JPH01175187A - Bonding method for substrate type electric part - Google Patents
Bonding method for substrate type electric partInfo
- Publication number
- JPH01175187A JPH01175187A JP33215887A JP33215887A JPH01175187A JP H01175187 A JPH01175187 A JP H01175187A JP 33215887 A JP33215887 A JP 33215887A JP 33215887 A JP33215887 A JP 33215887A JP H01175187 A JPH01175187 A JP H01175187A
- Authority
- JP
- Japan
- Prior art keywords
- board
- conductive adhesive
- linear pattern
- base
- electrical component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 16
- 239000000758 substrate Substances 0.000 title abstract description 10
- 239000000853 adhesive Substances 0.000 claims abstract description 48
- 230000001070 adhesive effect Effects 0.000 claims abstract description 48
- 239000000919 ceramic Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000010186 staining Methods 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
Abstract
Description
【発明の詳細な説明】
〔概要〕
基板形電気部品を基台に貼着する接着方法に関し、
接着作業時間が速く、且つ基板形電気部品を汚損する恐
れのない、基板形電気部品の接着方法を提供することを
目的とし、
基台の部品取着領域内に、ノズル型のディスペンサを用
いて、導電性接着剤を所望の直線状パターンに塗布し、
その後、基板形電気部品の基板の裏面側を、該直線状パ
ターンの表面に押圧し前後左右に摺動して、該直線状パ
ターンの導電性接着剤を該部品取着領域の全面に押し伸
ばし塗布した後に、硬化させ該基板形電気部品を基台に
、貼着する構成とする。[Detailed Description of the Invention] [Summary] A method for adhering a board-shaped electrical component to a base, which has a quick bonding time and does not cause the risk of contaminating the board-shaped electrical component. The purpose is to apply conductive adhesive in a desired linear pattern within the component attachment area of the base using a nozzle-type dispenser,
Then, press the back side of the board of the board-shaped electrical component against the surface of the linear pattern and slide it back and forth and left and right to push and spread the conductive adhesive of the linear pattern over the entire surface of the component attachment area. After being applied, it is cured and the board-shaped electrical component is attached to a base.
本発明は、基板形電気部品を基台に貼着する接着方法に
関する。The present invention relates to an adhesion method for adhering a board-shaped electrical component to a base.
セラミンク基板の表面に所望の回路を設けた例えば混成
集積回路、ストリップ線路、或いは金属板上に薄いフェ
ライト基板を貼着したサーキュレータ等のように、薄い
板状の基板よりなる基板形電気部品は、接地を完全にす
るため、導電性接着剤を用いて基台に貼着するのが一般
である。Substrate-shaped electrical components made of thin plate-like substrates, such as hybrid integrated circuits, strip lines, or circulators with a thin ferrite substrate pasted on a metal plate, have a desired circuit on the surface of a ceramic substrate. To ensure complete grounding, it is generally attached to the base using conductive adhesive.
一方、他の電子部品等と同様に、このような基板形電気
部品もまた、基台等への取着作業が容易で、且つ短時間
のことが要望されている。On the other hand, like other electronic components, such board-shaped electrical components are also required to be easy and quick to attach to a base or the like.
例えば０．６鶴〜１．２ｆｌのように薄い板厚のセラミ
ック基板等よりなる基板形電気部品を、基台の所定の位
置に導電性接着剤を用いて貼着する場合は、従来下記の
ようにしている。For example, when attaching a board-shaped electrical component made of a thin ceramic board of 0.6 to 1.2 fl to a predetermined position on a base using a conductive adhesive, the conventional method is as follows: That's what I do.
従来は基板形電気部品を裏返しにして、基板の裏面に、
筆を用いて導電性接着剤を万遍なく一様に塗布した後に
、基板形電気部品を基台の所定の部品取着領域に位置合
わせし押付け、１００℃前後にに加熱して導電性接着剤
を硬化させて、基板形電気部品を基台に接着して装着し
ていた。Conventionally, board-type electrical components were turned over and placed on the back side of the board.
After applying the conductive adhesive evenly and evenly using a brush, align and press the board-shaped electrical component onto the designated component mounting area of the base, and heat it to around 100℃ to apply the conductive adhesive. After curing the agent, the board-shaped electrical components were attached to the base by gluing them.
