JPH0513036Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to the structure of a transmitting/receiving module.

[Conventional technology]

FIG. 2 is an exploded perspective view showing a conventional optical transmission module. As shown in the figure, this is a substrate 1 on which an optical transmission circuit is constructed, and lead terminals 2 are attached to both longitudinal sides. The case 3 is a metal case to which a light emitting element 4 is attached, and together with a metal cover 5 constitutes an outer casing of the device, and is connected to earth to constitute a shield. Then, the board 1 causes the lead terminals 2 to protrude outside, and the case 3
A cover 5 is attached to form the device. This device is mounted on a board (not shown), and the optical transmission circuit on the board 1 is electrically connected to the circuit on the board, and the case 3
and cover 5 is grounded to the board.

Further, the optical receiving module has a structure substantially similar to that of the optical transmitting module described above, and the two modules are usually used by being mounted on the above-mentioned board as a set.

FIG. 3 is an exploded perspective view showing a conventional optical transceiver module. As mentioned above, the optical transmitting module and the optical receiving module are usually mounted and used as a pair, so as shown in the figure, the board 7 on which the optical transmitting circuit is constructed is placed in the case 6 which has a partition plate in the middle. There is also an embodiment in which the optical transmission module and the optical reception module are configured as one unit, in which the substrate 8 on which the optical transmission module and the optical reception circuit are configured are housed, and a cover 9 is attached. Here board 7
and 8 each have a lead terminal 10 on only one long side.
are attached, and each lead terminal 1
0 protrudes from both longitudinal sides of the case 6. Further, the light emitting element 11 and the light receiving element 12 are attached to the case 6.

[Problem that the invention attempts to solve]

However, in the former structure, the optical transmission module and the optical reception module must be mounted as a pair, and there is a limit to the miniaturization of each module, so there is a problem that it cannot be applied to high-density packaging. It was hot. Furthermore, although the latter structure has the advantage of simplifying the mounting by combining both modules into one unit, the space required for mounting is not much different from that of the former, and there is still a problem in adapting to high-density mounting. It was hot.

In view of these problems, it is an object of the present invention to provide a structure for a transmitter/receiver module that requires less space for mounting and can be adapted to high-density mounting.

[Means for solving problems]

The present invention has a transmitting/receiving module structure in which a transmitting circuit board and a receiving circuit board are housed in a conductive box. Receiving circuit boards are stacked and stored.

[Effect]

According to the present invention, since the transmitting circuit board and the receiving circuit are stored in an overlapping manner, the bottom area of the conductive box can be small, and the space required for mounting can be reduced. Note that since the two substrates are stacked on top of each other via the conductive plate material electrically connected to the conductive box, a shielding effect can be obtained between the two substrates.

〔Example〕

FIG. 1 is a sectional view showing an optical transceiver module of the present invention, and FIG. 4 is an exploded perspective view. Fourth
As shown in the figure, various electronic components are mounted on the board 13 to constitute an optical receiving circuit. On the other hand, board 1
Similarly, an optical transmission circuit is configured at 4. Further, on one long side of the substrate 13, lead terminals 15 protruding toward the circuit surface are arranged in an array. On the other hand, the board 14 has lead terminals 15 protruding toward the component side.
are arranged along one long side.

The case 16 is made of, for example, iron and includes a side plate 17 and a plate 18, and a mounting hole 19 and a screw hole 20 are provided on one short side of the side plate 17. Furthermore, the plate part 18 is formed by bending a plate material, and has a left long side 21 located at approximately the same height as the upper edge of the side plate part 17 and a middle side located at approximately the middle height of the side plate part 17. 22, and a right long side 23 (see FIG. 1) located at approximately the same height as the lower end side of the side plate portion 17. Lead terminal through holes through which lead terminals 15 pass are formed in an array on the right long side 23. Further, in the housing 25 provided near the mounting hole 19 of the case 16, there is a board (not shown) configured with a circuit for connecting the light emitting element 26 and the light receiving element 27 to the optical transmitting circuit and the optical receiving circuit. Built-in.

