JP3692788B2 - Optical transceiver - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an optical transceiver in which an optical element and an electric circuit are accommodated in a package, and more particularly to an optical transceiver in which a chassis ground member is firmly attached to a package against an external force in any direction.
[0002]
[Prior art]
The optical transceiver shown in FIG. 4 is obtained by integrating an optical element for inputting / outputting an optical signal and an electric circuit for mutually converting the optical signal and the electric signal. The optical element includes a light emitting element and a light receiving element. The electric circuit includes an optical transmission circuit and an optical reception circuit, and is provided on a circuit board by combining electronic components and electronic circuit modules and being integrated with a conductor that connects the electronic components and the electronic circuit modules.
[0003]
The optical transceiver is configured such that a light emitting element such as a laser diode, a light receiving element such as a photodiode, a substrate on which a transmission / reception circuit is mounted, and an electric input / output terminal are accommodated in a package 10. The shape of the package 10 is determined by various standards. As main standards, lby9, GLM, GBIC and the like are known. The shape of the conductor adapter for electrically connecting the optical transceiver and the external electric circuit varies depending on the standard. As an adapter for optically connecting an optical transceiver and an external optical element, an adapter 12 called a dual SC adapter is used in all the above-mentioned standards.
[0004]
The duplex SC adapter 12 is a rectangular frame having a predetermined size having two openings partitioned by a partition 11 for accommodating a light emitting element and a light receiving element.
[0005]
The optical transceiver package 10 is divided into a case portion 30 having an open upper portion and a cover portion 31 that closes the upper portion of the case portion 30. Each component housed in the case portion 30 is attached to the case portion 30 and is structurally structured. In order to fix and protect the upper part, the cover part 31 is attached and the package 10 is completed.
[0006]
The package may require a ground (hereinafter referred to as chassis ground) that is electrically insulated from the ground of each element or circuit (hereinafter referred to as circuit ground). This is because the electrical influence from the outside is cut off on each housed component. For this purpose, the chassis ground needs to be electrically separated from the components housed in the package 10. In particular, a chassis ground is required for the connector portion from the tip of the dual SC adapter 12 to about 8 mm. That is, the light emitting element and the light receiving element are susceptible to external electrical influences.
[0007]
When the package 10 is made of an insulator such as a plastic, it is necessary to attach a conductor member functioning as a chassis ground separately from the package to the package.
[0008]
In the conventional optical transceiver with chassis ground shown in FIG. 4, the package 10 is formed in a substantially box shape, and the duplex SC adapter 12 is formed integrally with the package 10 at the end of the package 10. A chassis ground plate 20 made of a conductor having the function of chassis ground is provided so as to cover the vicinity of the duplex SC adapter 12 on the upper surface and the lower surface of the package 10. The chassis ground plate 20 is formed with a bent portion 21 bent toward the package 10 at an end far from the double SC adapter 12, while the package 10 has a hole 13 for inserting the bent portion 21. It is formed. After inserting the bent portion 21 into the hole 13, the bent portion 21 is folded inside the package 10, whereby the chassis ground plate 20 is fixed to the package 10.
[0009]
The chassis ground plate 20 is attached before the case part 30 and the cover part 31 are assembled to the package 10.
[0010]
[Problems to be solved by the invention]
The conventional optical transceiver has the following problems.
[0011]
The chassis ground needs to be electrically separated from the circuit ground and each component in order not to have an external electrical influence on each component in the package 10. Therefore, the bent portion 21 and the hole 13 for fixing the chassis ground plate 20 are installed at a position away from the double SC adapter 12. Since the light emitting element and the light receiving element are accommodated in the double SC adapter 12 and the vicinity thereof, if the bent portion 21 or the hole 13 is installed at a position close to the double SC adapter 12, the bent inserted into the hole 13 This is because the part 21 comes close to the light emitting element and the light receiving element.
[0012]
The chassis ground plate 20 is attached by a method of attaching the chassis ground plate 20 to the package 10 after the package 10 is completed, or when the package 10 is divided into a case portion 30 and a cover portion 31. There is a method of attaching the chassis ground plate 20 to the case part 30 and the cover part 31 and then completing the package 10. In the former method, since the bent portion 21 for fixing the chassis ground plate 20 to the package 10 cannot be sufficiently folded inside the package 10, the holding force becomes weak and the bent portion 21 protrudes into the package 10. Therefore, there is a possibility of contact with the components in the package 10.
