JP2001135832A - Optical module and manufacturing method whereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide optical modules to enable an adjustment of the electrical characteristics of optical module main bodies after the main bodies are molded with a resin and to provide the manufacturing method of the optical modules. SOLUTION: Optical modules 10 and 60 are respectively provided with each of optical module main bodies 12 and 62, which respectively have an optical element 18 to convert the signal of either of an optical signal and an electrical signal into the other signal between the optical signal and the electrical signal, an electronic element 20 which is electrically connected with the element 18, and internal substrate 22 having a component mounting surface 22a for mounting the element 20, a first lead array 16, which is electrically connected with the element 20, and a resin body 11 for sealing the element 18, the element 20, the substrate 22 and the array 16, each of external substrates 14 and 64, which are respectively mounted with each of variable resistors 44 and 64 for adjusting the electrical characteristics of the main bodies 12 and 62, and each of fixing means 30 and 40 for fixing the substrates 14 and 64 along the main bodies 12 and 62.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical module having a built-in optical element used in an optical link device for data communication and a method of manufacturing the same.

[0002]

2. Description of the Related Art A transmission optical module for converting an electric signal into an optical signal and sending the converted signal to an optical fiber includes a light emitting element and an electronic element connected to the light emitting element. It is widely used for data links and optical communication systems such as optical LAN.

In a conventional optical module, a substrate on which an electronic element is mounted and a light emitting element are fixed at a predetermined position on a lead frame, electrically connected by wire bonding, and then integrated with an insulating resin. It is formed by resin molding.

[0004]

However, in the above-mentioned conventional optical module, a volume as a variable resistor for adjusting an optical output and a bias current value is mounted on the same substrate together with other electronic elements. I was Therefore, after adjusting the volume and fixing the optical output and bias current value, and after resin molding, the volume cannot be adjusted at all, and the optical output and bias current value can be finely adjusted or changed after resin molding. As a result, the electrical characteristics of the optical module could not be adjusted. The same applies when the volume is replaced with a thin film resistor that can be trimmed.

SUMMARY OF THE INVENTION It is an object of the present invention to provide an optical module capable of adjusting electric characteristics after resin molding and a method for manufacturing the same.

[0006]

SUMMARY OF THE INVENTION An optical module according to the present invention comprises: (1) an optical element for converting any one signal between an optical signal and an electric signal into the other signal; An electronic element to be connected, an internal substrate having a component mounting surface for mounting the electronic element, a first lead array electrically connected to the electronic element, an optical element, an electronic element, the internal substrate, and the first (2) an external board on which a variable resistor for adjusting the electrical characteristics of the optical module body is mounted, and (3) an optical module body. And fixing means for fixing the external substrate along.

This optical module has an external substrate on which a variable resistor for adjusting electric characteristics of the optical module main body is mounted, in addition to an internal substrate resin-sealed in the optical module main body. The external substrate is fixed along the optical module body by fixing means. Therefore, even after resin sealing, the electrical characteristics of the optical module main body can be adjusted by changing the resistance value of the variable resistor on the external substrate. In addition, the area of the internal substrate can be reduced by an amount corresponding to the outside of the variable resistor, and the size of the optical module can be reduced.

In the optical module according to the present invention, the external substrate may be fixed to a side surface of the optical module main body along the internal substrate. In this case, the size of the optical module can be further reduced.

In the optical module of the present invention, the fixing means includes: (1) a second lead array extending from the inside of the optical module body to the outside, and supporting one side of the external substrate; And a support protrusion provided on a side surface of the module main body and supporting another side of the external substrate facing the one side. According to this configuration, the external substrate is supported on one side by the second lead array, and the other side opposite to the one side is supported by the support protrusion. Fixed between.

Further, in the optical module of the present invention, the first lead array extends along the component mounting surface of the internal substrate, and the second lead array extends along the component mounting surface with the first portion and the first portion. And a second portion bent at a predetermined angle to the portion. With this configuration, the external substrate is fixed between the support protrusion and the second portion of the second lead array.

The optical module according to the present invention may be characterized in that one side of the external substrate is provided with a concave portion corresponding to each of the lead pins constituting the second lead array. According to this configuration, by locking the lead pins and the recesses constituting the second lead array,
The positioning of the external substrate is performed.

