JPH0122113B2 - - Google Patents

Info

Publication number
JPH0122113B2
JPH0122113B2 JP56035182A JP3518281A JPH0122113B2 JP H0122113 B2 JPH0122113 B2 JP H0122113B2 JP 56035182 A JP56035182 A JP 56035182A JP 3518281 A JP3518281 A JP 3518281A JP H0122113 B2 JPH0122113 B2 JP H0122113B2
Authority
JP
Japan
Prior art keywords
polishing
semiconductor wafer
abrasive
cloth
sided
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56035182A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57149154A (en
Inventor
Masaharu Kinoshita
Hiroshi Kataoka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP56035182A priority Critical patent/JPS57149154A/ja
Publication of JPS57149154A publication Critical patent/JPS57149154A/ja
Publication of JPH0122113B2 publication Critical patent/JPH0122113B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP56035182A 1981-03-13 1981-03-13 Method of polishing semiconductor wafer Granted JPS57149154A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56035182A JPS57149154A (en) 1981-03-13 1981-03-13 Method of polishing semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56035182A JPS57149154A (en) 1981-03-13 1981-03-13 Method of polishing semiconductor wafer

Publications (2)

Publication Number Publication Date
JPS57149154A JPS57149154A (en) 1982-09-14
JPH0122113B2 true JPH0122113B2 (enrdf_load_stackoverflow) 1989-04-25

Family

ID=12434702

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56035182A Granted JPS57149154A (en) 1981-03-13 1981-03-13 Method of polishing semiconductor wafer

Country Status (1)

Country Link
JP (1) JPS57149154A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0788146A1 (en) 1996-01-31 1997-08-06 Shin-Etsu Handotai Company Limited Method of polishing semiconductor wafers

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4918870A (en) * 1986-05-16 1990-04-24 Siltec Corporation Floating subcarriers for wafer polishing apparatus
TW199948B (enrdf_load_stackoverflow) * 1991-12-19 1993-02-11 Dsc Comm Corp

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0788146A1 (en) 1996-01-31 1997-08-06 Shin-Etsu Handotai Company Limited Method of polishing semiconductor wafers

Also Published As

Publication number Publication date
JPS57149154A (en) 1982-09-14

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