[0013]
The latter method of completing the package 10 after attaching the chassis ground plate 20 to the case part 30 and the cover part 31 is excellent. However, even this method is not fixed on the double SC adapter 12 side. There is. That is, as shown in FIG. 4, when the vertical forces a and b are applied, the chassis ground plate 20 is detached from the double SC adapter 12 side.
[0014]
If the hole 13 for inserting the bent portion 21 of the chassis ground plate 20 is installed around the double SC adapter 12, the bent portion 21 inserted into the hole 13 may come into contact with the light emitting element or the light receiving element. , Hole 13 can not be installed. Further, no protrusions can be provided around the dual SC adapter 12 for the purpose of fixing the chassis ground plate 20. This is because if a protrusion is provided around the dual SC adapter 12, the standard is not met.
[0015]
Thus, it is difficult to fix the chassis ground plate 20 around the double SC adapter 12.
[0016]
SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to solve the above-described problems and provide an optical transceiver in which a chassis ground member can be firmly attached to a package against an external force in any direction.
[0017]
[Means for Solving the Problems]
In order to achieve the above object, the present invention is partitioned by a partition for accommodating the light emitting element and the light receiving element at an end of a package that accommodates the light emitting element, the light receiving element, and the substrate on which the transmission / reception circuit is mounted. In an optical transceiver in which an adapter having a predetermined shape having two openings is formed and a chassis ground plate insulated from the respective elements and circuits is attached to the outside of the package, a part of the chassis ground plate is attached to the adapter. The claw is formed by bending the extension portion along the partition, and a groove for inserting the claw is provided in the adapter partition.
[0018]
A part of the chassis ground plate may be bent along the side surface of the package, a hole may be formed in the bent portion, and a protrusion for fitting into the hole may be provided on the side surface of the package.
[0019]
An adapter cover for covering the adapter may be formed on the chassis ground plate.
[0020]
The package may be divided into a case part having an open upper part and a cover part closing the upper part of the case part, and the chassis ground plate may be attached to the bottom face of the case part and the cover part, respectively.
[0021]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment of the present invention will be described in detail with reference to the accompanying drawings.
[0022]
As shown in FIG. 1, an optical transceiver of the present invention includes a light emitting element 1 such as a laser diode, a light receiving element 2 such as a photodiode, a substrate 5 on which an optical transmission circuit 3 and an optical reception circuit 4 are mounted, and electrical input / output terminals. 6 is accommodated in a package 10. The light emitting element 1 and the light receiving element 2 are electrically connected to the substrate 5 by leads, the element main body is disposed outside the substrate, and the direction of light is parallel to the substrate surface (this is a horizontal plane). It is set aside.
[0023]
A double SC adapter 12 having two openings defined by a partition 11 for accommodating the light emitting element 1 and the light receiving element 2 is formed at the end of the package 10. In each opening, at least a part of each element body is accommodated.
[0024]
A chassis ground plate 20 that is insulated from all of the light emitting element 1, the light receiving element 2, the transmission / reception circuits 3 and 4, the substrate 5, the electrical input / output terminal 6 and the circuit ground is attached to the outside of the package 10. The chassis ground plate 20 is provided so as to cover the vicinity of the double SC adapter 12 on the upper surface and the lower surface of the package 10.
[0025]
The chassis ground plate 20 is formed with a bent portion 21 bent toward the package 10 at an end far from the double SC adapter 12, while the package 10 has a hole 13 for inserting the bent portion 21. Is formed. After inserting the bent portion 21 into the hole 13, the bent portion 21 is folded inside the package 10, whereby the chassis ground plate 20 is fixed to the package 10.
[0026]
Further, a part of the chassis ground plate 20 is extended along the upper surface and the lower surface of the duplex SC adapter 12, and the extended portion 22 is bent at the end of the duplex SC adapter 12. The nail | claw 23 is formed by bend | folding along the front and the front-end | tip of the extension part 22 is bent. On the other hand, the partition 11 is provided with a groove 14 for inserting the claw 23. By inserting the claw 23 into the groove 14 of the partition 11, the claw 23 is engaged with the groove 14, so that the chassis ground plate 20 is fixed to the package 10.
[0027]
Further, another part of the chassis ground plate 20 is bent along the side surface of the package 10, and a hole 25 is formed in the bent portion 24. On the other hand, a projection 15 for fitting into the hole 25 is provided on the side surface of the package 10. The protrusion 15 is provided at a position away from the tip of the double SC adapter 12 by a distance specified by the standard. By fitting the protrusions 15 into the holes 25, the protrusions 15 engage with the holes 25, so that the chassis ground plate 20 is fixed to the package 10.