Further, in the optical module of the present invention, the optical element is a light emitting element, and at least one of the optical output and the bias current can be adjusted by a variable resistor mounted on an external substrate. Good. With this configuration, it is possible to adjust at least one of the optical output and the bias current of the optical module by changing the resistance value of the variable resistor.

In the optical module according to the present invention, the optical element may be a light receiving element, and the signal detection level may be adjusted by a variable resistor mounted on an external substrate. With this configuration, the signal detection level of the optical module can be adjusted by changing the resistance value of the variable resistor.

The method for manufacturing an optical module according to the present invention comprises:
(1) a first preparation step of preparing an external substrate having one side and another side facing each other and on which a variable resistor is mounted;
(2) On a lead frame including a first lead array and a second lead array, an internal substrate on which an electronic element is mounted and an optical element are mounted and then resin-sealed. A second preparatory step of forming a resin-sealed part by forming a support projection for supporting the side, (3) a bending step of bending the second lead array by a predetermined angle, and (4) a bending step Inserting an external substrate between the second lead array and the support protrusion.

According to the method of manufacturing an optical module, the second lead array is bent in the bending step, and the external substrate is fitted between the support projection and the bent second lead array in the fitting step. The external substrate can be easily fixed to the resin sealing component.

In the method for manufacturing an optical module according to the present invention, (1) the first preparation step includes the step of:
And (2) fitting the concave portion of the external substrate with respect to the bent second lead array. Locking step to stop, (2
b) A mounting step in which the other side of the external substrate is mounted on the support projection while using the elastic force of the second lead array with the engagement portion between the second lead array and the recess of the external substrate as a fulcrum. And may be characterized. With this configuration, in the locking step, the external substrate is positioned by locking the concave portion of the external substrate and the second lead array. Then, the other side of the external substrate is placed on the support protrusion while utilizing the elastic force of the second lead array in the mounting step, so that the external substrate is placed between the second lead array and the support protrusion. It is clamped and fixed to the resin sealing component.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A preferred embodiment of an optical module according to the present invention will be described below with reference to the accompanying drawings. Note that the same components are denoted by the same reference numerals, and redundant description will be omitted.

FIG. 1 is an exploded perspective view of an optical module 10 for transmission according to the present embodiment.

The optical module 10 is, as shown in FIG.
Optical module body 12 and volume 4 as a variable resistor for adjusting the electrical characteristics of optical module body 12
And an external substrate 14 on which the optical module 4 is mounted. The external substrate 14 is fixed to a side surface of the optical module body 12 by fixing means 30 and 40.

As shown in FIG. 1, the optical module body 12 has a SIP (single in-line package) type structure in which the outer shape is substantially a quadrangular prism shape, and the first lead array 16 projects from the bottom surface. For convenience of explanation, the internal configuration of the optical module body 12 will be described first.

FIG. 2 is a perspective view showing the internal structure of the optical module main body 12. As shown in FIG. 2, the optical module main body 12 includes, inside a resin body (11 in FIG. 1), a light emitting element (optical element) 18 for converting an electric signal into an optical signal, and an electron for driving the light emitting element 18. Element 20 and internal substrate 22 having component mounting surface 22a for mounting electronic element 20
, An island 24 for mounting the light emitting element 18 and the internal substrate 22, a first lead array 16, and a second lead array 30.

The island 24 has a light emitting element mounting area 26 for mounting the light emitting element 18 and an internal substrate mounting area 28 for mounting the internal substrate 22.

The first lead array 16 includes ten lead pins, is connected to a mounting board (not shown), and transmits electric signals between the optical module body (12 in FIG. 1) and the outside. Enable. On the other hand, the second lead array 30 includes eight lead pins, and is connected to an external substrate (FIG. 1).
14) to enable the transmission of electrical signals between the optical module body 12 and the external substrate 14. The first lead array 16 is provided on the component mounting surface 22a of the internal substrate 22.
The second lead array 30 extends along the component mounting surface 22a.
a and a predetermined angle θ with respect to the base 30a, preferably 90 °
Bent portion (second portion) 30b bent at an angle equal to or less than degree
And

The light emitting element 18 is mounted on the silicon bench 31 so that the optical axis direction is along the X direction in FIG.
The light emitting element 18 is, for example, a semiconductor laser, a light emitting diode, or the like. On the silicon bench 31, a ferrule 36 into which a part of the optical fiber 33 is inserted is fixed by a resin adhesive, and the optical fiber 33 is positioned and fixed on the silicon bench 31 via a V groove. ing. Thus, optical coupling between the light emitting element 18 and the optical fiber 33 is achieved. The silicon bench 31 is connected to the island 2 via a silicon spacer 32.
4 are mounted on the light emitting element mounting area 26, and the light emitting element 18 is mounted on the island 24 via the silicon bench 31 and the silicon spacer 32.

