JPH0119425Y2 - - Google Patents
Info
- Publication number
- JPH0119425Y2 JPH0119425Y2 JP3415983U JP3415983U JPH0119425Y2 JP H0119425 Y2 JPH0119425 Y2 JP H0119425Y2 JP 3415983 U JP3415983 U JP 3415983U JP 3415983 U JP3415983 U JP 3415983U JP H0119425 Y2 JPH0119425 Y2 JP H0119425Y2
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit board
- terminal
- recess
- male
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 239000011347 resin Substances 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 5
- 238000005476 soldering Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 3
- 238000004382 potting Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 229910001252 Pd alloy Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 210000000078 claw Anatomy 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Description
【考案の詳細な説明】
本考案は混成集積回路装置の構造の改良に関す
るものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an improvement in the structure of a hybrid integrated circuit device.
従来の混成集積回路装置の構造は、第１図に示
す如く、ケース１の底部に適宜の手段により集積
回路基板２が固着されており、この集積回路基板
２をゲル状樹脂３で覆うと共に、更にその上をポ
ツテイング樹脂４で充填して成つている。そし
て、集積回路基板２よりのリードピン５は、端子
プレート６内に埋込まれている外部引出端子７の
一端部７ａに半田付けされており、外部引出端子
７の端部７ｂに所要のリード線を半田付けするこ
とによつて、集積回路基板２を外部の回路に接続
するように構成されている（実公昭57−49398号
公報）。 The structure of a conventional hybrid integrated circuit device, as shown in FIG. Furthermore, the top thereof is filled with potting resin 4. The lead pins 5 from the integrated circuit board 2 are soldered to one end 7a of the external lead terminal 7 embedded in the terminal plate 6, and the required lead wires are connected to the end 7b of the external lead terminal 7. The integrated circuit board 2 is configured to be connected to an external circuit by soldering (Japanese Utility Model Publication No. 57-49398).
しかしながら、従来のこのような構成による
と、端子プレート６を用意してケース１の上端縁
に固着する工程のほかに、端子プレート６の外部
引出端子７の一端部にリードピン５を半田付けす
る工程が必要となるため、構造が複雑となる上に
工数が多く、コストの低減を図ることが難しいと
いう問題点を有していた。 However, according to such a conventional configuration, in addition to the step of preparing the terminal plate 6 and fixing it to the upper edge of the case 1, there is a step of soldering the lead pin 5 to one end of the external extraction terminal 7 of the terminal plate 6. , the structure is complicated and the number of man-hours is large, making it difficult to reduce costs.
本考案の目的は、従つて、構造が簡単で半田付
工数の削減を図ることができ、コストの低減を期
待することができる混成集積回路装置を提供する
ことにある。 Therefore, an object of the present invention is to provide a hybrid integrated circuit device that has a simple structure, can reduce the number of soldering steps, and can be expected to reduce costs.
本考案の構成は、集積回路基板と、該集積回路
基板を収納するための凹部を有するケースとを備
え、該ケースの凹部の底に集積回路基板を固着し
て成る混成集積回路装置において、雄型端子部材
を半田ペーストによりチツプ部品のリフローと同
時に上記集積回路基板に固着し、予めリード線が
電気的に接続されて成る雌型端子部材を上記雄型
端子部材に嵌着せしめた後、凹部内に充填剤を充
填し、集積回路基板と両端子部材とを樹脂封止し
た点に特徴を有する。 The present invention provides a hybrid integrated circuit device comprising an integrated circuit board and a case having a recess for accommodating the integrated circuit board, and the integrated circuit board is fixed to the bottom of the recess of the case. The mold terminal member is fixed to the integrated circuit board using solder paste at the same time as the chip components are reflowed, and the female terminal member, to which lead wires are electrically connected in advance, is fitted into the male terminal member, and then the recess is inserted into the recess. It is characterized in that a filler is filled inside and the integrated circuit board and both terminal members are sealed with resin.
以下、図示の実施例により本考案を詳細に説明
する。 Hereinafter, the present invention will be explained in detail with reference to illustrated embodiments.
第２図には、本考案により混成集積回路の一実
施例が示されている。混成集積回路１０は、アル
ミダイカスト又は成形樹脂等から成るケース１１
を有し、ケース１１の凹部１１ａ内の底面１１ｂ
に、混成集積回路基板１２が接着剤等の適宜の手
段によつて固着されている。混成集積回路基板１
２の主平面１２ａ上には、集積回路、チツプ部
品、厚膜回路等が設けられており、これらの部品
又は回路と共に、雄型端子１３が設けられてい
る。 FIG. 2 shows an embodiment of a hybrid integrated circuit according to the present invention. The hybrid integrated circuit 10 includes a case 11 made of die-cast aluminum or molded resin.
and a bottom surface 11b in the recess 11a of the case 11.