[0028]
The package 10 is divided into a case portion 30 whose upper portion is opened and a cover portion 31 that closes the upper portion of the case portion 30. The duplex SC adapter 12 is configured integrally with the case unit 30. The cover portion 31 is formed with a hanging portion 32 that hangs down from the side edge, and a claw 33 that is bent toward the inside of the package 10 is formed at the lower end of the hanging portion 32. On the other hand, a guide groove 34 for guiding the claw 33 from the end opposite to the end where the double SC adapter 12 is provided is formed on the side surface of the case portion 30, and for fitting the hanging portion 32. A recess 35 is formed. The claw 33 is guided from the end of the case part 30 into the guide groove 34, the cover part 31 is moved laterally until the cover part 31 closes the upper part of the case part 30, and the hanging part 32 is fitted into the concave part 35. 31 and the case part 30 couple | bond together and the package 10 is completed.
[0029]
The procedure for assembling this optical transceiver will be described.
[0030]
First, the chassis ground plate 20 is attached to each of the case part 30 and the cover part 31. That is, after placing the chassis ground plate 20 on the cover part 31 and inserting the bent part 21 into the hole 13 provided in the cover part 31 far from the dual SC adapter 12, the bent part is formed below the cover part 31. Fold 21. At this time, the duplex SC adapter 12 side of the chassis ground plate 20 is not fixed and is free.
[0031]
Further, after placing the bottom surface of the case portion 30 on the chassis ground plate 20 and inserting the bent portion 21 into the hole 13 provided in the case portion 30 far from the dual SC adapter 12, the bent portion is formed in the case portion 30. Fold 21. Thereafter, the components 1 to 6 are accommodated and fixed in the case portion 30.
[0032]
Using the cover portion 31 to which the chassis ground plate 20 is attached in this manner and the case portion 30 to which the chassis ground plate 20 is similarly attached, the claw 33 is guided to the guide groove 34 so that the cover portion 31 is the upper portion of the case portion 30. The cover part 31 is moved laterally until is closed.
[0033]
The extension 22 of the chassis ground plate 20 is aligned with the partition 11 of the dual SC adapter 12, and the claw 23 is inserted into the groove 14 of the partition 11. After the claw 23 is engaged with the groove 14, the cover part 31 and the case part 30 are joined by fitting the hanging part 32 into the recessed part 35. At this time, the protrusion 15 provided on the side surface of the package 10 is fitted into the hole 25 provided in the bent portion 24 of the chassis ground plate 20.
[0034]
In the optical transceiver assembled as described above, the engagement between the claw 23 and the groove 14 and the engagement between the protrusion 15 and the hole 25 act on the external force in the vertical direction, which has a weak holding force in the prior art. Has high holding power. Therefore, an optical transceiver is realized in which the chassis ground plate 20 is firmly attached to the package against an external force in any direction.
[0035]
Next, another embodiment of the present invention will be described.
[0036]
In FIG. 2, members having the same reference numerals as those in FIG. 1 have already been described. A configuration different from the configuration of FIG. 1 is that an adapter cover portion 26 that covers the dual SC adapter 12 is formed on the chassis ground plate 20. The adapter cover part 26 is formed so as to cover the entire upper surface or the entire lower surface of the duplex SC adapter 12. In addition, the adapter cover portion 26 is provided with a bent portion 27 that is bent along the side surface of the package 10 in the same manner as the portion that covers the vicinity of the duplex SC adapter 12, and the bent portion 27 has a hole. It has been.
[0037]
In the assembly procedure of this optical transceiver, first, the chassis ground plate 20 is attached to each of the case part 30 and the cover part 31 as in the case of FIG. At this time, the duplex SC adapter 12 side of the chassis ground plate 20 and the adapter cover 26 are not fixed and are free. Each part 1-6 is accommodated in the case part 30, and each part is fixed.
[0038]
Using the cover portion 31 to which the chassis ground plate 20 is attached in this manner and the case portion 30 to which the chassis ground plate 20 is similarly attached, the claw 33 is guided to the guide groove 34 so that the cover portion 31 is the upper portion of the case portion 30. The cover part 31 is moved laterally until is closed.
[0039]
The extension 22 of the chassis ground plate 20 is aligned with the partition 11 of the dual SC adapter 12, and the claw 23 is inserted into the groove 14 of the partition 11. After the claw 23 is engaged with the groove 14, the cover part 31 and the case part 30 are joined by fitting the hanging part 32 into the recessed part 35. At this time, the protrusion 15 provided on the side surface of the package 10 is fitted into the hole 25 provided in the bent portion 24 of the chassis ground plate 20.