The electronic element 20 is a signal processing device that performs predetermined processing on the received signal and outputs the processed signal, for example, the light emitting element 18.
This is a device that incorporates a drive circuit for driving. The electronic element 20 is mounted on a component mounting surface 22a of an internal substrate 22 on which printed wiring is provided.
Are mounted on the internal substrate mounting area 28 of the island 24. Then, wire bonding is performed between the light emitting element 18 and the electronic element 20 to achieve electrical connection.

The optical module body 12 includes the light emitting element 18, the electronic element 20, the internal substrate 22, the island 2
4. The first lead array 16 and the second lead array 30 are formed by resin sealing with the resin body 11.
As shown in FIG. 1, only one end of the first lead array 16 is resin-sealed, and the other end protrudes from the resin body 11. The second lead array 30 is resin-sealed only at the base 30 a, and a bent portion 30 b bent at a predetermined angle with respect to the base 30 a protrudes from the resin body 11. The ferrule 36 has only one end sealed with resin and the other end protruding from the resin body 11. A cylindrical sleeve 38 is fixed to the protruding portion of the ferrule 36. Accordingly, the optical module main body 12 extends along the optical axis X direction and has two side surfaces in a positional relationship parallel to the component mounting surface 22a of the resin-sealed internal substrate 22, and the component mounting surface 22a of the internal substrate 22. And the first lead array 16 and the second lead array 30 have a substantially quadrangular prism shape having two side surfaces protruding from each other.

As shown in FIG. 1, one side of the two sides of the optical module body 12 which are in parallel with the component mounting surface 22a of the internal substrate 22 is provided with the lower side of the external substrate 14 as shown in FIG. The support protrusion 40 for supporting the side 14b is formed. Then, the second read array 3
The 0 bent portion 30b is bent toward the support protrusion 40 side,
The upper side (one side) 14a of the external substrate 14 can be supported. Therefore, the external substrate 14 can be sandwiched between the bent portion 30b of the second lead array 30 and the support projection 40, and thus, fixing means 30, 40 for fixing the external substrate 14 are configured.

As shown in FIG. 1, the external substrate 14 has an area approximately equal to that of the internal substrate 22, and is configured by mounting two volumes 44 on a substrate on which printed wiring is provided. One of these two volumes 44 is for adjusting the light output output from the light emitting element 18 of the optical module main body 12, and the other is for adjusting the bias current supplied to the light emitting element 18 of the optical module main body 12. It is for doing. Eight recesses 46 are formed on the upper side 14 a of the external substrate 14 in accordance with the positions of the eight lead pins of the second lead array 30. A metal film is formed on the surface of the concave portion 46,
The concave portion 46 functions as a terminal for electrically connecting the optical module main body 12 and the external substrate 14.

The outer substrate 14 is formed such that the concave portion 46 of the upper side 14a is abutted against the bent portion 30b of the second lead array 30 on the side surface of the optical module main body 12, and the lower side 14b is supported by the support protrusion 40. It is fixed to the optical module body 12 along the resin-sealed internal substrate 22. The abutting portion between the concave portion 46 and the bent portion 30b may be fixed with solder to strengthen the fixed state and to ensure the electrical connection.

Next, the optical module 1 according to the present embodiment
0 will be described.

First, a metal lead frame 23 having the structure shown in FIG. 3 is prepared. The lead frame 23 includes an island 24 having a light emitting element mounting area 26 and an internal substrate mounting area 28, a first lead array 16, a second lead array 30 before being bent, and a support frame for supporting these. 48. The lead frame 23 is integrally formed by etching a metal thin plate or by punching with a press machine. At a predetermined position of the support frame 48, a plurality of holes 50 for positioning a resin molding die described later are provided.

