JPH0126537B2 - - Google Patents

Info

Publication number
JPH0126537B2
JPH0126537B2 JP56203685A JP20368581A JPH0126537B2 JP H0126537 B2 JPH0126537 B2 JP H0126537B2 JP 56203685 A JP56203685 A JP 56203685A JP 20368581 A JP20368581 A JP 20368581A JP H0126537 B2 JPH0126537 B2 JP H0126537B2
Authority
JP
Japan
Prior art keywords
hybrid integrated
integrated circuit
connector
board
holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56203685A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58105549A (ja
Inventor
Takeshi Urushibara
Yoshikazu Imamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP56203685A priority Critical patent/JPS58105549A/ja
Publication of JPS58105549A publication Critical patent/JPS58105549A/ja
Publication of JPH0126537B2 publication Critical patent/JPH0126537B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0478—Simultaneously mounting of different components
    • H05K13/0482—Simultaneously mounting of different components using templates; using magazines, the configuration of which corresponds to the sites on the boards where the components have to be attached

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Connecting Device With Holders (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP56203685A 1981-12-18 1981-12-18 混成集積回路の搬送治具 Granted JPS58105549A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56203685A JPS58105549A (ja) 1981-12-18 1981-12-18 混成集積回路の搬送治具

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56203685A JPS58105549A (ja) 1981-12-18 1981-12-18 混成集積回路の搬送治具

Publications (2)

Publication Number Publication Date
JPS58105549A JPS58105549A (ja) 1983-06-23
JPH0126537B2 true JPH0126537B2 (enrdf_load_stackoverflow) 1989-05-24

Family

ID=16478139

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56203685A Granted JPS58105549A (ja) 1981-12-18 1981-12-18 混成集積回路の搬送治具

Country Status (1)

Country Link
JP (1) JPS58105549A (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2609014B2 (ja) * 1990-07-17 1997-05-14 三菱電機株式会社 半導体装置の製造方法及び製造装置
JPH06281698A (ja) * 1993-11-26 1994-10-07 Toshiba Corp Ｉｃオートハンドラ方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS508308A (enrdf_load_stackoverflow) * 1973-05-26 1975-01-28
JPS5113251U (enrdf_load_stackoverflow) * 1974-07-17 1976-01-30

Also Published As

Publication number Publication date
JPS58105549A (ja) 1983-06-23

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