JPH0751820Y2 - Optical transceiver - Google Patents

Description

[Detailed Description of the Invention] [Industrial application] The present invention relates to an optical transmitter / receiver, which is particularly easy to assemble, has a low cost of parts, can securely fix the shield cover unit, and is compact in size. Possible optical transceivers.

[Prior Art] In general, an optical fiber connected to an optical fiber to receive an optical signal from the optical fiber and convert it into an electric signal, or convert an electric signal into an optical signal and send the optical signal to the optical fiber. Transceivers are already known. Here, a conventional optical transceiver will be described.

FIG. 3 is a perspective view showing an example of the structure of a conventional optical transceiver,
FIG. 4 is a cross-sectional view showing a case where a metal cover unit is attached and shielded instead of the resin mold cover unit in FIG. In FIG. 3, 1 is an optical connector fixing block unit, 2 is a metal base unit for fixing a hybrid IC, 3 is a hybrid IC substrate unit having a dual in-line structure, and 4 is a hybrid IC.
The protective cover unit 5 and 5 are input / output lead terminals. The optical connector fixing unit 1 includes an optical connector 7 connected to an optical cable and a light emitting element or a light receiving element. The board unit 3 has lead terminals 5 on both sides thereof. The substrate unit 3 is directly bonded onto the metal base unit 2. The optical connector fixing block unit 1 accommodating the light emitting element or the light receiving element is fixed to the metal base unit 2 by screws 6.

By the way, in FIG. 3, since the electric element portion is easily affected by the external induction noise, it is necessary to shield the whole with a metal body. FIG. 4 shows a sectional view of the optical transmitter / receiver in the case where the whole is shielded as described above. As described above, the light emitting element or the light receiving element 8 is housed in the optical connector fixing block unit 1 and has a structure that can be coupled with the optical fiber connected to the optical connector 7. An integrated circuit element 9 is mounted on the substrate unit 3 for the hybrid IC, and an electric signal is transmitted to the integrated circuit element 9 through the input / output lead terminal 5 having the dual in-line structure. The metal cover unit 10 for shielding is attached to the metal base unit 2 with screws 11. If necessary, the metal cover unit 10 may be attached to the base unit 2 with a conductive adhesive.

Note that FIG. 5 is a bottom view of the optical transceiver of FIG.

The optical transmitter / receiver having the above configuration is assembled as follows. The lead terminals 5 are soldered to the substrate unit 3 for the hybrid IC. Then, the substrate unit 3 is adhesively fixed to the metal base unit 2. Next, the leads 8A of the light emitting element or the light receiving element 8 are soldered to the substrate unit 3 for the hybrid IC. Then, the shield metal cover unit 10 is attached to the base unit 2 with the screws 11, and the assembly is completed.

[Problems to be Solved by the Invention] By the way, the conventional optical transceiver as described above has the following problems.

When the optical transmission speed is increased, the number of circuit elements that drive the integrated circuit element 9 is increased, and the size of the entire device is increased by mounting only one side (only the upper surface) as described above, resulting in an increase in size of the device.

For this reason, it is conceivable to reduce the size of the device by using a multi-layer substrate, but in this case, there arises a problem that the cost of parts is significantly increased.

In order to assemble each member as described above, for example, the soldering of the board unit and the lead terminal and the soldering of the board unit and the lead of the light emitting element or the light receiving element are performed in different steps, or the bonding step or the screw is performed. There were many steps such as the attaching step, and the assembling cost increased.

1 to 2 with the screw 11 at the end of the metal cover unit 10.
Since it is fixed in place and cantilevered, it is not only difficult to attach this cover unit to the base unit in parallel, but also at the other end of the cover unit in the direction of arrow B (Fig. 4). It was easy to deform when the force from was applied. For this reason, in order to prevent deformation, the cover unit must be made thick, which further increases the cost of parts.

As described above, since it is difficult to fix the position of the metal cover unit, it is easy for this cover unit and the lead terminal to short-circuit.

The present invention was devised in order to effectively solve the above problems.