Then, the light emitting element 18 is mounted on the light emitting element mounting area 26 of the island 24 via the silicon bench 31 and the silicon spacer 32. Further, the internal substrate 22 on which the electronic element 20 is mounted is mounted on the internal substrate mounting region 28 of the island 24.

After the light emitting element 18, the internal substrate 22 on which the electronic element 20 is mounted, the first lead array 16 and the second lead array 30 are electrically connected to form the inside of the optical module body 12. Then, the lead frame 23 is positioned and mounted on a resin molding die having a predetermined shape through the hole 50 of the support frame 48. Inject resin into this mold,
Resin sealing is performed by a transfer molding process. At this time, the support protrusion 40 for supporting the lower side 14b of the external substrate 14 is integrally formed on the side surface of the resin-sealed component (52 in FIG. 4A) with a mold.

After resin sealing, unnecessary support frames 48 are cut and removed, and a sleeve 38 is fixed to the ferrule 36. In this manner, a resin-sealed part 52 as an intermediate part before the second lead array 30 is bent as shown in FIG. 4A is manufactured (second preparation step).

On the other hand, the external substrate 1 having the printed wiring
A plurality of recesses 46 are formed on the upper side 14a of the resin-molded component 52 in accordance with the respective positions of the lead pins constituting the second lead array 30 (recess formation step), and a metal film is formed on the surface thereof. . The volume 44 is mounted on the external board 14. In this way, the external substrate 14 as shown in FIG. 4B is manufactured (first preparation step).

Next, the second lead array 30 of the resin-sealed part 52 is placed at a predetermined angle θ on the support projection 40 side (see FIG. 2).
However, it is preferably bent so as to form an angle of 90 degrees or less (bending step).

Then, the bent second lead array 3
The external substrate 14 is fitted between the support projection 40 and the support substrate 40 (fitting step), and the manufacture of the optical module 10 is completed.

Here, when the external substrate 14 is fitted between the second lead array 30 and the support projections 40 (fitting step), as shown in FIG.
Against the concave portion 46 of the external substrate 14 (locking step), and the second lead array 3
It is preferable that the lower side 14b of the external substrate 14 be mounted on the support protrusion 40 while utilizing the elastic force of 0 (mounting step). By doing so, the second lead array 30 and the support protrusion 4
The external substrate 14 can be easily fixed by being inserted between the external substrate 14 and the external substrate 14. Then, the second lead array 30 and the recess 4
6 is soldered. By doing so, the electrical connection can be made reliable, and the fixed state can be made stronger.

Although the transmitting optical module 10 according to the embodiment of the present invention has been described above, according to the present invention, the receiving optical module 60 can be configured almost similarly.

That is, the light emitting element 18 of the optical module main body 12 described in FIG. 1 is replaced with a light receiving element such as a photodiode, and the electronic element 20 has a built-in amplifier circuit for amplifying an electric signal output from the light receiving element. Thus, the optical module main body 62 for reception is configured.

At this time, as shown in FIG.
4 is the same as the external substrate 14 shown in FIG. Then, the second lead array 30 is brought into contact with a concave portion 65 formed on the upper side 64 a of the external substrate 64 to support the upper side 64 a of the external substrate 64, and the lower side 64 b is supported by the support protrusion 4.
0, and supports the lower side 64b of the external substrate 64.
As described above, the external substrate 6 is provided on the side surface of the optical module body 62.
The optical module 60 for reception is constituted by fixing 4. In the receiving optical module 60, the signal detection level can be adjusted by adjusting the volume 66 on the external board 64 to change the resistance value.

The transmitting optical module 10 and the receiving optical module 60 according to the present embodiment are housed in a housing 70 and integrally form an optical link device 72, as shown in FIGS. .

The housing 70 is made of an insulating plastic resin as shown in FIG. 7, and has an optical receptacle 74 at the front of which a transmitting and receiving optical connector is detachably fitted. , Optical module storage section 7 at the rear
6. The optical module storage section 76 is partitioned by a partition wall 78 to be divided into a transmission optical module storage section and a reception optical module storage section. A metal shield 80 made of a thin metal plate is attached along the partition wall 78 on the side of the receiving wall of the receiving optical module of the partition wall 78, so that a gap between the transmitting optical module 10 and the receiving optical module 60 is provided. Is shielded.

