JPH0125423Y2 - - Google Patents
Info
- Publication number
- JPH0125423Y2 JPH0125423Y2 JP1981096200U JP9620081U JPH0125423Y2 JP H0125423 Y2 JPH0125423 Y2 JP H0125423Y2 JP 1981096200 U JP1981096200 U JP 1981096200U JP 9620081 U JP9620081 U JP 9620081U JP H0125423 Y2 JPH0125423 Y2 JP H0125423Y2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- lead
- electrode
- circuit unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007789 sealing Methods 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 239000013013 elastic material Substances 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 238000005476 soldering Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 238000007689 inspection Methods 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981096200U JPS582975U (ja) | 1981-06-30 | 1981-06-30 | プリント基板回路ユニット |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981096200U JPS582975U (ja) | 1981-06-30 | 1981-06-30 | プリント基板回路ユニット |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS582975U JPS582975U (ja) | 1983-01-10 |
| JPH0125423Y2 true JPH0125423Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1989-07-31 |
Family
ID=29891080
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1981096200U Granted JPS582975U (ja) | 1981-06-30 | 1981-06-30 | プリント基板回路ユニット |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS582975U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60235390A (ja) * | 1984-05-08 | 1985-11-22 | 松下電器産業株式会社 | 高周波加熱装置 |
-
1981
- 1981-06-30 JP JP1981096200U patent/JPS582975U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS582975U (ja) | 1983-01-10 |