JP2013050497A - Optical communication module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an optical communication module in which light from a side of master board can be input/output, and which can be miniaturized, decreased in the number of components, and manufactured easily.SOLUTION: An optical communication module 11 is mounted on the surface of a circuit board 1 with reflow connection. The optical communication module 11 is mounted so as to conduct input/output of light from the side of the circuit board 1. The optical communication module 11 has a resin block 12. An electric circuit 13 is provided based on the resin block 12. Further, an electronic circuit 14, an optical coupling unit 15, and surface mounting terminals 16 and 17 are provided based on the resin block 12. In the optical communication module 11, a light transmission unit and a light receiving unit are integrated in a same module, so as to achieve miniaturization.

Description

  The present invention relates to an optical communication module in which a light emitting element and a light receiving element are mounted.

  For example, Patent Document 1 below discloses a technique related to an optical communication module. According to this disclosed technology, an optical communication module includes a light emitting side optical assembly having a casing, a light emitting element, and a lead pin, a light receiving side optical assembly having a casing, the light receiving element, and a lead pin, and a predetermined electric circuit. A rigid circuit board and a flexible circuit board (FPC) for electrically connecting the lead pins of the light emitting side optical assembly and the light receiving side optical assembly to the rigid circuit board are provided. The optical communication module includes a plurality of parts.

  The rigid circuit board is a so-called card edge board, and an edge connector for external connection is formed on an edge portion of the board. This edge connector is detachably connected to a card edge connector mounted on the parent board.

  Each lead pin and the flexible circuit board, and the rigid circuit board and the flexible circuit board are electrically connected by soldering. Each lead pin is placed in parallel on the electrode pad of the flexible circuit board, or is inserted into a through hole of the flexible circuit board and soldered. The flexible circuit board is assembled in a state of being bent into a substantially crank shape or a substantially L shape.

  The light-emitting side optical assembly and the light-receiving side optical assembly are assembled to the rigid circuit board in a state in which the spaces between the casings are maintained. The light-emitting side optical assembly and the light-receiving side optical assembly are assembled so that the optical axis is along the side of the rigid circuit board (direction along the side of the parent board). That is, the light-emitting side optical assembly and the light-receiving side optical assembly are assembled so that light can be input and output from the side.

JP 2009-252918 A

  However, the conventional optical communication module has a problem that the module size becomes large. Specifically, (1) the light-emitting side optical assembly and the light-receiving side optical assembly have a structure in which the light-emitting element and the light-receiving element are housed and mounted in separate casings, respectively. In this case, the module size becomes large. (2) Regarding the connection between the light-emitting side optical assembly and the light-receiving side optical assembly and the rigid circuit board, the structure requires a flexible circuit board. For example, the light-emitting side optical assembly and the light-receiving side optical assembly are connected to the rigid circuit board. On the other hand, there is a problem that the module size is increased by at least the amount of the flexible circuit board as compared with the case where it can be directly mounted.

  Further, the conventional optical communication module has a problem that the number of parts increases. Specifically, the configuration of the optical communication module includes a light-emitting side optical assembly, a light-receiving side optical assembly, a rigid circuit board, and a flexible circuit board, so that there is a problem that the number of components increases.

  For flexible circuit boards, the conventional optical communication module performs input and output of light from the side of the main board, so the light-emitting side optical assembly and the light-receiving side optical assembly are connected to the rigid circuit board. It is a necessary part to do. This contributes to an increase in the number of parts.

  Furthermore, the conventional optical communication module has a problem that the process becomes complicated. Specifically, apart from the steps related to the production of the light-emitting side optical assembly and the light-receiving side optical assembly, the steps related to the soldering of the light-emitting side optical assembly and the light-receiving side optical assembly and the rigid circuit board using a flexible circuit board. Therefore, when viewed as a whole, there is a problem that the process related to the production becomes complicated. The process is complicated by a large number of parts.

  Furthermore, the conventional optical communication module has a problem that reflow connection is difficult. Specifically, it is difficult to switch to reflow connection because it requires soldering using a flexible circuit board and requires connection at the card edge to the parent board. Has a point.

  Regarding electrical connection, it is important that adjacent electrical circuits are not made conductive by excess solder or the like. Since the conventional optical communication module has a large module size, it can be considered that the pitch of the electric circuit is simply narrowed when the size is reduced. In this case, there is a concern about the conduction. Further, if the pitch of the electric circuit is simply narrowed, the optical element module has an electric circuit related to the light emitting element and an electric circuit related to the light receiving element, which makes it difficult to suppress crosstalk.

  In addition, the above-described conventional optical communication module has a problem that a sufficient installation space must be secured. Specifically, since the connection at the card edge to the parent board is required, there is a possibility that the optical communication module may protrude greatly to the side of the parent board. For this reason, a sufficient installation space must be secured. It has the problem of not becoming.

  The present invention has been made in view of the above-described circumstances, and can input and output light from the side of the parent board, and can further reduce the size and the number of components. An object of the present invention is to provide an optical communication module that can be easily manufactured.