The transmitting optical module 10 is stored in the transmitting optical module housing, the receiving optical module 60 is stored in the receiving optical module housing, and the external substrates 14 and 64 are mounted.
Are stored facing each other. The optical module housing 76 is covered with a metal housing cover 82 to provide a shield. Thus, the optical link device 72 having a substantially rectangular parallelepiped shape as shown in FIG. 8 is formed.

Next, the operation and effects of the optical module according to the present embodiment and the method for manufacturing the same will be described.

The optical modules 10 and 6 according to the present embodiment
Reference numeral 0 denotes external substrates 14 and 64 on which volumes 44 and 66 for adjusting the electrical characteristics of the optical module bodies 12 and 62 are mounted in addition to the internal substrate 22 resin-sealed in the optical module bodies 12 and 62. have. The external substrates 14 and 64 are fixed along the optical module main bodies 12 and 62. Therefore, the optical module bodies 12, 6
Even after manufacturing 2 by resin sealing, external substrate 1
By adjusting the resistances by adjusting the volumes 44 and 66 on the optical modules 4 and 64, the electrical characteristics of the optical module bodies 12 and 62 can be adjusted. That is, the optical module 10 for transmission can adjust at least one of the optical output and the bias current, and the optical module 60 for reception can adjust the signal detection level. As a result, it is possible to provide an optical module that can quickly respond to changes in use conditions and external environment.

The volumes 44 and 66 are connected to the external board 1
4 and 64, and are fixed along the optical module bodies 12 and 62.
The size of the optical modules 10 and 60 can be reduced as compared with the case where the optical modules 10 and 60 are mounted and resin-sealed.

The optical module 1 according to the present embodiment
At 0 and 60, since the external substrates 14 and 64 are fixed along the optical module main bodies 12 and 62 in a positional relationship parallel to the component mounting surface 22a of the internal substrate 22, the width of the optical modules 10 and 60 is reduced. Thus, further miniaturization can be achieved. In particular, as described above, the optical modules 10 and 60 for transmission and reception form an optical link device 72 integrally, and by reducing the width of the optical modules 10 and 60 as described above, The size of the 72 itself can be reduced, and the effect is remarkable.

The optical module 1 according to the present embodiment
In 0 and 60, the second lead array 30 for electrically connecting the optical module bodies 12 and 62 to the external substrates 14 and 64 also functions as fixing means for fixing the external substrates 14 and 64. ing. Therefore, the structure can be simplified and the number of parts can be reduced.

The optical module 1 according to the present embodiment
0, 60, the upper sides 14a, 64 of the external substrates 14, 64
Since the recesses 46 and 65 are provided in a at positions corresponding to the respective positions of the lead pins constituting the second lead array 30, the lead pins constituting the second lead array 30 and the recesses 46 and 65 are abutted. External substrate 1
4, 64 positioning can be performed, and positioning accuracy can be improved. In particular, since a metal film is formed in the concave portions 46 and 65 and the concave portions 46 and 65 function as terminals for electrically connecting the optical module main bodies 12 and 62 and the external substrates 14 and 64, positioning is performed. By improving the accuracy, the optical module bodies 12, 62 and the external substrate 1
The reliability of the electrical connection between the 4,64 is increased.

In the method for manufacturing an optical module according to the present embodiment, the external substrate 1 is formed in the first and second preparation steps.
4, 64 and the resin sealing component 52 are prepared, the second lead array 30 of the resin sealing component 52 is bent toward the support protrusion 40 in the bending step, and then the support protrusion 40 and the second lead array are mounted in the fitting step. 30 and the external substrate 1
The external substrates 14 and 64 can be fixed to the resin sealing body 52 only by inserting the optical modules 4 and 64, and the optical modules 10 and 60 can be manufactured extremely efficiently.

In the method of manufacturing an optical module according to the present embodiment, especially when the external substrates 14 and 64 are fitted between the second lead array 30 and the support protrusions 40, first, the external substrate 14 , 64,
In the mounting step, the external substrates 14 and 64 can be sandwiched between the second lead array 30 and the support protrusions 40 by utilizing the elastic force of the second lead array 30. In addition, the external substrates 14 and 64 can be easily fixed to the resin sealing body 52.

