JPH01271170A - Polishing method using double-side polishing device - Google Patents

Abstract

PURPOSE:To substantially enhance surface accuracy of a workpiece by gluing it to upper and bottom gluing plates, connected between a sun gear and an internal gear, and polishing the workpiece in its one side next gluing this polished one side respectively to the upper and bottom gluing plates polishing the rest of one side. CONSTITUTION:Upper and bottom gluing plates 8, 9 are meshed with a sun gear 5 and an internal gear 6, performing a planetary motion by a difference of rotary speed between both the gears, and a workpiece (for instance, GaAs substrate) 3, glued respectively to these gluing plates 8, 9, is polished in every one side. Next this polished one side is glued to the upper and bottom gluing plates 8, 9 and the rest of one side is similarly polished.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a polishing method using a double-sided polishing device.

[Prior Art] FIG. 2 shows a conventional example of a polishing method using a double-sided polishing device. As shown in the figure, the top surface 1 of the polishing device
A carrier 4 holding a workpiece 3 is sandwiched between the lower surface 2 and the lower surface 2. The upper surface 1 and the lower surface 2 rotate in opposite directions to each other, and the carrier 4 is connected to the sun wheel 5. Planetary motion is performed due to the difference in the rotational speed of the internal gear 6.

At this time, the polishing liquid 7 is supplied from above, and both surfaces of the workpiece 3 are simultaneously polished.

[Problems to be Solved by the Invention] The above-mentioned conventional technology has problems when the workpiece is a compound semiconductor substrate, etc.
Since the machining progresses without correcting the warpage that occurred during machining, a difference in pressure distribution occurs within the plane, resulting in a difference in the amount of machining. As a result, when etching is performed for the purpose of removing processing strain, saddle-shaped curvatures with different orientations occur in the crystal direction, which causes inconvenience in subsequent processes.

The present invention has been made in view of the above points, and it is an object of the present invention to provide a polishing method using a double-sided polishing apparatus that enables improvement of the precision of a workpiece.

[Means for solving the problem] The above purpose is to connect the workpiece between the sun wheel and the internal gear, apply them to the lower attachment plate, polish one side of the workpiece, and then polish the polished one side. This is accomplished by applying the adhesive to the upper and lower adhesive plates and polishing the remaining surfaces.

Since the workpiece is attached to the upper and lower attaching plates, and each side of the workpiece is polished, there is no difference in pressure distribution within the plane as in the past, and the curved The occurrence of this can be prevented, and the surface accuracy can be improved.

[Example] The present invention will be described below based on the illustrated example. FIG. 1 shows an embodiment of the invention. Note that parts that are the same as those in the conventional system are given the same reference numerals, and therefore their explanations will be omitted. In this embodiment, the workpiece 3 is a sun wheel 5 and an internal gear 6.
The top connected between.

It was applied to the lower application plates 8 and 9, and one side thereof was polished, and then the polished one side was applied to the upper and lower application plates 8 and 9, respectively, and the remaining surfaces were polished. By doing so, one side is polished one by one, thereby eliminating the occurrence of curvature, and it is possible to obtain a polishing method using a double-sided polishing apparatus that can improve surface precision.

In other words, the workpiece 3 is a GaAs substrate with a size of 45 mm.
X45ma+ and thickness 500 μm were used. This workpiece 3 was attached to upper and lower attaching plates 8 and 9 having high flatness using heat-softening wax. The upper attachment plate 8 is mounted between the upper surface 1 and the lower surface 2, with the workpiece 3 side facing the upper surface 1 and the lower attachment plate 9 with the workpiece 3 side facing the lower surface 2. The upper and lower attachment plates 8 and 9 are the sun wheel 5. It meshes with the internal gear 6, and performs planetary motion due to the difference in rotation speed between the two. The polishing liquid 7 is supplied from the upper surface 1 and the lower surface 2, respectively. When the first polishing (on one side) is completed, remove the workpiece 3 and attach it again to the upper and lower attachment plates 8 and 9 with the processed side facing the attachment side, and start the second polishing (on the other side). went. As a result of processing both sides by processing one side at a time in this manner, no saddle-shaped warpage was observed in the workpiece 3, and a good surface area was obtained.

[Effects of the Invention] As described above, the present invention has the remarkable effect of significantly improving the surface accuracy of the workpiece.

[Brief explanation of the drawing]

FIG. 1 is a longitudinal sectional side view of a polishing apparatus according to an embodiment of the polishing method using the double-sided polishing apparatus of the present invention, and FIG. 2 is a longitudinal sectional side view of a polishing apparatus according to the polishing method using the conventional double-sided polishing apparatus. . 1: Top surface, 2: Bottom surface, 3: Workpiece, 5: Sun wheel, 6: Internal gear, 8: Upper attachment plate, boar 1 Figure 1: Side surface 6: Internal gear 2; Bottom surface 8: Envelope size Achito 3: Yearly hit Karoe Mono '4: Y field 6 Isunbuto L-to S: Jintofu 2nd figure

Claims (1)

[Claims] 1. A polishing method using a double-sided polishing device that polishes a workpiece by rotating the upper and lower surfaces of the double-sided polishing device having a sun wheel, an internal gear, and upper and lower surfaces in opposite directions. , the workpiece is attached to the upper and lower attaching plates connected between the sun wheel and the internal gear, one side is polished, and the polished one side is then attached to the upper and lower attaching plates, respectively. A polishing method using a double-sided polishing device characterized by polishing one side that remains after pasting. 2. A polishing method using the double-sided polishing apparatus according to claim 1, wherein the workpiece is pasted with heat-softening wax on the upper and lower pasting plates.