JP2699605B2 - Optical semiconductor device module - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device module for optical communication having a function of incorporating an optical semiconductor device and being coupled to an optical fiber.

[Conventional technology]

Conventionally, this type of optical semiconductor element module (hereinafter simply referred to as an optical module) has been configured as shown in FIGS. 3 (a) and 3 (b).

3 (a) and 3 (b) are views showing a conventional optical module, wherein FIG. 3 (a) is a front view and FIG. 3 (b) is a side view.
In these figures, 1 is a main body of a conventional optical module,
Reference numeral 2 denotes an optical receptacle for connecting an optical connector (not shown) to the main body 1, and 3 denotes a flange for fixing the main body 1 to a printed circuit board (not shown).
Is provided with a through hole 3a through which a mounting screw (not shown) is inserted.

The main body 1 is entirely formed in a substantially columnar shape, and includes an optical semiconductor element (not shown) and an optical semiconductor element (hereinafter, referred to as an optical semiconductor element).
An optical system member (not shown) for transmitting light between the optical connector and the optical connector is incorporated therein. The body 1 is provided with a plurality of electrodes 4 at the end opposite to the optical receptacle 2 for electrically connecting the optical element and the terminal of the printed circuit board. The electrode 4 is formed in a rod shape and extends from the end surface of the main body 1 along the longitudinal direction of the main body 1.

In order to mount the conventional optical module configured as described above on, for example, a printed circuit board, first, the flange 3 is screwed to the printed circuit board with mounting screws, and then the electrodes 4 are soldered to terminals of the printed circuit board. It is. At the time of soldering, in order to align the electrode 4 with the terminal, the electrode 4 is bent and shaped. This mounting work was performed manually because of the complexity of the work itself.

[Problems to be solved by the invention]

In recent years, the automation rate when mounting electric components on a printed circuit board has been increasing due to the improvement of surface mounting technology.
However, in a printed circuit board having a conventional optical module, the optical module must be mounted manually after mounting various electric components by an automatic machine, and it is not possible to realize complete automation. That is, the use of the conventional optical module raises the problem that the cost of assembling the printed circuit board is increased and the lead time for assembling is increased.

In order to mount the optical module on the surface, it is necessary to prevent an excessive force from being applied to the soldering portion when connecting the optical connector to the optical receptacle 2.

[Means for solving the problem]

The optical semiconductor element module according to the present invention includes a lead,
It is formed in a flat plate shape having a soldering surface parallel to the mounting surface of the board, and the leads and the optical receptacle are extended laterally from the main body. A flat plate-like electrode is soldered, the main body is covered with a mold resin, and a vacuum suction flat surface substantially parallel to the mounting surface is formed on the upper surface of the mold resin. The lower surface of the electrode is positioned on the same plane along the lower surface of the mold resin.

(Operation)

The optical semiconductor element module according to the present invention is in a state in which the flat surface of the mold resin is automatically conveyed to the soldering position of the substrate by sucking the flat surface of the mold resin with the vacuum suction type conveying device, and the lead and the plate-like electrode are placed on the surface of the base Soldered. Since the main body of the optical semiconductor element module is supported on the substrate via the flat electrode, almost all external force applied to the main body provided with the optical receptacle is transmitted to the base via the flat electrode.

〔Example〕

Hereinafter, an embodiment of the present invention will be described in detail with reference to FIGS. 1 (a) to 1 (c).

1 (a) to 1 (c) are views showing an optical semiconductor device module according to the present invention, wherein FIG. 1 (a) is a plan view and FIG. 1 (b).
Is a front view showing the main part in a cutaway manner, and FIG. 3C is a side view of the same. In these figures, reference numeral 11 denotes an optical semiconductor element module (hereinafter, referred to as an optical module) according to the present invention. 21 is an optical system unit as the main body of the optical module,
Reference numeral 22 denotes a rod-shaped electrode connected to an optical element in the optical system unit 21. The rod-shaped electrode 22 projects from the side of the optical system unit 21 opposite to the optical receptacle 14. The optical receptacle 14 is fitted with an optical connector (not shown), and connects the optical connector with the optical system unit 21.

Reference numerals 23, 24 and 25 denote plate electrodes and leads for electrically connecting the optical system unit 21 to terminals of a printed circuit board (not shown). The flat electrode 23 is formed so that the lower surface thereof is flat, and is soldered to a lower portion of the optical system unit 21 facing the mounting surface of the printed circuit board. The leads 24 and 25 are soldered to the rod-shaped electrodes 22, respectively.

Further, these flat electrodes 23 and leads 24, 25
The portion extended to the side of the optical system unit 21 (the side opposite to the extending direction of the optical receptacle 14) is positioned on the same plane. That is, the soldering surfaces 23a, 24a,
25a will be formed.

