JPH0123541B2 - - Google Patents

Info

Publication number
JPH0123541B2
JPH0123541B2 JP22565486A JP22565486A JPH0123541B2 JP H0123541 B2 JPH0123541 B2 JP H0123541B2 JP 22565486 A JP22565486 A JP 22565486A JP 22565486 A JP22565486 A JP 22565486A JP H0123541 B2 JPH0123541 B2 JP H0123541B2
Authority
JP
Japan
Prior art keywords
bonding
wire
copper
purity
ball
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP22565486A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6379927A (ja
Inventor
Akito Kurosaka
Haruo Tominaga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikura Cable Works Ltd
Original Assignee
Fujikura Cable Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikura Cable Works Ltd filed Critical Fujikura Cable Works Ltd
Priority to JP61225654A priority Critical patent/JPS6379927A/ja
Publication of JPS6379927A publication Critical patent/JPS6379927A/ja
Publication of JPH0123541B2 publication Critical patent/JPH0123541B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/015—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/43—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/43—Manufacturing methods
    • H01L2224/432—Mechanical processes
    • H01L2224/4321—Pulling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/43—Manufacturing methods
    • H01L2224/438—Post-treatment of the connector
    • H01L2224/43848—Thermal treatments, e.g. annealing, controlled cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H10W72/01515—
    • H10W72/07533—
    • H10W72/50—
    • H10W72/522—
    • H10W72/552—
    • H10W72/5522—
    • H10W72/5525—
    • H10W72/555—

Landscapes

  • Wire Bonding (AREA)
  • Conductive Materials (AREA)
JP61225654A 1986-09-24 1986-09-24 ボンデイングワイヤ Granted JPS6379927A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61225654A JPS6379927A (ja) 1986-09-24 1986-09-24 ボンデイングワイヤ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61225654A JPS6379927A (ja) 1986-09-24 1986-09-24 ボンデイングワイヤ

Publications (2)

Publication Number Publication Date
JPS6379927A JPS6379927A (ja) 1988-04-09
JPH0123541B2 true JPH0123541B2 (cg-RX-API-DMAC10.html) 1989-05-02

Family

ID=16832678

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61225654A Granted JPS6379927A (ja) 1986-09-24 1986-09-24 ボンデイングワイヤ

Country Status (1)

Country Link
JP (1) JPS6379927A (cg-RX-API-DMAC10.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004064033A (ja) * 2001-10-23 2004-02-26 Sumitomo Electric Wintec Inc ボンディングワイヤー

Also Published As

Publication number Publication date
JPS6379927A (ja) 1988-04-09

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