JPH01255287A - Flexible wiring substrate - Google Patents
Flexible wiring substrateInfo
- Publication number
- JPH01255287A JPH01255287A JP8341888A JP8341888A JPH01255287A JP H01255287 A JPH01255287 A JP H01255287A JP 8341888 A JP8341888 A JP 8341888A JP 8341888 A JP8341888 A JP 8341888A JP H01255287 A JPH01255287 A JP H01255287A
- Authority
- JP
- Japan
- Prior art keywords
- metal foil
- resin
- base material
- base
- foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title 1
- 239000011888 foil Substances 0.000 claims abstract description 23
- 239000000463 material Substances 0.000 claims abstract description 15
- 229910052751 metal Inorganic materials 0.000 claims abstract description 13
- 239000002184 metal Substances 0.000 claims abstract description 13
- 239000010953 base metal Substances 0.000 claims abstract description 6
- 229920005989 resin Polymers 0.000 abstract description 12
- 239000011347 resin Substances 0.000 abstract description 12
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 4
- 229910052782 aluminium Inorganic materials 0.000 abstract description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 4
- 239000003822 epoxy resin Substances 0.000 abstract description 4
- 229920000647 polyepoxide Polymers 0.000 abstract description 4
- 229910052742 iron Inorganic materials 0.000 abstract description 3
- 230000001070 adhesive effect Effects 0.000 abstract description 2
- 229910052802 copper Inorganic materials 0.000 abstract description 2
- 239000010949 copper Substances 0.000 abstract description 2
- 239000000835 fiber Substances 0.000 abstract description 2
- 239000000203 mixture Substances 0.000 abstract description 2
- 239000004745 nonwoven fabric Substances 0.000 abstract description 2
- 239000005011 phenolic resin Substances 0.000 abstract description 2
- 239000012209 synthetic fiber Substances 0.000 abstract description 2
- 229920002994 synthetic fiber Polymers 0.000 abstract description 2
- 239000002759 woven fabric Substances 0.000 abstract description 2
- 239000004411 aluminium Substances 0.000 abstract 1
- 239000012784 inorganic fiber Substances 0.000 abstract 1
- 239000002585 base Substances 0.000 description 9
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 229910000808 amorphous metal alloy Inorganic materials 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- -1 polyphenylene Polymers 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229920000265 Polyparaphenylene Polymers 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical group C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 1
- 229910004337 Ti-Ni Inorganic materials 0.000 description 1
- 229910011209 Ti—Ni Inorganic materials 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- KHYBPSFKEHXSLX-UHFFFAOYSA-N iminotitanium Chemical compound [Ti]=N KHYBPSFKEHXSLX-UHFFFAOYSA-N 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000011012 sanitization Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は電気機器、電子機器、通信機器、計算機器等に
用りられるフレキシブル配線基板に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a flexible wiring board used in electrical equipment, electronic equipment, communication equipment, computing equipment, etc.
従来、フレキシブル配線基板としては、ボ１１エステル
樹脂やポリイミド樹脂フィルム等の熱可塑性樹脂フィル
ムに鉋１箔を接着したものが用りられてｂた。BACKGROUND ART Conventionally, as a flexible wiring board, one in which a plane foil is bonded to a thermoplastic resin film such as a polyester resin or a polyimide resin film has been used.
従来の技術で述べたように、熱町渭性樹脂フィルムに銅
箔をｍ４Ｍしてなるフレキシブル配線基板にお論では、
Ｌ字型形状で用すると立上り部が崩れるためこのままで
は使用することができず、立上り部に積層板等の硬質材
料を補強して用いるという問題があった。本発明は従来
の技術における上述の問題点に鑑みてなされたもので、
その目的とするところは、Ｌ′ｆ−型形状で用因ること
のできる７レキシプル配線基板を提供することにある。As mentioned in the conventional technology section, we are talking about a flexible wiring board made of copper foil on a thermoplastic resin film.
When used in an L-shape, the rising portion collapses, so it cannot be used as is, and there is a problem in that the rising portion must be reinforced with a hard material such as a laminate. The present invention has been made in view of the above-mentioned problems in the conventional technology.
The object is to provide a 7-lexiple wiring board that can be used in an L'f-type configuration.
本発明はベース金′Ｉｊ４箔の片面に明脂含浸基材を介
して異種の金属箔を配設一体化してなることを特徴とす
るフレキシブル配線基板のため、Ｌ字型形状で用いても
立上り部が崩れることがなくなったもので、以下本発明
の詳細な説明する。The present invention is a flexible wiring board characterized by integrally disposing different types of metal foils on one side of a base gold Ij4 foil through a clear resin-impregnated base material, so that it can easily stand up even when used in an L-shape. The present invention will be described in detail below.