上記従来方法は、片手で基板を保持し、他方の手に筆を
持って、導電性接着剤を基板の裏面に塗布す、る方法で
あって、基板が薄くて持ち難いばかりでなく、基板の裏
面を筆で何回も摺動して塗布しなければならないので、
接着作業が非能率的であった０
また、導電性接着剤は他の接着剤に較べて低粘度である
。したがって塗布作業中に導電性接着剤が、基板の表面
（塗布時には下側になっている）に流れ込み、基板形電
気部品を汚損するという問題点があった。The conventional method described above involves holding the board in one hand and holding a brush in the other hand to apply conductive adhesive to the back side of the board, which not only makes the board thin and difficult to hold; Because you have to apply by sliding the back side of the brush many times,
The adhesive work was inefficient.0 Also, conductive adhesives have lower viscosity than other adhesives. Therefore, there is a problem in that the conductive adhesive flows onto the surface of the substrate (which is on the lower side at the time of coating) during the coating operation, and contaminates the substrate-shaped electrical component.
本発明はこのような点に鑑みて創作されたもので、接着
作業時間が速く、且つ基板形電気部品を汚損する恐れの
ない、基板形電気部品の接着方法を提供することを目的
としている。The present invention was created in view of these points, and an object of the present invention is to provide a method for bonding board-shaped electrical components, which is quick in bonding work time, and does not cause the risk of contaminating the board-shaped electrical components.
上記の問題点を解決するために本発明方法は、第１図（
ａ）、 （ｂｌに示す工程図のように、基台２の部品取
着領域３内に、ノズル型のディスペンサ１０を用いて、
導電性接着剤５を所望の直線状パターンに塗布する。In order to solve the above problems, the method of the present invention is shown in Fig. 1 (
a), (As shown in the process diagram shown in BL, using a nozzle-type dispenser 10 in the component attachment area 3 of the base 2,
Apply conductive adhesive 5 in the desired linear pattern.
その後、基板形電気部品ｌの基板の裏面側を、直線状パ
ターンの表面に押圧し前後左右に摺動して、直線状パタ
ーンの導電性接着剤５を部品取着領域３の全面に押し伸
ばし塗布する。Thereafter, the back side of the board of the board-shaped electrical component l is pressed against the surface of the linear pattern and slid back and forth and left and right to push and spread the conductive adhesive 5 of the linear pattern over the entire surface of the component attachment area 3. Apply.
そして、加熱して導電性接着剤５を硬化させ、基板形電
気部品１を基台２に貼着する。Then, the conductive adhesive 5 is cured by heating, and the board-shaped electric component 1 is attached to the base 2.
上記本発明方法によれば、導電性接着剤は粘度が低いの
で、基板形電気部品の基板の裏面を、直線状パターンの
導電性接着剤部分に押し付け、前後左右に摺動すると、
容易に導電性接着剤を部品取着領域の全面に押し伸ばし
、塗布することできる。According to the method of the present invention, since the conductive adhesive has a low viscosity, when the back side of the board of the board-shaped electric component is pressed against the conductive adhesive part of the linear pattern and slid back and forth and left and right,
The conductive adhesive can be easily spread and applied over the entire surface of the component attachment area.
また、導電性接着剤を基板形電気部品側ではな（、基板
形電気部品を取付ける基台の取着面に、ノズル型のディ
スペンサを用いて直線状に塗布しているので、基板形電
気部品の基板の表面側に導電性接着剤が流出することが
なく、基板形電気部品を汚損する恐れがない。In addition, since the conductive adhesive is applied in a straight line using a nozzle-type dispenser to the mounting surface of the base on which the board-type electrical component is attached, the conductive adhesive is not applied to the board-type electrical component side. The conductive adhesive will not flow out onto the surface side of the board, and there is no risk of contaminating the board-shaped electrical components.
さらにまた、基台の部品取着領域にＸ軸方向。Furthermore, the X-axis direction is in the component attachment area of the base.
Ｙ軸方向、或いはＸ軸方向Ｙ軸方向を連続して繋げたコ
の字形等の直線状に、ディスペンサ或いは基台を摺動す
るのであるから、導電性接着剤の塗布作業が容易で、自
動化が可能ととなる。The dispenser or base slides in a straight line, such as a U-shape that connects the Y-axis direction or the X-axis direction and the Y-axis direction, making the application of conductive adhesive easy and automated. becomes possible.
以下図を参照しながら、本発明を具体的に説明する。な
お、全図を通じて同一符号は同一対象物を示す。The present invention will be specifically described below with reference to the drawings. Note that the same reference numerals indicate the same objects throughout the figures.
第１図の（ａ）、 （ｂｌは本発明方法の工程を示す斜
視図、第２図は本発明にかかわるディスペンサの断面図
、第３図は本発明方法の他の実施例の斜視図である。Figures 1(a) and (bl are perspective views showing the steps of the method of the present invention, Figure 2 is a sectional view of a dispenser according to the present invention, and Figure 3 is a perspective view of another embodiment of the method of the present invention. be.
