JPS62199997U - - Google Patents
Info
- Publication number
- JPS62199997U JPS62199997U JP8781786U JP8781786U JPS62199997U JP S62199997 U JPS62199997 U JP S62199997U JP 8781786 U JP8781786 U JP 8781786U JP 8781786 U JP8781786 U JP 8781786U JP S62199997 U JPS62199997 U JP S62199997U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- transmitting
- receiving
- housed
- module structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000003287 optical effect Effects 0.000 description 6
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
第1図は本考案の一実施例の光送受信モジユー
ルを示す断面図、第2図は従来の光送信モジユー
ルを示す分解斜視図、第3図は従来の光送受信モ
ジユールを示す分解斜視図及び第4図は本考案の
一実施例の光送受信モジユールを示す分解斜視図
である。
13:光受信回路が構成される基板、14:光
送信回路が構成される基板、15:リード端子、
16:ケース、18:板部、32:下カバー、3
6:上カバー。
Fig. 1 is a sectional view showing an optical transceiver module according to an embodiment of the present invention, Fig. 2 is an exploded perspective view showing a conventional optical transceiver module, and Fig. 3 is an exploded perspective view and an exploded perspective view showing a conventional optical transceiver module. FIG. 4 is an exploded perspective view showing an optical transceiver module according to an embodiment of the present invention. 13: A board on which an optical receiving circuit is formed, 14: A board on which an optical transmitting circuit is formed, 15: Lead terminal,
16: Case, 18: Plate, 32: Lower cover, 3
6: Upper cover.
Claims (1)
性箱体に収納されて構成される送受信モジユール
構造において、導電性箱体に電気的に接続されて
いる導電性板材18を介して送信回路基板14及
び受信回路基板13が重ね合わされ収納されてい
ることを特徴とする送受信モジユール構造。 In a transmitting/receiving module structure in which a transmitting circuit board 14 and a receiving circuit board 13 are housed in a conductive box, the transmitting circuit board 14 and the receiving circuit board 13 are connected to each other via a conductive plate 18 that is electrically connected to the conductive box. A transmitting/receiving module structure characterized in that receiving circuit boards 13 are stacked and housed.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986087817U JPH0513036Y2 (en) | 1986-06-11 | 1986-06-11 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986087817U JPH0513036Y2 (en) | 1986-06-11 | 1986-06-11 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62199997U true JPS62199997U (en) | 1987-12-19 |
JPH0513036Y2 JPH0513036Y2 (en) | 1993-04-06 |
Family
ID=30945371
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1986087817U Expired - Lifetime JPH0513036Y2 (en) | 1986-06-11 | 1986-06-11 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0513036Y2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000236193A (en) * | 1999-02-17 | 2000-08-29 | Hitachi Ltd | Electronic module and optical module, and optoelectronic equipment using them |
JP2013008741A (en) * | 2011-06-22 | 2013-01-10 | Mitsubishi Electric Corp | Semiconductor module attachment structure and controller of air conditioner |
WO2014045671A1 (en) * | 2012-09-21 | 2014-03-27 | 株式会社村田製作所 | Electronic device |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57142897U (en) * | 1981-03-05 | 1982-09-07 |
-
1986
- 1986-06-11 JP JP1986087817U patent/JPH0513036Y2/ja not_active Expired - Lifetime
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57142897U (en) * | 1981-03-05 | 1982-09-07 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000236193A (en) * | 1999-02-17 | 2000-08-29 | Hitachi Ltd | Electronic module and optical module, and optoelectronic equipment using them |
JP2013008741A (en) * | 2011-06-22 | 2013-01-10 | Mitsubishi Electric Corp | Semiconductor module attachment structure and controller of air conditioner |
WO2014045671A1 (en) * | 2012-09-21 | 2014-03-27 | 株式会社村田製作所 | Electronic device |
Also Published As
Publication number | Publication date |
---|---|
JPH0513036Y2 (en) | 1993-04-06 |
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