A hybrid integrated circuit board 12 is fixed to the substrate by suitable means such as adhesive. Hybrid integrated circuit board 1
Integrated circuits, chip parts, thick film circuits, etc. are provided on the main plane 12a of 2, and male terminals 13 are provided together with these parts or circuits.
雄型端子１３は、混成集積回路基板１２を外部
の回路に接続するための接続端子として、従来の
リードピンの代りに設けられたものであり、第３
図に詳細に示されているように、端子本体１３ａ
と端子本体１３ａの基部に一体に形成されている
フランジ部１３ｂとから成つている。雄型端子１
３は、他のチツプ部品等が回路基板１２に搭載さ
れるのと同時に、そのフランジ部１３ｂの底面が
例えば銀−パラジウム合金から成る導体パターン
１４の上に印刷された半田ペースト１５の上とな
るように回路基板１２上に搭載され、他のチツプ
部品等と同時に加熱されることにより、他の部品
と同時に、雄型端子１３が導体パターン１４に半
田ペースト１５により半田付けされ固着される。
尚、フランジ部１３の平面形状は、円形又は正方
形とすることができる。 The male terminal 13 is provided as a connection terminal for connecting the hybrid integrated circuit board 12 to an external circuit, instead of the conventional lead pin, and is the third
As shown in detail in the figure, the terminal body 13a
and a flange portion 13b integrally formed at the base of the terminal body 13a. Male terminal 1
3, at the same time as other chip components etc. are mounted on the circuit board 12, the bottom surface of the flange portion 13b is placed on the solder paste 15 printed on the conductor pattern 14 made of, for example, a silver-palladium alloy. By being mounted on the circuit board 12 and heated at the same time as other chip components, the male terminal 13 is soldered and fixed to the conductive pattern 14 with the solder paste 15 at the same time as the other components.
Note that the planar shape of the flange portion 13 can be circular or square.
雄型端子１３を外部の回路と接続するために、
雄型端子１３と組合う雌型端子１６が端子本体１
３ａに嵌着されている。雌型端子１６は、その基
端部に一体形成された爪１６ａにより、リード線
１７の芯線１７ａが把持されることにより該雌型
端子に圧着されており、雌型端子１６の先端の円
筒部分が端子本体１３ａに嵌着されている。これ
によりリード線１７は雄型端子１３と電気的に接
続され、しかる後、集積回路基板１２がゲル状樹
脂１８で覆われ、更に、その上からポツテイング
樹脂を充填することにより封止される。 In order to connect the male terminal 13 to an external circuit,
The female terminal 16 combined with the male terminal 13 is the terminal body 1.
3a is fitted. The female terminal 16 is crimped to the female terminal by gripping the core wire 17a of the lead wire 17 with a claw 16a integrally formed at its base end, and the cylindrical portion at the tip of the female terminal 16 is fitted into the terminal body 13a. Thereby, the lead wire 17 is electrically connected to the male terminal 13, and then the integrated circuit board 12 is covered with a gel-like resin 18, and further sealed by filling a potting resin over the gel-like resin 18.
このような構成によると、雄型端子１３は他の
チツプ部品と同一の工程で同時に回路基板上に取
付けることができるため、従来に比して工数を削
減することができる。更に、外部リード線の取付
けは雄型コネクタと雌型コネクタとの嵌め合せに
より行なうことができるので、半田付工程が不用
となり、コストの低減を期待することができる。 With this configuration, the male terminal 13 can be mounted on the circuit board at the same time as other chip components in the same process, so the number of man-hours can be reduced compared to the conventional method. Furthermore, since the external lead wires can be attached by fitting the male connector and the female connector, a soldering process is not required, and cost reduction can be expected.
このほか、両端子１３，１６はポツテイング樹
脂等により埋設されてしまうので、外気から完全
に遮断され、従つて温度変化等による結露又は他
の水分により端子間の電流リークを起すことが完
全に除去される。また、リード線１７の引出し場
所が自由に選べるので、素子の配置の自由度が増
す等の利点も有している。 In addition, since both terminals 13 and 16 are buried with potting resin, etc., they are completely isolated from the outside air, and therefore, current leakage between the terminals due to condensation due to temperature changes or other moisture is completely eliminated. be done. Further, since the lead wire 17 can be drawn out freely, there is an advantage that the degree of freedom in arranging the elements is increased.