  The optical communication module of the present invention according to claim 1, which has been made to solve the above problems, is provided with an electric circuit having a plurality of circuit portions on a surface of a resin block having a plurality of surfaces, and an electronic component. An electronic circuit portion mounted and including a first circuit portion of the electrical circuit, an optical coupling portion mounting a light emitting element and a light receiving element and including a second circuit portion of the electrical circuit, and a surface with respect to a parent substrate A surface mounting terminal portion that is a mounting portion and includes a third circuit portion of the electric circuit, and further, the light axis of the light emitting element and the light receiving element is oriented along a side of the parent substrate. It is characterized by being mounted on.

  An optical communication module according to a second aspect of the present invention relates to the optical communication module according to the first aspect, wherein with respect to the plurality of surfaces of the resin block, an electrical connection surface with the parent substrate is a lower surface, On the opposite side of the lower surface, a surface that is substantially parallel to the parent substrate is an upper surface, a surface that is substantially perpendicular to the upper surface and the optical axis is a first side surface, and two surfaces that are substantially perpendicular to the first side surface and the upper surface. When the surface is the second side surface and the third side surface, the upper surface is provided with the electronic circuit portion, and the upper surface, the second side surface, and the lower surface are provided with the surface mounting terminal portion according to the light emitting element, In providing the surface coupling terminal portion related to the light receiving element over the upper surface, the third side surface, and the lower surface, providing the optical coupling portion over the upper surface and the first side surface, and providing the optical coupling portion From the side of the first side Characterized by mounting an optical element and the light receiving element.

  An optical communication module according to a third aspect of the present invention relates to the optical communication module according to the first aspect, wherein the electrical connection surface with the parent substrate is a lower surface with respect to the plurality of surfaces of the resin block. On the opposite side of the lower surface, a surface that is substantially parallel to the parent substrate is an upper surface, a surface that is substantially perpendicular to the upper surface and the optical axis is a first side surface, and two surfaces that are substantially perpendicular to the first side surface and the upper surface. When the surface is the second side surface and the third side surface, the upper surface is provided with the electronic circuit portion, and the upper surface, the second side surface, and the lower surface are provided with the surface mounting terminal portion according to the light emitting element, The surface mounting terminal portion related to the light receiving element is provided over the upper surface, the third side surface, and the lower surface, and the optical coupling portion is provided with a recess in the continuous portion over the upper surface and the first side surface. To provide the optical coupling part. What is characterized by mounting the light emitting element and the light receiving element from the side of the upper surface relative to said recess.

  An optical communication module according to a fourth aspect of the present invention relates to the optical communication module according to the second or third aspect, wherein the first side surface of the resin block has a common coupling portion for receiving and emitting light with respect to an optical coupling partner. Protruding portions are provided.

  An optical communication module according to a fifth aspect of the present invention relates to the optical communication module according to the second, third, or fourth aspect, wherein the resin block has a groove-like cavity recessed from the lower surface toward the upper surface. A portion is provided.

  An optical communication module according to a sixth aspect of the present invention relates to the optical communication module according to the second, third, fourth, or fifth aspect, and the lower surface of the resin block has the surface mounting terminal portion on the lower surface. A concave excess relief portion for the third circuit portion is provided.

  According to the present invention described in claim 1, since it has an electric circuit based on a resin block, and has an electronic circuit portion, an optical coupling portion, and a surface mounting terminal portion based on the resin block, There is an effect that an optical communication module having a one-part configuration can be provided. Further, according to the present invention, since the surface mounting terminal portion is provided, there is an effect that surface mounting can be performed on the parent substrate. Therefore, according to the present invention, there is an effect that the optical communication module can be reduced in size and the number of parts can be reduced, and the process can be simplified.

  According to the second aspect of the present invention, the electronic circuit portion is provided on the upper surface of the resin block on the basis of the resin block, and the light emitting element is applied to the upper surface, the second side surface, and the lower surface of the resin block. A surface mounting terminal portion is provided, a surface mounting terminal portion related to the light receiving element is provided over the upper surface, the third side surface, and the lower surface of the resin block, and an optical coupling portion is provided over the upper surface and the first side surface of the resin block. As a result, it is possible to provide an optical communication module having a one-component configuration having an electronic circuit portion, an optical coupling portion, and a surface mounting terminal portion based on the resin block. Therefore, according to the present invention, the optical communication module can be reduced in size and the number of parts can be reduced.

  Further, according to the present invention described in claim 2, since the light emitting element and the light receiving element are mounted from the first side surface side of the resin block in providing the optical coupling portion, mounting according to the electronic circuit portion, With respect to the mounting related to the optical coupling portion, there is an effect that it can be performed only by changing the direction of the resin block. Therefore, according to the present invention, it is possible to facilitate the production. Further, according to the present invention, since the surface mounting terminal portion is provided including the lower surface of the resin block, there is an effect that surface mounting can be performed on the parent substrate. Therefore, according to the present invention, it is possible to simplify the process. In addition, according to the present invention, since the surface mounting terminal portion related to the light emitting element and the surface mounting terminal portion related to the light receiving element are provided using different surfaces of the resin block, it is possible to suppress crosstalk. There is an effect.

