JPH0126541B2 - - Google Patents
Info
- Publication number
- JPH0126541B2 JPH0126541B2 JP58038908A JP3890883A JPH0126541B2 JP H0126541 B2 JPH0126541 B2 JP H0126541B2 JP 58038908 A JP58038908 A JP 58038908A JP 3890883 A JP3890883 A JP 3890883A JP H0126541 B2 JPH0126541 B2 JP H0126541B2
- Authority
- JP
- Japan
- Prior art keywords
- board
- heat
- cut
- heat dissipation
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000017525 heat dissipation Effects 0.000 claims description 13
- 230000032683 aging Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 238000009434 installation Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20518—Unevenly distributed heat load, e.g. different sectors at different temperatures, localised cooling, hot spots
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
Landscapes
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58038908A JPS59165443A (ja) | 1983-03-11 | 1983-03-11 | 割基板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58038908A JPS59165443A (ja) | 1983-03-11 | 1983-03-11 | 割基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59165443A JPS59165443A (ja) | 1984-09-18 |
JPH0126541B2 true JPH0126541B2 (ko) | 1989-05-24 |
Family
ID=12538296
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP58038908A Granted JPS59165443A (ja) | 1983-03-11 | 1983-03-11 | 割基板 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59165443A (ko) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62174395U (ko) * | 1986-04-24 | 1987-11-05 | ||
JP2540802Y2 (ja) * | 1991-05-31 | 1997-07-09 | 日本インター株式会社 | 電子機器の取付構造 |
JPH05243428A (ja) * | 1991-12-20 | 1993-09-21 | Toshiba Corp | 電子機器 |
JP6353752B2 (ja) * | 2014-09-18 | 2018-07-04 | 日本電産コパル株式会社 | カメラ装置 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5927556A (ja) * | 1982-08-04 | 1984-02-14 | Hanshin Electric Co Ltd | 要放熱電気部品の取付方法 |
-
1983
- 1983-03-11 JP JP58038908A patent/JPS59165443A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5927556A (ja) * | 1982-08-04 | 1984-02-14 | Hanshin Electric Co Ltd | 要放熱電気部品の取付方法 |
Also Published As
Publication number | Publication date |
---|---|
JPS59165443A (ja) | 1984-09-18 |
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