第４図には、第３図に示した雄型端子の変形例
が示されている。第４図に示す雄型端子２０は、
端子本体２０ａが、フランジ部２０ｂよりも下方
に延びて成る脚部２０ｃを有しており、且つこの
脚部２０ｃの先端部にはワリが入れられている点
が第３図に示した雄型コネクタ１３と異なつてい
る。ここで脚部２０ｃの長さt1は回路基板１２の
厚さt2より短かくなるように寸法が定められてい
る。脚部２０ｃは、回路基板１２に対応して設け
られている孔１２ｂ内に貫入しており、これによ
り雄型端子２０を回路基板１２に取付ける際の位
置決めを正確に行なうことができる上に、取付時
の安定性を著しく改善することができる。 FIG. 4 shows a modification of the male terminal shown in FIG. 3. The male terminal 20 shown in FIG.
The male type shown in FIG. 3 is different in that the terminal main body 20a has a leg portion 20c extending downward from the flange portion 20b, and the tip of the leg portion 20c is provided with a warp. It is different from connector 13. Here, the length t 1 of the leg portion 20c is determined to be shorter than the thickness t 2 of the circuit board 12. The leg portions 20c penetrate into the holes 12b provided in correspondence with the circuit board 12, which allows accurate positioning of the male terminal 20 when attaching it to the circuit board 12. Stability during installation can be significantly improved.
本考案によれば、上述の如く、構造が簡素化さ
れる上に組立時の半田付工程を削減することがで
きるので製造コスト低減を期待することができる
上に、端子部外気から完全に遮断することができ
るので信頼性を著しく向上させることができる。
更に、ケースに端子プレートを設ける必要がなく
なり、従つてリード線をケースの任意の部分から
外へ引出すことができるので、頗る便利である。 According to the present invention, as mentioned above, the structure is simplified and the soldering process during assembly can be reduced, so it is possible to expect a reduction in manufacturing costs.In addition, the terminal part is completely isolated from the outside air. Therefore, reliability can be significantly improved.
Furthermore, there is no need to provide a terminal plate on the case, and therefore the lead wire can be drawn out from any part of the case, which is extremely convenient.
第１図は従来の装置の構造を示す断面図、第２
図は本考案による混成集積回路装置の一実施例を
示す断面図、第３図は第２図に示す雄型及び雌型
端子の拡大詳細図、第４図は第３図に示した雄型
端子の変形例を示す拡大詳細図である。
１０……混成集積回路、１１……ケース、１１
ａ……凹部、１１ｂ……底面、１２……混成集積
回路基板、１３……雄型端子、１３ａ……端子本
体、１３ｂ……フランジ部、１４……導体パター
ン、１５……半田ペースト、１６……雌型端子、
１７……リード線。
Figure 1 is a sectional view showing the structure of a conventional device;
The figure is a sectional view showing one embodiment of the hybrid integrated circuit device according to the present invention, FIG. 3 is an enlarged detailed view of the male and female terminals shown in FIG. 2, and FIG. 4 is the male type terminal shown in FIG. 3. FIG. 7 is an enlarged detailed view showing a modified example of the terminal. 10...Hybrid integrated circuit, 11...Case, 11
a... Recessed portion, 11b... Bottom surface, 12... Hybrid integrated circuit board, 13... Male terminal, 13a... Terminal body, 13b... Flange portion, 14... Conductor pattern, 15... Solder paste, 16 ...female terminal,
17... Lead wire.
Claims (1)
めの凹部を有するケースとを備え、該ケースの凹
部の底に集積回路基板を固着して成る混成集積回
路装置において、雄型端子部材を半田ペーストに
よりチツプ部品のリフローと同時に前記集積回路
基板に固定し、予めリード線が電気的に接続され
て成る雌型端子部材を前記雄型端子部材に嵌着せ
しめた後、前記凹部内に充填し、集積回路基板と
両端子部材とを封止したことを特徴とする混成集
積回路装置。 In a hybrid integrated circuit device comprising an integrated circuit board and a case having a recess for accommodating the integrated circuit board, and the integrated circuit board is fixed to the bottom of the recess of the case, the male terminal member is attached with solder paste. fixing the chip component to the integrated circuit board at the same time as reflowing the chip component, fitting a female terminal member to which lead wires are electrically connected in advance into the male terminal member, and then filling the recess; A hybrid integrated circuit device characterized in that an integrated circuit board and both terminal members are sealed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3415983U JPS59140450U (en) | 1983-03-11 | 1983-03-11 | Hybrid integrated circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3415983U JPS59140450U (en) | 1983-03-11 | 1983-03-11 | Hybrid integrated circuit device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59140450U JPS59140450U (en) | 1984-09-19 |
| JPH0119425Y2 true JPH0119425Y2 (en) | 1989-06-05 |
Family
ID=30164931
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3415983U Granted JPS59140450U (en) | 1983-03-11 | 1983-03-11 | Hybrid integrated circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59140450U (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2745614B2 (en) * | 1988-12-28 | 1998-04-28 | 松下電器産業株式会社 | Cord reel device |
-
1983
- 1983-03-11 JP JP3415983U patent/JPS59140450U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59140450U (en) | 1984-09-19 |
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