JP2540426Y2 - Circuit component mounting structure - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit component mounting structure in which a circuit component having external connection terminals such as an integrated circuit device is mounted on a circuit board and then subjected to insulation coating with an exterior resin. .

[0002]

2. Description of the Related Art FIG. 6 is a diagram for explaining a conventional example immediately after an integrated circuit device is mounted on a circuit board and then subjected to insulation coating with an exterior resin. FIG. 7 is a cross-sectional view of FIG.
FIG. 6 and 7, for example, in the integrated circuit device 1, the external connection terminals 2 are placed on land electrodes formed on a circuit board 11 (not shown), and are temporarily attached with an adhesive (not shown). .
Thereafter, the integrated circuit device 1 and the circuit board 11 are electrically and mechanically connected by soldering or reflow processing.

[0003] The hybrid integrated circuit device in which the integrated circuit device 1 and other circuit components are mounted on the circuit board 11 as described above is thereafter entirely covered with an exterior resin 12 in order to improve the withstand voltage and moisture resistance. Is done. In the hybrid integrated circuit device configured as described above, since the exterior resin is filled between the external connection terminals, the withstand voltage between the external connection terminals is improved regardless of the environmental humidity.

[0004]

FIG. 8 shows FIGS. 6 and 7.
FIG. 3 is a view showing a state in which the exterior resin of FIG. FIG. 9 shows FIG.
FIG. After connecting the external connection terminals 2 of the integrated circuit device 1 to the land electrodes on the circuit board 11 and applying or dipping the exterior resin 12 around the circuit board 11, the exterior resin 12 is immediately 6 and 7 without going around the space 13 below the external connection terminal 2 in the device 1. However, since the exterior resin 12 has fluidity, as shown in FIGS. 8 and 9, the exterior resin 12 also reaches the space 13 below the external connection terminal 2 before being cured. in this way,
The exterior resin 12 applied or dipped above the external connection terminal 2 becomes thinner above the space 13 below the external connection terminal 2 or its portion 17 is depressed. As a result, the external connection terminal 2 and the integrated circuit device 1
In some cases, a pinhole 14 is formed at a connection portion with the mold portion. The bent portion 15 of the external connection terminal 2
Alternatively, the exterior resin 12 coated on the ridge 16 may become thin and partially exposed. The exterior resin 12 is
When the air flows into the space 13, air is entrapped and air bubbles may be generated in a part of the exterior resin 12.

As described above, a part of the hybrid integrated circuit device,
In particular, in the vicinity of the external connection terminal 2, a portion that is not covered with the exterior resin 12 occurs or is extremely thin.
In the case of an exterior resin containing air bubbles, the withstand voltage characteristics are deteriorated. Further, the hybrid integrated circuit device as described above,
Vulnerable to aging and had problems with reliability. Furthermore, when mounting circuit components on a circuit board, positioning is performed visually or by image processing. However, when the wiring pattern on the circuit board is miniaturized, positioning becomes difficult even by visual observation or image processing.

The present invention is intended to solve the above-described problems, and is used for positioning when mounting circuit components on a circuit board, and for reliability for a long time without change in withstand voltage characteristics and moisture resistance. It is an object of the present invention to provide a mounting structure of a circuit component having high performance.

[0007]

In order to achieve the above object, a circuit component mounting structure according to the present invention includes a circuit component (1 in FIG. 1) having an external connection terminal (2 in FIG. 1), A circuit board (11 in FIG. 1) on which the component (1) is mounted;
A groove (5 in FIG. 1) is formed along the external connection terminal (2) of the circuit component (1), and a circuit board (1) is formed.
An insulating block (3 in FIG. 1) that fills a space (13 in FIG. 4) surrounded by the surface of 1), the external connection terminals (2), and side ends (4 in FIG. 1) of the circuit component (1); And an exterior resin (12 in FIG. 4) that covers the circuit component (1) and the circuit board (11) together with the insulating block (3).

[0008]

[Function] An insulating block having a groove formed on the circuit board and having a groove formed therein for burying the external connection terminal while closing a space formed by the external connection terminal, the surface of the circuit board, and the end face of the circuit component on the side of the external connection terminal. Pre-positioned. Thereafter, the exterior resin is applied or dipped on the circuit board and each circuit component. However, since the exterior resin before being cured has the insulating block, it does not go under the external connection terminals. As a result, there is no place in the exterior resin where pinholes are generated or where the exterior resin is not applied or dipped. Also, there is no portion where the exterior resin becomes thin. Therefore, the hybrid integrated circuit device provided with the exterior resin has improved withstand voltage characteristics and moisture resistance. Further, since the insulating block does not have a lead portion such as an external connection terminal, it can be easily attached to a correct position by using a jig or the like. And if the insulating block is mounted in the correct position,
Even a circuit component such as an integrated circuit device having an external connection terminal can be easily attached to a correct position by guiding a groove formed in the insulating block.