The light emitting element 26 and the light receiving element 27 are connected to the optical fiber 2.
8 and 29, and the stop plate 30
is fixed. This stop plate 30 has a screw hole 31
and is screwed to one short side of the case 16. As a result, the light emitting element 26 and the light receiving element 27 are mounted in the case 16, and the above-mentioned case 1
It is electrically connected to the circuit built in 6.

The lower cover 32 is made of a plate made of iron, for example, and is bent so that both longitudinal sides 33 are slightly higher than the middle side 34. Lead terminal through holes 35 are formed in both long sides 33.

The upper cover 36 is formed by bending both long sides of a plate made of iron, for example, to form a U-shape, and claws 37 and 38 are formed at the lower end thereof.

As shown in FIG. 1, the circuit board 13 is bonded to the upper surface of the middle side 22 of the plate portion 18 of the case 16 with its circuit surface, and is electrically connected to the circuit built in the case 16. At this time, the lead terminal 15 is inserted into the lead terminal through hole 24 on the right long side 23 of the plate portion 18.
penetrate.

Similarly, a substrate 14 is adhered to the lower surface of the middle side 22 of the plate portion 18 and is connected to the circuit described above.

Then, insert the lead terminal 15 into the lead terminal through hole 35.
The lower cover 32 is attached to the lower end of the side plate 17 of the case 16 and the right long side 23 of the plate 18, and the upper cover 36 is attached to the upper end of the side plate 17 of the case 16. and is attached so as to come into contact with the left long side 21 of the plate part 18, and both covers 32, 36 are attached by folding back the claw part 37.
An outer casing is constructed by fixing the .

This optical transmitter/receiver module is mounted on a board (not shown) by a claw part 38, and the optical transmitter circuit and the optical receiver circuit are connected to the circuit on the same board, and the above-mentioned outer casing is grounded to the circuit on the same board. It is something.

According to this embodiment, the substrate 13 and the substrate 14 are bonded to the upper and lower surfaces of the middle side 22 of the plate portion 18 of the case 16, and the lower cover 32 and the upper cover 3
6 is attached, so
It has the advantage of being easy to assemble. Moreover, even though the optical transmitting circuit and the optical receiving circuit are built-in, the bottom area of the outer casing is small, which is advantageous for high-density packaging. Further, since the iron plate portion 18 is interposed between the substrate 13 and the substrate 14, there is an advantage that a shielding effect between the two substrates can be obtained and a good heat dissipation effect can be obtained.

Although the embodiments of optical transceiver modules have been described above, the present invention is not limited thereto and can be applied to transceiver modules in general.

[Effect of idea]

As explained above, according to the present invention, the shielding effect between the transmitting circuit board and the receiving circuit board is ensured by interposing the conductive plate material, and since the structure is such that both boards are stacked and stored, the conductive box Since the bottom area of the body is small and the space required for mounting is small, it is advantageous for high-density mounting.

[Brief explanation of drawings]

Fig. 1 is a sectional view showing an optical transceiver module according to an embodiment of the present invention, Fig. 2 is an exploded perspective view showing a conventional optical transceiver module, and Fig. 3 is an exploded perspective view and an exploded perspective view showing a conventional optical transceiver module. FIG. 4 is an exploded perspective view showing an optical transceiver module according to an embodiment of the present invention. 13... A board on which an optical receiving circuit is configured, 14...
...Substrate on which the optical transmission circuit is constructed, 15... Lead terminal, 16... Case, 18... Plate portion, 32...
Lower cover, 36...upper cover.

Claims (1)

[Claims for Utility Model Registration] In a transmitting/receiving module structure in which a transmitting circuit board 14 and a receiving circuit board 13 are housed in a conductive box, each of the transmitting circuit board and the receiving circuit board has a lead on one long side. The terminals 15 are arranged and protruded, and the transmitting circuit board 14 and the receiving circuit board 13 are housed in a superposed manner via a conductive plate part 18 that is electrically connected to the conductive box body. Transmitting/receiving module structure.