[0053]

The optical module of the present invention has an external substrate on which a variable resistor for adjusting the electrical characteristics of the optical module main body is mounted in addition to the optical module main body. The external substrate is fixed along the optical module body by fixing means. Therefore, according to the present invention, it is possible to provide an optical module capable of adjusting the electrical characteristics of the optical module main body even after resin molding.
In addition, the area of the internal substrate can be reduced by an amount corresponding to the outside of the variable resistor, and the size of the optical module can be reduced.

Further, according to the method for manufacturing an optical module of the present invention, it is possible to provide a method for manufacturing the optical module of the present invention with high manufacturing efficiency.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing an optical module for transmission.

FIG. 2 is a perspective view showing an internal structure of an optical module for transmission.

FIG. 3 is a process diagram showing a manufacturing process of an optical module for transmission.

FIG. 4A is a perspective view showing a resin-sealed component, and FIG. 4B is a perspective view showing an external substrate.

FIG. 5 is a perspective view showing a state in which an external substrate is fixed to a transmission optical module main body.

FIG. 6 is a perspective view showing an optical module for reception.

FIG. 7 is an exploded perspective view showing the optical link device.

FIG. 8 is a perspective view showing an optical link device.

[Explanation of symbols]

10, 60: optical module, 11: resin body, 12, 62
... optical module body, 14, 64 ... external substrate, 16 ... first lead array, 18 ... optical element, 20 ... electronic element, 2
2 Internal board, 22a Component mounting surface, 23 Lead frame, 30 Second lead array, 30a Base, 30
b: bent portion, 40: support projection, 44, 66: volume, 46, 65: concave portion, 52: resin-sealed part.

Claims (9)

[Claims] 1. An optical element for converting any one signal between an optical signal and an electric signal to the other signal, an electronic element electrically connected to the optical element, and the electronic element mounted thereon. For sealing the optical element, the electronic element, the internal substrate, and the first lead array. An optical module main body having a resin body; an external board on which a variable resistor for adjusting electric characteristics of the optical module main body is mounted; and a fixing part for fixing the external substrate along the optical module main body. And an optical module. 2. The optical module according to claim 1, wherein the external substrate is fixed to a side surface of the optical module main body along the internal substrate. 3. The optical module main body further comprises: a second lead array extending from the inside of the optical module main body to the outside, and supporting one side of the external substrate; A support protrusion that supports another side of the external substrate facing one side,
The optical module according to claim 1, further comprising: 4. The first lead array extends along the component mounting surface of the internal substrate, the second lead array extends along a component mounting surface, a first portion extending along the component mounting surface, and a first portion extending along the component mounting surface. The optical module according to claim 3, further comprising: a second portion bent at a predetermined angle with respect to the portion. 5. The device according to claim 3, wherein a recess corresponding to each of the lead pins constituting the second lead array is provided on one side of the external substrate. Optical module. 6. The optical element according to claim 1, wherein the optical element is a light emitting element, and at least one of an optical output and a bias current can be adjusted by a variable resistor mounted on the external substrate. The optical module according to any one of the above. 7. The optical element according to claim 1, wherein the optical element is a light receiving element, and a signal detection level can be adjusted by a variable resistor mounted on the external substrate. An optical module as described. 8. A first preparing step for preparing an external substrate having one side and another side facing each other and having a variable resistor mounted thereon, and a first lead array and a second lead array. After mounting the internal substrate on which the electronic elements are mounted and the optical element on the lead frame including the optical element, the resin sealing is performed, and a support protrusion for supporting the other side of the external substrate is formed on the side surface to seal the resin. A second preparatory step for producing a stop part, a bending step of bending the second lead array by a predetermined angle, and fitting the external substrate between the bent second lead array and the support projection A method for manufacturing an optical module, comprising: a fitting step. 9. The method according to claim 1, wherein the first preparing step includes forming a concave portion on the one side of the external substrate so as to correspond to each of the lead pins constituting the second lead array. A locking step of locking the concave portion of the external substrate with respect to the bent second lead array; and a fulcrum supporting a locking portion between the second lead array and the concave portion of the external substrate. 9. A mounting step of mounting the other side of the external substrate on the support projection while utilizing the elastic force of the second lead array. Manufacturing method of optical module.