本発明のベース金＠箔としては厚さ０．０１８〜０．５
順の鉄、アルミニウム、アモルファス合金等の金属箔を
用いることが好まし論が特に限定するものでない。金属
箔表面は樹脂含浸基材との接着性を向上させるためサン
ドペーパー等の物理的処理及び又は酸、アルカ１１等に
よる化学的処理で表面を粗面化、活Ｉ生化しておくこと
が好ましい。使詣含浸基材の樹脂としては、フェノール
樹脂、クレゾール賀脂、エポキシ樹脂、不飽和ポリエス
テル樹脂、メラミン樹脂、ボ１ｊイミド倒脂、フッ化樹
脂、ボリフエニレンオギサイド位（脂等の樹脂の旭独、
変性物、混合物が用いられ必要に応じて粘度調整に水、
メチルアルコール、アセトン、スチレンモノマー等の溶
媒を添加したもので、更に必要に応じて無機充填剤等の
充填剤を添加しておくこともできる。基材としてはガラ
ス、アスベスト等のｍ ｍ Ｊ６ ｍやボ１１エステル
、ボ１ｊアクリル、ポリウレタン、ポリイミド、ポリア
ミド、ポリビニルアルコール等の有機合成繊維や木綿等
の天然繊維からなる織布、不織布、マーＩト、寒冷紗、
ネット、紙庫である。樹脂含浸基材の厚みは０．０５〜
０．５ ｗｗがよく％樹脂含有臘は乾燥后で４０〜６０
％がよい。The base gold of the present invention @ foil has a thickness of 0.018 to 0.5
It is preferable to use metal foil such as iron, aluminum, amorphous alloy, etc., but there is no particular limitation. In order to improve the adhesion to the resin-impregnated base material, the surface of the metal foil is preferably roughened and activated by physical treatment such as sandpaper or chemical treatment with acid, alkali 11, etc. . Examples of resins for the impregnation base material include phenol resin, cresol resin, epoxy resin, unsaturated polyester resin, melamine resin, bo-1jimide fat, fluoride resin, polyphenylene ogicide (based on resins such as fat). Asahi Germany,
Modified products and mixtures are used, and water is added to adjust the viscosity as necessary.
A solvent such as methyl alcohol, acetone, or styrene monomer is added thereto, and a filler such as an inorganic filler may also be added if necessary. Base materials include glass, asbestos, etc., woven fabrics, non-woven fabrics, and organic synthetic fibers such as esters, acrylic, polyurethane, polyimide, polyamide, polyvinyl alcohol, and natural fibers such as cotton. g, cheesecloth,
Internet, paper warehouse. The thickness of the resin-impregnated base material is 0.05~
0.5 ww is good and % resin content is 40-60 after drying.
% is good.
史に衛脂含浸基材の使用枚数は通常１〜２枚であるが特
に限定するものではない。異種の金属箔としては厚み９
．０１８〜０．０７ｊｆｆの銅、アルミニウム、鉄、二
・Ｉケル、亜鉛等の風狂、合金、複合品であるが、ベー
ス金属箔と異種の金属箔であることが必要であり、必要
に応じて接着面を化学処理及び又は物理処理し、更に必
要に応じて接着剤層を設けたものである。なお、樹脂含
浸基材、異種の金属箔はベース金属箔の片面丈に配設し
てもよく、両面に配設してもよく任意である。一体化手
段とシテハプレス、ロール、ダブルベルト等のように積
層一体化できるものであればよく特に限定するものでは
ない。Historically, the number of sanitizing and fat-impregnated base materials used is usually 1 to 2, but is not particularly limited. Thickness 9 for different types of metal foil
．． 018~0.07jff of copper, aluminum, iron, Ni-Kel, zinc, etc., alloys, composite products, but it is necessary that the metal foil is different from the base metal foil, and as necessary. The adhesive surface is chemically and/or physically treated, and an adhesive layer is further provided as necessary. Note that the resin-impregnated base material and the different metal foils may be disposed on one side of the base metal foil, or may be disposed on both sides as desired. There are no particular limitations as long as the uniting means can be laminated and integrated with the unit, such as a press, a roll, or a double belt.
以下本発明を実施例にもとづいて説明する。The present invention will be explained below based on examples.