第１図において、１は、例えば０．６ｎ〜１．２ｍｍの
ように薄い板厚のセラミック基板の表面に所望の回路を
設けた基板形電気部品であって、裏面の全面に、金等を
メタライズして接地導体層を設けである。In FIG. 1, reference numeral 1 denotes a board-type electrical component in which a desired circuit is provided on the surface of a thin ceramic substrate of, for example, 0.6 nm to 1.2 mm, and the entire back surface is coated with gold or the like. A ground conductor layer is provided by metallizing.
基台２は、基板形電気部品１を収容する金属よりなる筐
体の底板等であって、点線で示す矩形状の部品取着領域
３上に、基板形電気部品１を接着し、装着するように構
成されている。The base 2 is a bottom plate or the like of a metal casing that houses the board-shaped electrical component 1, and the board-shaped electrical component 1 is bonded and mounted onto a rectangular component mounting area 3 shown by a dotted line. It is configured as follows.
部品取着領域３内に、導電性接着剤５を直線状パターン
に塗布するディスペンサ１０は、詳細を第２図に示すよ
うになっている。The dispenser 10 for applying the conductive adhesive 5 in a linear pattern within the component mounting area 3 is shown in detail in FIG.
第２図において、ディスペンサ１０は金属よりなる円筒
形のシリンダ１１の先端を絞って、細目のノズル１２を
設けである。In FIG. 2, the dispenser 10 has a cylindrical cylinder 11 made of metal with a narrow nozzle 12 formed by narrowing the tip.
シリンダ１１の上部に、キャップ１３を気密に冠着し、
キャップ１３の中心部を気密にロッドを貫通させ、シリ
ンダ１１内のロッドの先端に、円板形のピストン１５を
固着しである。A cap 13 is airtightly attached to the top of the cylinder 11,
A rod is hermetically passed through the center of the cap 13, and a disk-shaped piston 15 is fixed to the tip of the rod inside the cylinder 11.
また、シリンダ１１の頭部近傍に、送排気管１４の端末
を連結しである。Further, the end of the supply/exhaust pipe 14 is connected to the vicinity of the head of the cylinder 11.
なお、シリンダ１１に導電性接着剤５を補充するには、
キャップ１３をシリンダ１１より取り外し、さらにピス
トン１５を引き出して、シリンダｌｌ内に導電性接着剤
５を投入する。この際、ロッドを引っ張れば、容易にシ
リンダ１１よりピストン１５を取り出すことができる。Note that in order to replenish the cylinder 11 with the conductive adhesive 5,
The cap 13 is removed from the cylinder 11, the piston 15 is pulled out, and the conductive adhesive 5 is poured into the cylinder 11. At this time, the piston 15 can be easily taken out from the cylinder 11 by pulling the rod.
このような、ディスペンサ１０を用いて、導電性接着剤
５を直線状パターンで塗布するには、まず、シリンダ１
１のピストン１５より下側に導電性接着剤５を投入する
。そして塗布時以外は、送排気管１４よりシリンダ１１
の上部の空気を排出して、ピストン１５を引き上げるよ
うにして、導電性接着剤５をシリンダ１１内に引き込む
ようにしておく。In order to apply the conductive adhesive 5 in a linear pattern using such a dispenser 10, first, the cylinder 1 is
The conductive adhesive 5 is placed below the piston 15 of No. 1. At times other than when applying, the cylinder 11 is connected to the supply and exhaust pipe 14.
The conductive adhesive 5 is drawn into the cylinder 11 by discharging the upper air and pulling up the piston 15.
このように、シリンダ１１の頭部を低圧に保持して、低
粘度の導電性接着剤５が、ノズル１２より滴下するのを
阻止する。In this way, the head of the cylinder 11 is maintained at a low pressure to prevent the low viscosity conductive adhesive 5 from dripping from the nozzle 12.
ノズル１２より導電性接着剤５を流出させるには、送排
気管１４よりの排気を中止するか、或いは送排気管１４
より送風するものである。In order to cause the conductive adhesive 5 to flow out from the nozzle 12, the exhaust from the supply/exhaust pipe 14 must be stopped, or the supply/exhaust pipe 14 must be
It blows more air.
上述のようなディスペンサ１０を用いて、第１図（ａｌ
に示すように、基台２の部品取着領域３内にそれぞれの
素線が、Ｘ軸或いはＹ軸に並行するコ字形が連続した直
線状パターンになるように、導電性接着剤５を塗布する
。Using the dispenser 10 as described above, FIG.
