JPH0123554B2 - - Google Patents
Info
- Publication number
- JPH0123554B2 JPH0123554B2 JP7665784A JP7665784A JPH0123554B2 JP H0123554 B2 JPH0123554 B2 JP H0123554B2 JP 7665784 A JP7665784 A JP 7665784A JP 7665784 A JP7665784 A JP 7665784A JP H0123554 B2 JPH0123554 B2 JP H0123554B2
- Authority
- JP
- Japan
- Prior art keywords
- oxide film
- nickel
- layer
- electronic component
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 67
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 claims description 51
- 239000010408 film Substances 0.000 claims description 38
- 229910052759 nickel Inorganic materials 0.000 claims description 33
- 235000006408 oxalic acid Nutrition 0.000 claims description 17
- 238000005498 polishing Methods 0.000 claims description 14
- 239000000243 solution Substances 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 12
- 239000000126 substance Substances 0.000 claims description 12
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 10
- 239000007788 liquid Substances 0.000 claims description 9
- 229910000480 nickel oxide Inorganic materials 0.000 claims description 9
- 150000007524 organic acids Chemical class 0.000 claims description 9
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 claims description 9
- 239000010409 thin film Substances 0.000 claims description 8
- DDFHBQSCUXNBSA-UHFFFAOYSA-N 5-(5-carboxythiophen-2-yl)thiophene-2-carboxylic acid Chemical compound S1C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)S1 DDFHBQSCUXNBSA-UHFFFAOYSA-N 0.000 claims description 5
- 239000007864 aqueous solution Substances 0.000 claims description 2
- 238000009835 boiling Methods 0.000 claims description 2
- 238000007747 plating Methods 0.000 description 23
- 229910000679 solder Inorganic materials 0.000 description 13
- 238000005530 etching Methods 0.000 description 12
- 238000010438 heat treatment Methods 0.000 description 6
- 238000013508 migration Methods 0.000 description 5
- 230000005012 migration Effects 0.000 description 5
- 239000002253 acid Substances 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 150000002500 ions Chemical class 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 2
- 235000014676 Phragmites communis Nutrition 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 150000007522 mineralic acids Chemical class 0.000 description 2
- -1 oxalic acid Chemical class 0.000 description 2
- 238000005554 pickling Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 125000000896 monocarboxylic acid group Chemical group 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
- C23G1/10—Other heavy metals
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
- Weting (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7665784A JPS60221585A (ja) | 1984-04-18 | 1984-04-18 | ニツケル酸化被膜除去方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7665784A JPS60221585A (ja) | 1984-04-18 | 1984-04-18 | ニツケル酸化被膜除去方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60221585A JPS60221585A (ja) | 1985-11-06 |
| JPH0123554B2 true JPH0123554B2 (enrdf_load_stackoverflow) | 1989-05-02 |
Family
ID=13611474
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7665784A Granted JPS60221585A (ja) | 1984-04-18 | 1984-04-18 | ニツケル酸化被膜除去方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60221585A (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4026573B2 (ja) * | 2003-09-24 | 2007-12-26 | 株式会社デンソー | 電子装置を収納するパッケージの製造方法 |
-
1984
- 1984-04-18 JP JP7665784A patent/JPS60221585A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60221585A (ja) | 1985-11-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR0133869B1 (ko) | 반도체 장치 화학적 에칭 방법 | |
| JPS6178141A (ja) | 集積回路のための銅突起形成方法 | |
| JP2007524996A (ja) | 銅コンタクトを有する集積回路ダイおよび該集積回路ダイのための方法 | |
| JPH03504659A (ja) | 銅含有リードフレームに対するプラスチック封入体の粘着度を向上させる方法 | |
| US4078980A (en) | Electrolytic chromium etching of chromium-layered semiconductor | |
| US4767049A (en) | Special surfaces for wire bonding | |
| US5833758A (en) | Method for cleaning semiconductor wafers to improve dice to substrate solderability | |
| US5632438A (en) | Direct chip attachment process and apparatus for aluminum wirebonding on copper circuitization | |
| US5075258A (en) | Method for plating tab leads in an assembled semiconductor package | |
| JPH0123554B2 (enrdf_load_stackoverflow) | ||
| JP3274381B2 (ja) | 半導体装置の突起電極形成方法 | |
| JP3484367B2 (ja) | 無電解めっき方法およびその前処理方法 | |
| US4282266A (en) | Method for determining silicon content in layers of aluminum and silicon | |
| US3876461A (en) | Semiconductor process | |
| KR100495932B1 (ko) | 필름 캐리어 테이프 및 그 제조방법 | |
| JPS6138187Y2 (enrdf_load_stackoverflow) | ||
| JPH05148658A (ja) | 無電解錫めつき方法 | |
| JP3027960B2 (ja) | 半導体装置の汚れ除去方法 | |
| JPS62173748A (ja) | 半導体用リ−ドフレ−ムの製造方法 | |
| JPH1166965A (ja) | リード線 | |
| JPS6394640A (ja) | 半導体素子の製造方法 | |
| JPH09213700A (ja) | バンプ電極の製造方法 | |
| JPS6148953A (ja) | 樹脂封止形半導体装置の製造方法 | |
| Lin et al. | BUMPING PROCESS ON INTEGRATED CIRCUITS BY ty; ELECTROLESS PLATING | |
| JPS6318679B2 (enrdf_load_stackoverflow) |