実施例
厚さ９．２ ＮＭのＴｉ−Ｎｉ アモルファス合金箔の
片面をサンドベーパーで粗面化後、エポキシ樹脂（シェ
ル化学株式会社製、品番エピコート１００１）１００
ｍ、ジシアンジアミド４部、ベンジルジメチルアミン０
．２部、メチルオキシトール１００部からな６エボキシ
樹脂ワニスを厚み（１，０５龍 のガラス布に乾燥後の
樹脂蓋が４５優になるように含浸、乾燥したエポキシ樹
脂含浸ガラス布１枚を介して厚み０．０３５ａ＋１の銅
箔を配設した積層体を成形圧力３０Ｋｑ／ｃｄ 、
１６０℃で６０分間加熱加圧成形してフンキシプル配線
基板を得た。Example After roughening one side of a Ti-Ni amorphous alloy foil with a thickness of 9.2 NM using a sand vapor, an epoxy resin (manufactured by Shell Chemical Co., Ltd., product number Epicoat 1001) 100
m, dicyandiamide 4 parts, benzyldimethylamine 0
．． Impregnated a glass cloth with a thickness of 1.05 mm with 6 epoxy resin varnish made from 2 parts of methyl oxytol and 100 parts of methyloxytol so that the resin cover after drying becomes 45 mm, and then applied it through one sheet of dried epoxy resin-impregnated glass cloth. A laminate with copper foil of thickness 0.035a+1 was molded under a molding pressure of 30Kq/cd.
The product was heated and press-molded at 160° C. for 60 minutes to obtain a flexible wiring board.
比較例
実施例のＴ’１−Ｎｉアモルファス合金箔ヲ厚すｏ、２
朋のボ１１エステル樹脂フィルムに変えた以外は実施例
と用様に処理してフレキシブル配線基板を得た。Comparative Example T'1-Ni amorphous alloy foil thickness: o, 2
A flexible wiring board was obtained by processing in the same manner as in the example except that the film was changed to a Tonobo 11 ester resin film.
実施例及び比較例のフレキシブル配線基板の性能は第１
表のようである。The performance of the flexible wiring boards of Examples and Comparative Examples was the first.
It looks like a table.
本発明は上述した如く構成されている。特許請求の範囲
第１項に記載した構成を有するフレキシブル配線基板に
おいてはＬ字型形状での使用が可能となり電気機器、計
算機器等を軽−、コンパクト化できる効果がある。The present invention is constructed as described above. The flexible wiring board having the configuration described in claim 1 can be used in an L-shape, and has the effect of making electrical equipment, computing equipment, etc. lighter and more compact.
Claims (1)
の金属箔を配設一体化してなることを特徴とするフレキ
シブル配線基板。(1) A flexible wiring board characterized in that different types of metal foils are integrally arranged on one side of a base metal foil via a resin-impregnated base material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8341888A JPH01255287A (en) | 1988-04-05 | 1988-04-05 | Flexible wiring substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8341888A JPH01255287A (en) | 1988-04-05 | 1988-04-05 | Flexible wiring substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01255287A true JPH01255287A (en) | 1989-10-12 |
Family
ID=13801891
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8341888A Pending JPH01255287A (en) | 1988-04-05 | 1988-04-05 | Flexible wiring substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01255287A (en) |
-
1988
- 1988-04-05 JP JP8341888A patent/JPH01255287A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH01255287A (en) | Flexible wiring substrate | |
| JPH0824011B2 (en) | Electric laminated board and printed wiring board using the same | |
| JPH01163059A (en) | Metal foil clad laminated sheet | |
| JP3107218B2 (en) | Electric laminate | |
| JP2572880B2 (en) | Electric laminate | |
| JP2798186B2 (en) | Electric laminate | |
| JPH0339245A (en) | Laminated sheet for electric apparatus | |
| JPH0771839B2 (en) | Laminated board manufacturing method | |
| JPH0382192A (en) | Electric laminated board | |
| JPH0592517A (en) | Laminate | |
| JPH0421438A (en) | Laminated sheet for electrical use | |
| JPS5996949A (en) | Laminated board for electricity | |
| JPS62233212A (en) | Manufacture or laminated sheet | |
| JPH01225543A (en) | Metal base laminated sheet | |
| JPH05245974A (en) | Laminated sheet | |
| JPH0371693A (en) | Manufacture of wiring board | |
| JPH0315527A (en) | Preparation of laminated sheet | |
| JPH08224832A (en) | Manufacture of copper-clad laminated plate | |
| JPH0245142A (en) | Manufacture of laminated board | |
| JPH04122632A (en) | Laminate for electrical use | |
| JPH01225519A (en) | Manufacture of laminate | |
| JPH01202440A (en) | Laminate for electrical apparatus | |
| JPH0259637B2 (en) | ||
| JPH03285391A (en) | Manufacture of multilayer wiring board | |
| JPH0421437A (en) | Laminated sheet for electrical use |