The purpose of the present invention is to easily miniaturize, low manufacturing cost,
Another object of the present invention is to provide an optical transceiver capable of securely and easily fixing a shield cover unit.

[Means for Solving the Problems] The present invention provides an optical connector fixing block unit accommodating a light emitting element or a light receiving element, a board unit mounting a circuit element electrically connected to the element, and an electric element for the element. A lead unit for guiding signals, a shield cover unit made of a conductive member for covering the substrate unit, and a conductive member for fixing the optical connector fixing block unit, the substrate unit, the lead unit and the shield cover unit. It is applied to an optical transceiver having a base unit.

In such an optical transceiver, the lead unit has a predetermined height to insulate the leads attached to the base unit from the base unit and to separate the lower surface of the substrate unit from the upper surface of the base unit by an appropriate distance. The board unit has a terminal hole for inserting the upper part of the lead of the lead unit and a terminal hole for inserting the lead from the optical connector fixing block unit. The cover unit is formed by bending both ends of the cover unit, and is provided with an engaging member for engaging the base unit with pressing force at each corner of the lower end thereof, and the base unit has a shield at each corner thereof. A receiving portion that engages with the engaging member of the cover unit is provided to enable soldering operation in one step and to assemble each member. Easy to, and in which the device has to be miniaturized.

[Operation] According to the present invention, since it is configured as described above, when assembling this device, the insulator of the lead unit is inserted and attached to the base unit, and the board unit is mounted on the upper end of this insulator. The optical connector fixing block unit is attached to the base unit by means of a screw or the like.

The lead from the block unit and the lead of the lead unit are soldered to the board unit in the same step, and the shield cover unit is pressed from above to engage the engaging member with the receiving portion of the base unit. And attach it to the base unit. Since the board unit is mounted above the base unit with a slight distance, the circuit element can be mounted not only on the upper surface of the board unit but also on the lower surface side.

[Embodiment] A preferred embodiment of the present invention will be described below with reference to the accompanying drawings.

FIG. 1 is an exploded perspective view showing an optical transceiver according to the present invention, and FIG. 2 is a sectional view of the optical transceiver shown in FIG. 1 after assembly.

As shown in the figure, the optical transceiver is a light emitting element or a light receiving element.
The optical connector fixing block 21 accommodating the 28 and the element 28
A board unit 23 mounted with circuit elements 29, 31 electrically connected to the lead unit 25 for guiding an electric signal to these circuit elements 29, 31, and a shield made of a conductive member for covering the board unit 23. With the cover unit 30 and the optical connector fixing block unit 21, the substrate unit 23, the lead unit 25 and the base unit 22 made of a conductive member for fixing the shield cover unit 30,
It is mainly composed.

The base unit 22 is formed, for example, by pressing a conductive sheet metal so that one end thereof is vertically erected. At the other end of the horizontal portion of the base unit 22, a pair of screw holes 22D for screw fixing the optical connector fixing block unit 21 are formed. Further, on both sides of the center of the horizontal portion, hook-shaped recesses 22C for mounting the lead unit 25 are provided. Further, in order to attach the cover unit 23 to each corner of the horizontal portion of the base unit 22, for example, a tab 40A is formed by forming a hole 40A in a metal piece and bending the hole in a vertical direction. A section 40 is provided. Further, a pair of grounding penetrating leads 33 are attached to the base unit 22 adjacent to the recessed portion 22C by penetrating the base unit 22 by soldering or welding.

The lead unit 25 is a substantially rectangular parallelepiped insulator formed by molding an insulating material such as plastic.
32 has a plurality of leads 25A embedded therein, and is provided so that all of them are projected from the lower part and part of them (lead upper part 25B) is projected from the upper part. A concave slit 32A is formed on a side portion of the insulator 32, and the slit 32A is formed in the concave portion of the base unit 22.
The lead unit 25 can be attached and detached by being fitted into the 22C. The board unit 23 is attached to the upper end of the insulator 32. The insulator 32 has a predetermined height, for example, a height equal to or higher than the height of the circuit element attached to the lower surface of the substrate unit 23, and the base unit 22
The upper surface and the lower surface of the board unit 23 mounted thereon are separated from each other by an appropriate distance. Further, a concave portion is formed in a step shape at the center of the upper end of the insulator 32 so that a circuit element attached to the lower surface of the board unit 23 does not hit the insulator 32.

