JPH0119425Y2 - - Google Patents
Info
- Publication number
- JPH0119425Y2 JPH0119425Y2 JP3415983U JP3415983U JPH0119425Y2 JP H0119425 Y2 JPH0119425 Y2 JP H0119425Y2 JP 3415983 U JP3415983 U JP 3415983U JP 3415983 U JP3415983 U JP 3415983U JP H0119425 Y2 JPH0119425 Y2 JP H0119425Y2
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit board
- terminal
- recess
- male
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 239000011347 resin Substances 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 5
- 238000005476 soldering Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 3
- 238000004382 potting Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 229910001252 Pd alloy Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 210000000078 claw Anatomy 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3415983U JPS59140450U (ja) | 1983-03-11 | 1983-03-11 | 混成集積回路装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3415983U JPS59140450U (ja) | 1983-03-11 | 1983-03-11 | 混成集積回路装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59140450U JPS59140450U (ja) | 1984-09-19 |
| JPH0119425Y2 true JPH0119425Y2 (en:Method) | 1989-06-05 |
Family
ID=30164931
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3415983U Granted JPS59140450U (ja) | 1983-03-11 | 1983-03-11 | 混成集積回路装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59140450U (en:Method) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2745614B2 (ja) * | 1988-12-28 | 1998-04-28 | 松下電器産業株式会社 | コードリール装置 |
-
1983
- 1983-03-11 JP JP3415983U patent/JPS59140450U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59140450U (ja) | 1984-09-19 |
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