Reference numeral 26 denotes a mold resin for sealing the optical system unit 21 and each electrode, and is molded so as to expose the electrodes 23 and the soldering surfaces 23a, 24a, 25a of the leads 24, 25. That is, the soldering surfaces 23a, 24a, 25a are positioned on the same plane along the lower surface of the mold resin 26.

Further, the soldering surfaces 23a, 24
The soldering surfaces 23a, 23a, 2a
A vacuum suction flat surface 26a substantially parallel to 4a and 25a is formed.

Next, a procedure for mounting the thus configured optical module 11 according to the present invention on a printed circuit board will be described. The printed circuit board is provided with terminals in a positional relationship corresponding to the flat electrodes 23 and the soldering surfaces 23a, 24a, 25a of the leads 24, 25.

When mounting on a printed circuit board, first, a vacuum suction type transfer device (not shown) is sucked on the flat surface 26a of the mold resin 26. Next, the optical module 11 is transported to a predetermined position on the printed board by the vacuum suction type transport apparatus, and the soldering surfaces 23a, 24a, 25a are placed on the terminals of the printed board.
Position. After that, the terminal is soldered to the flat electrode 23 and the leads 24, 25.

Therefore, in the optical module 11 according to the present invention, the optical module 11 is transported to the mounting position by automatic handling by vacuum suction, and is surface-mounted on a printed circuit board. Further, since the optical system unit 21 of the optical module 11 is supported on the printed circuit board via the plate-like electrode 23, almost all external forces applied to the optical system unit 21 when connecting the optical connector to the optical receptacle 14 are substantially the same. The light is transmitted to the substrate via the flat electrode 23. For this reason, no excessive force is applied to the soldered portions of the leads 24, 25.

〔The invention's effect〕

As described above, in the optical semiconductor element module according to the present invention, the lead is formed in a flat plate shape having a soldering surface parallel to the mounting surface of the substrate, and the lead and the optical receptacle are directed sideways from the main body. Along with the extension, a flat plate-like electrode having a flat lower surface is soldered to a lower portion of the main body facing the mounting surface of the substrate, and the main body is covered with a molding resin, and the upper surface of the molding resin is substantially parallel to the mounting surface. A flat surface for vacuum suction is formed, and the soldering surface of the lead and the lower surface of the flat electrode are positioned on the same plane along the lower surface of the mold resin. The substrate is automatically conveyed to the soldering position of the substrate by being adsorbed on the substrate, and is soldered in a state where the flat electrode and the lead are placed on the surface of the substrate.

Therefore, in the optical semiconductor element module according to the present invention, the optical semiconductor device module is transported to the mounting position by automatic handling by vacuum suction and is surface-mounted on a printed circuit board, so that automatic surface mounting on the substrate becomes possible. For this reason, fully automatic assembly of the substrate having the optical semiconductor element module is realized, and the manufacturing cost of the optical communication device can be kept low, and the assembly lead time can be shortened.

In addition, since the main body of the optical semiconductor element module is supported on the substrate via the flat electrode, almost all external force applied to the main body when connecting the optical connector to the optical receptacle is applied to the substrate via the flat electrode. Is transmitted. Therefore, no excessive force is applied to the soldered portion of the lead.

[Brief description of the drawings]

1 (a) to 1 (c) are views showing an optical semiconductor element module according to the present invention, wherein FIG. 1 (a) is a plan view, and FIG. Figure (c) also shows a side view. 2 (a) and 2 (b) are views showing a conventional optical module, wherein FIG. 2 (a) is a front view and FIG. 2 (b) is a side view. 11 ... optical module, 14 ... optical receptacle, 23 ... plate electrode, 24,25 ... lead, 23a, 24a, 25a ... solder surface, 26 ... mold resin, 26a ... flat surface,

Claims (1)

(57) [Claims] 1. An optical semiconductor device module having an optical semiconductor element incorporated in a main body and a lead for connecting a substrate and an optical receptacle for connecting an optical connector provided in the main body, wherein the lead is connected to a solder parallel to the mounting surface of the substrate. A flat plate-like electrode having a flat surface having a mounting surface, the lead and the optical receptacle extending sideways from the main body, and a lower surface being flat at a lower portion of the main body facing the mounting surface of the substrate. Is soldered, the main body is covered with a molding resin, a flat surface for vacuum suction is formed on the upper surface of the molding resin substantially parallel to the mounting surface, and the soldering surface of the lead and the lower surface of the plate-like electrode are An optical semiconductor element module, which is located on the same plane along the lower surface of a mold resin.