JPH01233093A - 非低水素系被覆アーク溶接棒 - Google Patents
非低水素系被覆アーク溶接棒Info
- Publication number
- JPH01233093A JPH01233093A JP5929288A JP5929288A JPH01233093A JP H01233093 A JPH01233093 A JP H01233093A JP 5929288 A JP5929288 A JP 5929288A JP 5929288 A JP5929288 A JP 5929288A JP H01233093 A JPH01233093 A JP H01233093A
- Authority
- JP
- Japan
- Prior art keywords
- welding
- coating
- silicone
- coating material
- water
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3601—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
- B23K35/3608—Titania or titanates
Landscapes
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Nonmetallic Welding Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5929288A JPH01233093A (ja) | 1988-03-15 | 1988-03-15 | 非低水素系被覆アーク溶接棒 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5929288A JPH01233093A (ja) | 1988-03-15 | 1988-03-15 | 非低水素系被覆アーク溶接棒 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01233093A true JPH01233093A (ja) | 1989-09-18 |
| JPH0455795B2 JPH0455795B2 (enExample) | 1992-09-04 |
Family
ID=13109160
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5929288A Granted JPH01233093A (ja) | 1988-03-15 | 1988-03-15 | 非低水素系被覆アーク溶接棒 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01233093A (enExample) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0763399A1 (de) * | 1995-09-13 | 1997-03-19 | Natunicom Trading Limited | Elektrode zum Schweissen von kohlenstoffarmen und niedriglegierten Stahlsorten |
| US6153847A (en) * | 1997-06-06 | 2000-11-28 | Mitsui Engineering & Shipbuilding Company | Welding member and welding method |
| US7147725B2 (en) | 2003-12-04 | 2006-12-12 | Lincoln Global, Inc. | Colloidal silica binder system |
| US7300528B2 (en) | 2003-03-24 | 2007-11-27 | Lincoln Global, Inc. | Flux binder system |
| US8624163B2 (en) | 2005-06-01 | 2014-01-07 | Lincoln Global, Inc. | Modified flux system |
-
1988
- 1988-03-15 JP JP5929288A patent/JPH01233093A/ja active Granted
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0763399A1 (de) * | 1995-09-13 | 1997-03-19 | Natunicom Trading Limited | Elektrode zum Schweissen von kohlenstoffarmen und niedriglegierten Stahlsorten |
| US6153847A (en) * | 1997-06-06 | 2000-11-28 | Mitsui Engineering & Shipbuilding Company | Welding member and welding method |
| EP0882543B1 (en) * | 1997-06-06 | 2003-11-26 | MITSUI ENGINEERING & SHIPBUILDING CO., LTD | Welding member and welding method |
| US7300528B2 (en) | 2003-03-24 | 2007-11-27 | Lincoln Global, Inc. | Flux binder system |
| US7147725B2 (en) | 2003-12-04 | 2006-12-12 | Lincoln Global, Inc. | Colloidal silica binder system |
| US8624163B2 (en) | 2005-06-01 | 2014-01-07 | Lincoln Global, Inc. | Modified flux system |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0455795B2 (enExample) | 1992-09-04 |
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