In the substrate unit 23 for the hybrid IC, the integrated circuit element 29 and the circuit element 31 for driving the integrated circuit element 29 are attached not only to the upper surface but also to the lower surface. This board unit 23
A terminal hole 23A for inserting the lead upper portion 25B of the lead 25A of the lead unit and the upper portion of the through lead 33 is formed on both sides of the. Also, this board unit 23
On the mounting side of the optical connector fixing block unit 21, a terminal hole 23B for inserting the plurality of leads 28A from the optical connector fixing block unit 21 is formed.

The optical connector fixing block unit 21 has an optical connector 27 connected to an optical cable (not shown) at one end, and a light emitting element or a light receiving element 28 coupled to this connector is housed inside the optical connector 27. . And this element
From 28, a plurality of light emitting and receiving element leads 28A are connected to the substrate unit 2
Has been extended to 3. Further, a pair of screw holes 26A are formed on the lower surface of the block unit 21 so as to correspond to the screw holes 22D of the base unit 22, so that the block unit 21 can be screwed to the base unit 22. Has become.

The shield cover unit 30 is formed in a U-shaped cross section by bending both sides of a conductive metal plate, for example.
An engaging member 30A projecting inward is formed at each corner of the lower end of the unit 30, and the engaging member 30A is configured to engage with the receiving portion 40 of the base unit 22. Has been done. For example, the tip of the engaging member 30A is formed into an inclined surface, and when this surface abuts the upper end of the receiving portion 40, the pressing force applied to the cover unit 30 expands and engages the cover unit 30. The member 30A can be easily fitted into the hole 40A of the receiving portion 40.

Next, a procedure for assembling the optical transmitter / receiver configured as described above will be described.

First, the integrated circuit element 29 and the circuit element 31 are mounted on one side or both sides of the substrate unit 23 for the hybrid IC by soldering or the like.

Next, the slits 32A formed in the insulator 32 of the lead unit 25 are fitted into the recesses 22C on the left and right sides of the base unit 22.

Next, while inserting the lead upper portions 25B of the lead units 25 into the terminal holes 23A on both sides of the board unit 23, the board unit 23 is placed on the insulator 32. At this time, since the board unit 23 and the base unit 22 are separated from each other by an appropriate distance and a recess is formed in the upper portion of the insulating portion 32, the circuit attached to the lower surface of the board unit 23. The element does not contact the base unit 22.

Next, the optical connector fixing block unit 21 is placed on the other end side of the base unit 22, and the leads 28A of this light emitting element or light emitting / receiving element 28 are inserted into the terminal holes 23B of the substrate unit 23. Then, a screw 26 is screwed into the screw hole 22D and the screw hole 26A of the block unit 21 from below the base unit 22 to firmly tighten the block unit 21 to the base unit 22.

Then, the lead unit 25A and the light emitting / receiving element lead 28A of the lead unit, which are inserted into the terminal holes 23A and 23B of the board unit 23 in the previous step, are respectively soldered to the board unit 2
Solder to 3. At this time, since each soldering operation is performed on the same surface of the board unit,
This soldering operation can be easily performed.

Finally, attach the shield cover unit 30 to the board unit 23.
It is placed on and the pressing force is applied from above. Then,
The engaging member 30A at the corner of the cover unit 30 comes into contact with the receiving portion 40 of the base unit 22, and the engaging member 30A fits into the hole 40A of the receiving portion 40 while expanding the cover unit 30. As a result, the cover unit 30 is fixed to the base unit 22, and the assembling operation of this optical transceiver is completed.

