substances 0.000 description 2
- 229920001249 ethyl cellulose Polymers 0.000 description 2
- 235000019325 ethyl cellulose Nutrition 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical group CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000000020 Nitrocellulose Substances 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000005456 alcohol based solvent Substances 0.000 description 1
- 239000003849 aromatic solvent Substances 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 238000010344 co-firing Methods 0.000 description 1
- 239000011362 coarse particle Substances 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000003759 ester based solvent Substances 0.000 description 1
- 235000019441 ethanol Nutrition 0.000 description 1
- 239000005453 ketone based solvent Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 229920001220 nitrocellulos Polymers 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4239280A JPS56140085A (en) | 1980-03-31 | 1980-03-31 | Manufacture of highly electroconductive metallized ceramics |
| GB8109193A GB2072707B (en) | 1980-03-31 | 1981-03-24 | Electroconductive paste and process for producing electroconductive metallized ceramics using the same |
| DE3111808A DE3111808C2 (de) | 1980-03-31 | 1981-03-25 | Elektrisch leitende Paste, ihr Herstellungsverfahren und ihre Verwendung |
| US06/473,213 US4493789A (en) | 1980-03-31 | 1983-03-08 | Electroconductive paste and process for producing electroconductive metallized ceramics using the same |
| SG873/84A SG87384G (en) | 1980-03-31 | 1984-12-05 | Electroconductive paste and process for producing electroconductive metallized ceramics using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4239280A JPS56140085A (en) | 1980-03-31 | 1980-03-31 | Manufacture of highly electroconductive metallized ceramics |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56140085A JPS56140085A (en) | 1981-11-02 |
| JPH0127997B2 true JPH0127997B2 (enrdf_load_stackoverflow) | 1989-05-31 |
Family
ID=12634788
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4239280A Granted JPS56140085A (en) | 1980-03-31 | 1980-03-31 | Manufacture of highly electroconductive metallized ceramics |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56140085A (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0738491B2 (ja) * | 1986-07-23 | 1995-04-26 | 株式会社東芝 | 回路基板の製造方法及び回路基板 |
-
1980
- 1980-03-31 JP JP4239280A patent/JPS56140085A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS56140085A (en) | 1981-11-02 |
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