As shown in the figure, conductive adhesive 5 is applied within the component attachment area 3 of the base 2 so that each wire forms a linear pattern with continuous U-shapes parallel to the X-axis or Y-axis. do.
その後、基板形電気部品１の基板の縁を手で持ち、裏面
を下側にして部品取着領域３に押付け、前後左右に数回
摺動させて、直線状パターンの導電性接着剤５を部品取
着領域３の全面に押し伸ばし塗布する。After that, hold the edge of the board of the board-shaped electrical component 1 with your hand, press it against the component mounting area 3 with the back side facing down, and slide it back and forth and left and right several times to apply the conductive adhesive 5 in a linear pattern. Spread and apply over the entire surface of the component attachment area 3.
基板形電気部品１を部品取着領域３上に載せた状態で、
基台２の全体を１００℃前後に加熱して、導電性接着剤
５を硬化させ、基板形電気部品１を基台２に貼着する。With the board-shaped electrical component 1 placed on the component mounting area 3,
The entire base 2 is heated to around 100° C. to harden the conductive adhesive 5, and the board-shaped electrical component 1 is attached to the base 2.
なお、直線状パターンに導電性接着剤５塗布するには、
ディスペンサ１０を手動で移動する以外に、自動装置を
用いれば量産的で高能率である。In addition, in order to apply the conductive adhesive 5 to the linear pattern,
Instead of manually moving the dispenser 10, automatic equipment can be used for mass production and high efficiency.
即ち、ディスペンサ１０を垂直に保持し、基台２をＸ−
Ｙ駆動テーブル上に固着し、基台２に所望のＸ−Ｙのパ
ターン運動を付与する自動化装置を使用する。或いは、
基台２を固定テーブルに固着し、ディスペンサ１０に所
望のＸ−Ｙのパターン運動を付与する自動化装置を使用
する。That is, the dispenser 10 is held vertically and the base 2 is
An automated device is used which is fixed onto a Y-drive table and imparts the desired X-Y pattern movement to the base 2. Or,
The base 2 is secured to a fixed table and automated equipment is used to impart the desired X-Y pattern movement to the dispenser 10.
第３図は、基板形電気部品の基板が細長い板状の場合で
ある。FIG. 3 shows a case where the board of the board-shaped electric component is in the form of an elongated plate.
したがって、基板形電気部品を挿着する筐体２０の底板
２ＯＡには、基板形電気部品の基板と同形状の細長い矩
形状の部品取着領域３０を点線で示しである。Therefore, on the bottom plate 2OA of the casing 20 into which the board-shaped electrical component is inserted, an elongated rectangular component mounting area 30 having the same shape as the board of the board-shaped electrical component is indicated by dotted lines.
このように部品取着領域３０が細長い場合には、導電性
接着剤５の直線状パターンは、単なる二条の直線で良い
。When the component attachment area 30 is elongated in this way, the linear pattern of the conductive adhesive 5 may be simply two straight lines.
上述の如くに本発明の導電性接着剤の塗布方法は、まず
、ディスペンサ１０で基台２側に直線状パターンに導電
性接着剤を塗布するので、自動化が容易であって、作業
効率が向上する。As described above, in the conductive adhesive application method of the present invention, the conductive adhesive is first applied to the base 2 side in a linear pattern using the dispenser 10, so automation is easy and work efficiency is improved. do.
また、基板形電気部品１側でなく、基台２側に塗布する
のであるから、導電性接着剤が基板形電気部品１の基板
の表面に付着することがなくて、基板形電気部品を汚損
する恐れがない。In addition, since the conductive adhesive is applied to the base 2 side rather than the board-type electrical component 1 side, the conductive adhesive does not adhere to the surface of the board of the board-type electrical component 1, thereby preventing it from contaminating the board-type electrical component. There is no fear of it happening.
以上説明したように本発明方法は、導電性接着剤を、基
板形電気部品を取付ける基台側に、ディスペンサを用い
て直線状パターンに塗布するという、基板形電気部品の
接着方法であって、導電性接着剤の塗布作業が容易であ
り、且つ自動化することが簡単で、接着作業時間が速く
、且つ導電性接着剤が基板形電気部品を汚損する恐れの
ない等、実用上で優れた効果がある。As explained above, the method of the present invention is a method for bonding a board-shaped electrical component, in which a conductive adhesive is applied in a linear pattern on the base side on which the board-shaped electrical component is attached using a dispenser, and the method includes: It has excellent practical effects, such as easy application of conductive adhesive, easy automation, fast bonding time, and no risk of conductive adhesive staining board-type electrical components. There is.
