JPS63215094A - Electronic parts mounter - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to an electronic component mounting apparatus for mounting electronic components such as flat packages onto a substrate.

(Prior Art) Conventionally, for example, when mounting a four-way flat package (hereinafter referred to as QFP) on a substrate, as shown in FIG.
The lead 2 of the FPI is positioned and placed on the pattern 5 on the substrate 4.

With the QFPl placed on the substrate 4, the heater chip 6 is pressed onto the lead 2 of the QFPl from above as shown in FIG. 2(b), and the solder attached to the pattern 5 is heated by the heater chip 6. Lead 2 is fixed to pattern 5.

(Same layer point to be solved by the invention) However, if solder bulges on the pattern 5 on the substrate 4 or if there is variation in the vertical direction in the lead 2 of the QFPI, the QFPI glue 2 There was a problem that the pattern deviated from pattern 5 on pattern 4.

The present invention has been made to solve the above-mentioned drawbacks.
The purpose of this is to mount electronic components in a way that allows electronic components to be accurately mounted at specified positions on the board, even when the pattern on the board is raised or the leads of the electronic component are uneven in the vertical direction. The goal is to provide equipment.

[Configuration of the Invention (Means for Solving the Problems)] In order to solve the above problems, the present invention provides a suction nozzle that suction-holds an electronic component and positions the lead of the electronic component in a pattern on a substrate; A heater chip is fixed to the suction nozzle and heats and fixes the lead of the electronic component to the pattern on the board; The device is characterized by comprising a slide nozzle that is pressed against the slide nozzle.

(Function) In other words, in the present invention, by positioning the lead of the electronic component against the pattern on the board while pressing it against the tip end surface of the heater chip, the lead of the electronic component is Even if there is variation in the vertical direction, electronic components can be accurately mounted at predetermined positions on the board.

(Example) Hereinafter, an example of the present invention will be described with reference to the drawings.

FIG. 1 shows an embodiment of the present invention, in which 11 is a cylinder, 12 is a heater chip, and 13 is a slide nozzle.

This slide nozzle 13 is provided at the tip of one cylinder 11, and is slidable in the axial direction of the nozzle 13 by suction of air within the cylinder 11. Further, the heater chip 12 is arranged around the cylinder 11 and fixed to the cylinder 11 via a support member 14, and the suction nozzle 13
will be moved together with the

When mounting the QFP 15 on the substrate 17 using this apparatus configured as described above, first, suction force is generated by sucking out the air in the cylinder 11, and the QFP 5 is sucked and held via the slide nozzle 13. At this time, the slide nozzle 13 slides upward due to the suction force.
The leads 16 of the QFPI 5 are pressed against the lower surface of the heater chip 12. Therefore, in this state Q
After the lead 16 of the FP 15 is positioned and pressed against the pattern 18 on the substrate 17, the solder attached to the pattern 18 is heated by the heater chip 12, so that it can be soldered and fixed to the pattern 18 on the substrate 17.

As mentioned above, in this embodiment, QFPl 5 glue 16
Since it is positioned and placed on the pattern 18 on the board 17 while being pressed against the tip end surface of the heater chip 12, if the solder on the pattern 18 is raised or if the solder is placed on the lead 16 of the QFPI 5, Even if there are variations in direction, the QFP 15 does not move before being fixed, and can be accurately attached to a predetermined position on the substrate 17.

Moreover, since the slide nozzle 13 slides in the axial direction of the cylinder 11, even if the height from the top surface of the package to the lead 16 changes, it can be reliably pressed against the tip surface of the heater chip 12.

In addition, as a method for accurately applying the lead 16 to the pattern 18 on the substrate, first position the substrate 17, indicate the pattern with coordinate values, accurately position the lead 16 with respect to the slide nozzle 13, and apply suction to the nozzle.

Place the assembly of the cylinder and heater chip on the above-mentioned seat IJiIi.
1 and move it onto the substrate. This technique is the same as what has been done in the past, so a detailed explanation is omitted. Furthermore, it goes without saying that the present invention is applicable not only to QFPs but also to general electronic components mounted on substrates.

[Effects of the Invention] As explained above, according to the present invention, the lead of the electronic component is pressed against the tip surface of the heater chip and positioned on the pattern on the board, so that the pattern on the board is not raised. Even if the leads of the electronic component are uneven in the vertical direction, the leads of the electronic component will not be deviated from the pattern on the board, and the electronic component can be mounted at a predetermined position on the board.

[Brief explanation of the drawing]

FIG. 1 is a schematic diagram of an electronic component mounting apparatus showing an embodiment of the present invention, FIGS. 2(a) and 2(b) are explanatory diagrams showing a conventional electronic component mounting method, and FIG. 3 is a pattern on a board. FIG. 4 is a perspective view showing a state in which the leads of the electronic component are vertically scattered. 11...Cylinder, 12...Heater chip, 13.
...Slide nozzle, 15...QFP, 16...Lead, 17...Substrate, 18...Pattern. Applicant's agent Patent attorney Takehiko Suzue Figure 1 (a) Figure 2

Claims (1)

[Claims] A suction nozzle that holds the electronic component by suction and positions the lead of the electronic component on the pattern on the board; a heater chip that is fixed to the suction nozzle and heats and fixes the lead of the electronic component on the pattern on the board; An electronic component mounting device comprising: a slide nozzle that is slidably provided at the tip of the heater chip and presses the lead of the electronic component against the tip surface of a heater chip by being sucked into the suction nozzle.