JPH0119261B2 - - Google Patents
Info
- Publication number
- JPH0119261B2 JPH0119261B2 JP57040757A JP4075782A JPH0119261B2 JP H0119261 B2 JPH0119261 B2 JP H0119261B2 JP 57040757 A JP57040757 A JP 57040757A JP 4075782 A JP4075782 A JP 4075782A JP H0119261 B2 JPH0119261 B2 JP H0119261B2
- Authority
- JP
- Japan
- Prior art keywords
- frequency power
- bias voltage
- self
- power source
- plasma
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Drying Of Semiconductors (AREA)
- Plasma Technology (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57040757A JPS58158929A (ja) | 1982-03-17 | 1982-03-17 | プラズマ発生装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57040757A JPS58158929A (ja) | 1982-03-17 | 1982-03-17 | プラズマ発生装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58158929A JPS58158929A (ja) | 1983-09-21 |
| JPH0119261B2 true JPH0119261B2 (enExample) | 1989-04-11 |
Family
ID=12589490
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57040757A Granted JPS58158929A (ja) | 1982-03-17 | 1982-03-17 | プラズマ発生装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58158929A (enExample) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4496448A (en) * | 1983-10-13 | 1985-01-29 | At&T Bell Laboratories | Method for fabricating devices with DC bias-controlled reactive ion etching |
| JPS60116125A (ja) * | 1983-11-29 | 1985-06-22 | Zenko Hirose | 成膜方法 |
| JPS60187025A (ja) * | 1984-03-07 | 1985-09-24 | Ulvac Corp | プラズマ放電装置に於けるセルフバイアス電圧制御装置 |
| JPS6147642A (ja) * | 1984-08-14 | 1986-03-08 | Teru Saamuko Kk | プラズマ発生装置 |
| JPH0642452B2 (ja) * | 1984-09-06 | 1994-06-01 | 松下電器産業株式会社 | プラズマ化学気相堆積方法 |
| JPS61119029A (ja) * | 1984-11-14 | 1986-06-06 | Nippon Soken Inc | 水素化アモルフアス半導体薄膜の製造方法 |
| JPS61166028A (ja) * | 1985-01-17 | 1986-07-26 | Anelva Corp | ドライエツチング装置 |
| US4602981A (en) * | 1985-05-06 | 1986-07-29 | International Business Machines Corporation | Monitoring technique for plasma etching |
| JP2570805B2 (ja) * | 1988-04-26 | 1997-01-16 | 株式会社島津製作所 | プラズマ付着装置 |
| US5288971A (en) * | 1991-08-09 | 1994-02-22 | Advanced Energy Industries, Inc. | System for igniting a plasma for thin film processing |
| JP2530560B2 (ja) * | 1993-05-17 | 1996-09-04 | 株式会社アドテック | 高周波プラズマ用インピ―ダンス整合装置 |
| WO1999020087A2 (en) | 1997-10-14 | 1999-04-22 | Advanced Energy Industries, Inc. | System for plasma ignition by fast voltage rise |
| US6677711B2 (en) * | 2001-06-07 | 2004-01-13 | Lam Research Corporation | Plasma processor method and apparatus |
| JP4370789B2 (ja) | 2002-07-12 | 2009-11-25 | 東京エレクトロン株式会社 | プラズマ処理装置及び可変インピーダンス手段の校正方法 |
| US20040118344A1 (en) | 2002-12-20 | 2004-06-24 | Lam Research Corporation | System and method for controlling plasma with an adjustable coupling to ground circuit |
| US8450635B2 (en) | 2007-03-30 | 2013-05-28 | Lam Research Corporation | Method and apparatus for inducing DC voltage on wafer-facing electrode |
| JP5147510B2 (ja) | 2007-04-27 | 2013-02-20 | キヤノン株式会社 | 電子写真用ローラ部材の製造方法 |
| CN113179574B (zh) * | 2021-04-23 | 2022-06-07 | 山东大学 | 用于标定区域等离子体分布的多通道朗缪尔探针诊断系统 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS597212B2 (ja) * | 1977-09-05 | 1984-02-17 | 富士通株式会社 | プラズマ・エッチング方法 |
| JPS55118637A (en) * | 1979-03-06 | 1980-09-11 | Chiyou Lsi Gijutsu Kenkyu Kumiai | Plasma etching apparatus |
-
1982
- 1982-03-17 JP JP57040757A patent/JPS58158929A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58158929A (ja) | 1983-09-21 |
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