JPH0121622B2 - - Google Patents

Info

Publication number
JPH0121622B2
JPH0121622B2 JP5795484A JP5795484A JPH0121622B2 JP H0121622 B2 JPH0121622 B2 JP H0121622B2 JP 5795484 A JP5795484 A JP 5795484A JP 5795484 A JP5795484 A JP 5795484A JP H0121622 B2 JPH0121622 B2 JP H0121622B2
Authority
JP
Japan
Prior art keywords
semiconductor wafer
enclosure
piston rod
punching device
cylinder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP5795484A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60201622A (ja
Inventor
Ryoji Wakabayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JOSAI SEIKI KK
Original Assignee
JOSAI SEIKI KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JOSAI SEIKI KK filed Critical JOSAI SEIKI KK
Priority to JP59057954A priority Critical patent/JPS60201622A/ja
Publication of JPS60201622A publication Critical patent/JPS60201622A/ja
Publication of JPH0121622B2 publication Critical patent/JPH0121622B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Dicing (AREA)
JP59057954A 1984-03-26 1984-03-26 半導体ウエ−ハの保護膜の自動打抜き装置 Granted JPS60201622A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59057954A JPS60201622A (ja) 1984-03-26 1984-03-26 半導体ウエ−ハの保護膜の自動打抜き装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59057954A JPS60201622A (ja) 1984-03-26 1984-03-26 半導体ウエ−ハの保護膜の自動打抜き装置

Publications (2)

Publication Number Publication Date
JPS60201622A JPS60201622A (ja) 1985-10-12
JPH0121622B2 true JPH0121622B2 (enEXAMPLES) 1989-04-21

Family

ID=13070418

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59057954A Granted JPS60201622A (ja) 1984-03-26 1984-03-26 半導体ウエ−ハの保護膜の自動打抜き装置

Country Status (1)

Country Link
JP (1) JPS60201622A (enEXAMPLES)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02134038U (enEXAMPLES) * 1989-04-12 1990-11-07

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02134038U (enEXAMPLES) * 1989-04-12 1990-11-07

Also Published As

Publication number Publication date
JPS60201622A (ja) 1985-10-12

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