In this way, the cover unit 30 is attached to the base unit 22 by the pressing force applied to the cover unit 30, and the lead unit 25 also has the insulator 32 in the recessed portion of the base unit 22.
It can be attached to the base unit 22 simply by inserting it into 22C, and screws and the like are not required, so that assembly can be performed easily.

Further, the lead upper portion 25B of the lead unit 25 and the light emitting / receiving element lead 28A of the optical connector fixing block unit 21 can be joined by a single soldering operation on the same surface, which makes the operation easy and highly reliable. A joint can be obtained.

Further, the shield cover unit 30 is fixed to the base unit 22 at four corners thereof, and the side portions thereof are supported by the insulator 32 of the lead unit 25. There is no short circuit with the lead 25A, and even if a force is applied to the cover unit 30, it will not easily deform.

Further, since the lead-through lead 33 metal-bonded to the base unit 22 and the ground of the board unit 23 are soldered, they can be made to have the same potential, and the shield effect can be improved.

In the above embodiment, the cover unit 30 is provided with the protruding engaging member 30A, and the base unit 22 is provided with the receiving portion 40 having the hole 40A for receiving the engaging member 30A. It may be formed. Further, although the cover unit 30 is made of metal, it is not limited to this and may be made of conductive plastic.

[Effect of Invention] As described above, according to the present invention, the following effects are exhibited.

The shield cover unit can be fixed easily and reliably. Further, even if the cover unit is made thin, the deformation can be prevented and the cover unit can be manufactured by press working, so that the cost of parts can be reduced.

Since the insulator of the lead unit can be mass-produced by, for example, plastic molding, the cost of parts can be further reduced.

Since the insulator of the lead unit is provided with a predetermined height so that the board unit can be floated from the base unit, circuit elements can be mounted on both sides of the board unit, and the overall size of the device can be reduced. .

The lead unit and cover unit can be assembled simply by inserting them into the base unit.
The screwing is required only when the optical connector fixing block unit is attached, and the mounting process can be greatly reduced.

[Brief description of drawings]

FIG. 1 is an exploded perspective view of an optical transceiver according to a preferred embodiment of the present invention, FIG. 2 is a sectional view of the optical transceiver shown in FIG. 1, and FIG. 3 shows a structure of a conventional optical transceiver. FIG. 4 is a perspective view, FIG. 4 is a cross-sectional view showing a case where a metal cover unit is attached instead of the resin cover unit in FIG. 3 for shielding, and FIG. 5 is a bottom view of the optical transceiver of FIG. 21 …… Optical connector fixed block unit, 22 …… Base unit, 23 …… Board unit, 23A, 23B …… Terminal hole, 25
...... Lead unit, 30 …… Shield cover unit, 30A …… Engaging member, 32 …… Insulator, 40 …… Reception part.

Continuation of the front page (51) Int.Cl. ⁶ Identification number Office reference number FI Technical indication location H04B 10/14 10/26 10/28 H05K 7/14 C 7301-4E

Claims (1)

[Scope of utility model registration request] 1. An optical connector fixing block unit accommodating a light emitting element or a light receiving element, a board unit on which a circuit element electrically connected to the element is mounted, and a lead unit for guiding an electric signal to the circuit element. A light having a shield cover unit made of a conductive member for covering the substrate unit, and a base unit made of a conductive member for fixing the optical connector fixing block unit, the substrate unit, the lead unit and the shield cover unit. In the transceiver, the lead unit has a predetermined height so as to insulate the leads attached to the base unit from the base unit and to separate the lower surface of the substrate unit from the upper surface of the base unit by an appropriate distance. And an insulator detachably attached to the base unit, And a terminal hole for inserting an upper portion of the lead of the lead unit and a terminal hole for inserting a lead from the optical connector fixing block unit, wherein the shield cover unit is formed by bending both ends thereof and a lower end thereof. An engaging member for engaging the base unit with a pressing force at each corner of the base unit, and the base unit has a receiving portion that engages with an engaging member of the shield cover unit at each corner thereof. An optical transmitter / receiver characterized by comprising.