JPH01217869A - 混成集積回路装置 - Google Patents
混成集積回路装置Info
- Publication number
- JPH01217869A JPH01217869A JP63041771A JP4177188A JPH01217869A JP H01217869 A JPH01217869 A JP H01217869A JP 63041771 A JP63041771 A JP 63041771A JP 4177188 A JP4177188 A JP 4177188A JP H01217869 A JPH01217869 A JP H01217869A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- circuit
- lead
- lands
- soldered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005476 soldering Methods 0.000 claims description 29
- 239000000758 substrate Substances 0.000 abstract description 12
- 229910000679 solder Inorganic materials 0.000 abstract description 7
- 238000004806 packaging method and process Methods 0.000 abstract description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000010397 one-hybrid screening Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
Landscapes
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63041771A JPH01217869A (ja) | 1988-02-24 | 1988-02-24 | 混成集積回路装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63041771A JPH01217869A (ja) | 1988-02-24 | 1988-02-24 | 混成集積回路装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01217869A true JPH01217869A (ja) | 1989-08-31 |
| JPH0578913B2 JPH0578913B2 (US20100223739A1-20100909-C00025.png) | 1993-10-29 |
Family
ID=12617651
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63041771A Granted JPH01217869A (ja) | 1988-02-24 | 1988-02-24 | 混成集積回路装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01217869A (US20100223739A1-20100909-C00025.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02177495A (ja) * | 1988-12-28 | 1990-07-10 | Taiyo Yuden Co Ltd | 二重構造混成集積回路装置の製造方法 |
-
1988
- 1988-02-24 JP JP63041771A patent/JPH01217869A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02177495A (ja) * | 1988-12-28 | 1990-07-10 | Taiyo Yuden Co Ltd | 二重構造混成集積回路装置の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0578913B2 (US20100223739A1-20100909-C00025.png) | 1993-10-29 |
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