[0009]

FIG. 1 is a diagram showing an embodiment of the present invention in which an integrated circuit device is mounted on a circuit board via an insulating block. FIG. 2 is a diagram showing an embodiment of the present invention in which an integrated circuit device is mounted on a circuit board on which an insulating block is mounted. 1 and 2, the circuit board 11
On the top, a wiring pattern (not shown), land electrode,
Alternatively, external connection terminals and the like are formed. Further, for example, an insulating block 3 is mounted on the circuit board 11 corresponding to the external connection terminal 2 provided on the integrated circuit device 1. The insulating block 3 is shaped so as to close a space formed by the external connection terminal 2 of the integrated circuit device 1, the circuit board 11, and the side end 4 of the integrated circuit device 1 on the side of the external connection terminal 2. ing. Also, the insulating block 3
Is formed with a groove 5 in which the external connection terminal 2 of the integrated circuit device 1 is buried. That is, the groove 5 is formed so as to follow the shape of the external connection terminal 2 of the integrated circuit device 1.

The external connection terminal 2 of the integrated circuit device 1 is bent from the side end 4 so as to be surface-mounted on a land electrode (not shown) on the circuit board 11. The insulating block 3 is formed so that the external connection terminal 2 bent as described above is embedded therein so that no space is formed below the external connection terminal 2. When the external connection terminals 2 are provided at both ends of the integrated circuit device 1, the insulating blocks 3 and 3 'are provided so as to sandwich the integrated circuit device 1, as shown in FIG.

The insulating blocks 3 to 3 'having the above-mentioned shape are bonded to the circuit board 11 in advance by a jig or the like. Thereafter, the external connection terminals 2 of the integrated circuit device 1 are buried along the grooves 5 to 5 'of the insulating blocks 3 to 3'. Since the solder paste is placed between the external connection terminal 2 and the land electrode (not shown) of the circuit board 11, the two are soldered by, for example, performing a reflow process. And then,
The circuit board 11 is applied or dipped thereon, for example, with an epoxy resin. And the circuit board 1
In No. 1, the epoxy resin is cured by passing through a drying oven.

FIG. 3 shows another embodiment of the present invention, in which an insulating block is formed in a frame shape. In FIG. 3, the insulating block 3 ″ is formed in a rectangular frame shape, and has a groove 5 ″ in which the external connection terminal 2 is buried, as in FIGS. 1 and 2. The frame-shaped insulating block 3 ″ is applied to an integrated circuit device having external connection terminals on all sides. In the embodiment shown in FIGS.
Since the exterior resin has no space formed below the external connection terminals 2, there is no possibility that a pin pole is formed or the external connection terminals 2 are exposed by the exterior resin flowing into the space.

The reason why the pinhole cannot be formed and the reason why the external connection terminal 2 is not exposed will be described below. FIG. 4 is a sectional view showing the vicinity of the external connection terminal in the integrated circuit device after the exterior resin is applied according to the embodiment of the present invention. FIG. 5 is a sectional view taken along line AA 'of FIG. 4 and 5, the exterior resin 12 does not enter the space 13 formed below the external connection terminal 2 due to its fluidity because the insulating block 3 and the external connection terminal 2 are in close contact. Therefore, the exterior resin 12 does not become thin near the external connection terminal 2 or a pinhole does not occur.

Although the embodiment of the present invention has been described in detail, the present invention is not limited to the embodiment. And
Various design changes can be made without departing from the present invention described in the utility model registration claims. In the embodiments, the integrated circuit device has been described. However, the present invention is not limited to any circuit components provided with external connection terminals. The shape of the insulating block and its groove is not limited to the shape of the embodiment as long as there is no space between the surface of the circuit board, the external connection terminal, and the side end of the circuit component.

[0015]

According to the present invention, the insulating portion is disposed in the space formed by the circuit board, the external connection terminals, and the side end portions of the circuit components. And a shape close to a coated or dipped state is maintained. Therefore, a thin portion or a pinhole cannot be formed in the exterior resin near the external connection terminal. Further, the grooves for burying the external connection terminals formed in the insulating portion can easily and accurately position the circuit components. That is, the insulating block of the present invention improves the formation of the exterior resin and is suitable for positioning circuit components.

[Brief description of the drawings]

FIG. 1 is a diagram showing an embodiment of the present invention in which an integrated circuit device is mounted on a circuit board via an insulating block.

FIG. 2 is a diagram showing an embodiment of the present invention in which an integrated circuit device is mounted on a circuit board on which an insulating block is mounted.

FIG. 3 shows another embodiment of the present invention in which an insulating block is formed in a frame shape.

FIG. 4 is a cross-sectional view showing the vicinity of external connection terminals in the integrated circuit device after the exterior resin is applied according to the embodiment of the present invention.

FIG. 5 is a sectional view taken along line AA ′ of FIG. 4;

FIG. 6 shows an integrated circuit device mounted on a circuit board;
It is a figure for explaining the prior art example immediately after performing insulation coating with exterior resin.

FIG. 7 is a sectional view taken along the line BB ′ of FIG. 6;

FIG. 8 is a view showing a state in which the exterior resin of FIGS. 6 and 7 is cured.

FIG. 9 is a sectional view taken along the line CC ′ of FIG. 8;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Integrated circuit device 2 ... External connection terminal 3, 3 ', 3 "... Insulating block 4 ... Side end part 5, 5', 5" ... Groove 11 ... Circuit Substrate 12 ... exterior resin 13 ... space

Claims (1)

(57) [Scope of request for utility model registration] 1. A circuit component having an external connection terminal, a circuit board on which the circuit component is mounted, a groove formed along the external connection terminal of the circuit component, a surface of the circuit board, and an external connection terminal And an insulating block that fills a space surrounded by side ends of the circuit component, and an exterior resin that covers the circuit component and the circuit board together with the insulating block.