[0040]
Since the optical transceiver assembled as described above is provided with the adapter cover portion 26, the dual SC adapter 12 is shielded by the chassis ground. Therefore, the light emitting element 1 and the light receiving element 2 can be effectively electrically separated from the outside, and noise radiated to the outside from the double SC adapter 12 can be effectively reduced.
[0041]
Next, the chassis ground plate will be described.
[0042]
As shown in FIG. 3A, the chassis ground plate 20 includes a rectangular flat portion 27 for covering the vicinity of the double SC adapter, and a central portion of one side of the flat portion 27 to the end of the double SC adapter. And an extended extension portion 22. On the opposite side of the plane portion 27, two bent portions 21 are provided. Further, bent portions 24 are provided on both sides of the plane portion 27 at positions close to the double SC adapter. As shown in FIG. 3 (b), the extension 22 is bent downward at the end of the dual SC adapter, extended downward along the partition, and the tip of the extension 22 is bent. A nail 23 is formed. Each of the bent portion 24 and the bent portion 21 extends downward. The hole 25 is elongated in a direction parallel to the plane portion 27.
[0043]
As shown in FIG. 3C, the chassis ground plate 20 and the package 10 can be engaged by inserting the claw 23 into the groove 14 provided in the partition 11. At this time, the claws 23 of the two chassis ground plates 20 are fitted into the grooves 14 without a gap. Further, as shown in FIG. 3D, the chassis ground plate 20 and the package 10 can be engaged by folding the bent portion 21.
[0044]
As shown in FIG. 3E, when the chassis ground plate 20 is attached to the case portion 30, the chassis ground plate 20 is attached from the lower surface side of the case portion 30. Further, as shown in FIG. 3F, when attaching the chassis ground plate 20 to the cover portion 31, the chassis ground plate 20 is attached from the upper surface side of the cover portion 31.
[0045]
【The invention's effect】
The present invention exhibits the following excellent effects.
[0046]
(1) Since the engagement between the claw 23 and the groove 14 and the engagement between the projection 15 and the hole 25 act on the external force in the vertical direction, which has been a problem in the prior art, it has a high holding force. Therefore, an optical transceiver is realized in which the chassis ground plate 20 is firmly attached to the package 10 against an external force in any direction.
[0047]
(2) By providing the adapter cover 26, the light emitting element 1 and the light receiving element 2 can be electrically separated from the outside, and noise radiated from the double SC adapter 12 to the outside can be effectively reduced. Can do.
[Brief description of the drawings]
FIG. 1 is an assembled view of a package showing an embodiment of the present invention.
FIG. 2 is an assembly view of a package showing another embodiment of the present invention.
3A and 3B are views of a chassis ground plate according to the present invention, where FIG. 3A is a plan view, FIG. 3B is a side view, FIG. 3C is a cross-sectional view when a claw is inserted into a groove, and FIG. FIG. 4 is a side view of only the chassis ground plate after attachment, (e) is a bottom perspective view showing attachment to the case portion, and (f) is a top perspective view showing attachment to the cover portion.
FIG. 4 is an assembly view of a conventional package.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Light emitting element 2 Light receiving element 3 Optical transmission circuit 4 Optical receiving circuit 5 Board | substrate 10 Package 11 Partition 12 Adapter (double SC adapter)
14 Groove 15 Protrusion 20 Chassis ground plate 22 Extension part 23 Claw 24 Bending part 25 Hole 30 Case part 31 Cover part

Claims (4)

An adapter having a predetermined shape having two openings partitioned by a partition for accommodating the light emitting element and the light receiving element at an end of a package for accommodating the light emitting element, the light receiving element, and the substrate on which the transmission / reception circuit is mounted. In the optical transceiver in which a chassis ground plate insulated from the respective elements and circuits is attached to the outside of the package, a part of the chassis ground plate is extended along the partition of the adapter. An optical transceiver characterized in that a claw is formed by bending a leading end of a protruding portion, and a groove for inserting the claw is provided in a partition of the adapter. A part of the chassis ground plate is formed to be bent along the side surface of the package, a hole is formed in the bent portion, and a protrusion for fitting into the hole is provided on the side surface of the package. The optical transceiver according to claim 1. The optical transceiver according to claim 1, wherein an adapter cover portion that covers the adapter is formed on the chassis ground plate. 2. The package according to claim 1, wherein the package is divided into a case part with an open upper part and a cover part that closes the upper part of the case part, and the chassis ground plate is attached to the bottom face of the case part and the cover part, respectively. The optical transceiver in any one of 1-3.

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