第１図の（ａ）、 （ｂｌは本発明方法の工程を示す斜
視図、
第２図は本発明にかかわるディスペンサの断面図、
第３図は本発明方法の他の実施例の斜視図である。
図において、
１は基板形電気部品、
２は基台、
３．３０は部品取着領域、
５は導電性接着剤、
１０はディスペンサ、
１１はシリンダ、
１２はノズル、
１５はピストン、
２０は筐体、
２〇八は底板をそれぞれ示す。
（α）
（ｌｒ））
Ｊ乞テ；ヌヘ゛〉ヅFigures 1(a) and (bl are perspective views showing the steps of the method of the present invention, Figure 2 is a sectional view of a dispenser according to the present invention, and Figure 3 is a perspective view of another embodiment of the method of the present invention. In the figure, 1 is a board type electrical component, 2 is a base, 3.30 is a component attachment area, 5 is a conductive adhesive, 10 is a dispenser, 11 is a cylinder, 12 is a nozzle, 15 is a piston, 20 indicates the housing, and 208 indicates the bottom plate. (α) (lr))
Claims (1)
スペンサ（１０）を用いて、導電性接着剤（５）を所望
の直線状パターンに塗布し、 その後、基板形電気部品（１）の基板の裏面側を、該直
線状パターンの表面に押圧し前後左右に摺動して、該直
線状パターンの導電性接着剤（５）を該部品取着領域（
３）の全面に押し伸ばし塗布した後に、硬化させ該基板
形電気部品（１）を基台（２）に、貼着することを特徴
とする基板形電気部品の接着方法。[Claims] Applying a conductive adhesive (5) in a desired linear pattern within the component mounting area (3) of the base (2) using a nozzle-type dispenser (10), Thereafter, the back side of the board of the board-shaped electrical component (1) is pressed against the surface of the linear pattern and slid back and forth and left and right to attach the conductive adhesive (5) of the linear pattern to the component. region(
3) A method for adhering a board-shaped electrical component, which comprises applying the board-shaped electrical component (1) to a base (2) by stretching the entire surface of the board and then curing the board-shaped electrical component (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33215887A JPH0642384B2 (en) | 1987-12-28 | 1987-12-28 | Bonding method for board type electrical components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33215887A JPH0642384B2 (en) | 1987-12-28 | 1987-12-28 | Bonding method for board type electrical components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01175187A true JPH01175187A (en) | 1989-07-11 |
| JPH0642384B2 JPH0642384B2 (en) | 1994-06-01 |
Family
ID=18251799
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33215887A Expired - Lifetime JPH0642384B2 (en) | 1987-12-28 | 1987-12-28 | Bonding method for board type electrical components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0642384B2 (en) |
-
1987
- 1987-12-28 JP JP33215887A patent/JPH0642384B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0642384B2 (en) | 1994-06-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CA1128674A (en) | Method of mounting electronic components | |
| US6174752B1 (en) | Method and apparatus for epoxy loc die attachment | |
| JPH07218440A (en) | Part preparation method for automatic assignment | |
| JPH01175187A (en) | Bonding method for substrate type electric part | |
| JP3422297B2 (en) | Paste application method and paste application device | |
| JPH06112240A (en) | Method and apparatus for insertion of chip into housing at inside of board by adhesive-coated head | |
| US6858469B1 (en) | Method and apparatus for epoxy loc die attachment | |
| JPS59136990A (en) | Reflow soldering method | |
| KR100902838B1 (en) | Method for applying soldering cream using silicon pad | |
| JP3784877B2 (en) | Electronic circuit coating method | |
| JPS59100545A (en) | Die bonding device for ic chip | |
| US7115976B1 (en) | Method and apparatus for epoxy LOC die attachment | |
| JPS63104428A (en) | Method for gluing semiconductor pellet | |
| JPH05218629A (en) | Dispensing method of creamy solder | |
| JP2001284374A (en) | Bonding paste transfer device, and transfer method | |
| JPH0983122A (en) | Solder supply method | |
| JPH0312940A (en) | Mount of pellet | |
| JPH10308579A (en) | Solder paste coater | |
| JPH06142576A (en) | Method and apparatus for applying highly viscous material | |
| JPH04268790A (en) | Circuit board manufacturing method and device | |
| JPH04105332A (en) | Paste coater | |
| JPS63215094A (en) | Electronic parts mounter | |
| JPH01135218A (en) | Structure of mounting part for crystal resonator | |
| JPH06283559A (en) | Chip bonding device | |
| JPH0354888A (en) | Mounting method for electronic component |