  According to the third aspect of the present invention, the electronic circuit portion is provided on the upper surface of the resin block on the basis of the resin block, and the light emitting element is applied to the upper surface, the second side surface, and the lower surface of the resin block. A surface mounting terminal portion is provided, a surface mounting terminal portion related to the light receiving element is provided over the upper surface, the third side surface, and the lower surface of the resin block, and an optical coupling portion is provided over the upper surface and the first side surface of the resin block. As a result, it is possible to provide an optical communication module having a one-component configuration having an electronic circuit portion, an optical coupling portion, and a surface mounting terminal portion based on the resin block. Therefore, according to the present invention, the optical communication module can be reduced in size and the number of parts can be reduced.

  According to the third aspect of the present invention, when the optical coupling portion is provided, the concave portion is provided on the upper surface and the first side surface of the resin block, and the light emitting element and the light receiving element are formed on the concave portion from the upper surface side of the resin block. As a result, it is possible to perform mounting without changing the orientation of the resin block with respect to mounting related to the electronic circuit portion and mounting related to the optical coupling portion. That is, there is an effect that the mounting can be performed in one step. Therefore, according to the present invention, it is possible to facilitate the production. Further, according to the present invention, since the surface mounting terminal portion is provided including the lower surface of the resin block, there is an effect that surface mounting can be performed on the parent substrate. Therefore, according to the present invention, it is possible to simplify the process. In addition, according to the present invention, since the surface mounting terminal portion related to the light emitting element and the surface mounting terminal portion related to the light receiving element are provided using different surfaces of the resin block, it is possible to suppress crosstalk. There is an effect.

  According to the fourth aspect of the present invention, in addition to the effects of the second or third aspect, the following effects can be obtained. That is, since the protruding portion is provided, the optical coupling can be performed through the protruding portion. Since the protruding portion serves as a common coupling portion for receiving and emitting light, the optical communication module can be reduced in size.

  According to the present invention described in claim 5, since the groove-like cavity is provided in the resin block, there is an effect that the shape of the resin block itself can be made into a substantially U-shaped three-dimensional shape. Thereby, the thickness of the resin block can be made uniform, and there is an effect that “sinking” in resin molding can be prevented. Moreover, according to this invention, since the resin block is made into a substantially U-shaped three-dimensional shape, there is an effect that a resin block with high heat dissipation can be obtained. Further, according to the present invention, since the hollow portion is formed by making the resin block into a substantially U-shaped three-dimensional shape, there is an effect that the space generated by the hollow portion can be effectively used. Specifically, the space generated by the hollow portion can be used as a mounting space for components, thereby achieving the effect of reducing the size.

  According to the sixth aspect of the present invention, when the optical communication module is reduced in size, even if the pitch of the electric circuit is narrowed, conduction between the adjacent electric circuits due to solder or the like can be prevented. Play. Therefore, according to the present invention, it is possible to provide an optical communication module that is effective for downsizing and has high reliability.

It is a figure which concerns on the optical communication module of this invention, (a) And (b) is a schematic diagram which concerns on the mounting position of an optical communication module, (c) And (d) is a perspective view of an optical communication module. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of an optical communication module according to the present invention, which is an optical communication module surface-mounted on a parent substrate (Example 1). It is a perspective view of the optical communication module seen from the upper surface side of the resin block. It is a perspective view of the optical communication module seen from the lower surface side of the resin block. FIG. 9 is a perspective view according to a modification of the optical communication module in FIG. 2 (Example 2). It is a perspective view of the optical communication module before assembling a lens component. It is a figure which concerns on the optical communication module of this invention, and is a perspective view of the optical communication module as another example surface-mounted with respect to the parent board | substrate (Example 3). It is an expansion perspective view of an electronic circuit part. It is an expansion perspective view of an optical coupling part. It is an enlarged view of the excess relief part in the terminal part for surface mounting, (a) is a perspective view, (b) is a side view. It is the figure which utilized effectively the space which arises by a cavity part, (a) And (b) is a perspective view of an optical communication module. It is an enlarged view of the surplus relief part which becomes another example, (a) is a perspective view, (b) is a side view.

  The optical communication module of the present invention will be described with reference to FIG. In FIG. 1A, reference numeral 1 indicates a circuit board (parent board). As the circuit board 1, a glass epoxy board such as FR-4 is used. An optical communication module 11 (101) is mounted on the surface of the circuit board 1 by reflow connection (surface mounting: SMT (Surface mount technology)). The optical communication module 11 (101) is mounted in the vicinity of the edge 2 of the circuit board 1 in the case of FIG. In the case of FIG. 1B, the circuit board 1 is mounted at a desired position using the pigtail part 3.

  The optical communication module 11 (101) is mounted so that light can be input and output from the side of the circuit board 1. The side is assumed to coincide with the direction of the arrow P. The arrow P also coincides with the direction of the optical axis. The pigtail portion 3 includes a connector portion 4 that is a fitting portion with an optical coupling partner (not shown) and a pair of optical fiber portions 5.

  The optical communication module 11 (101) can be reduced in size and the number of parts as compared with the conventional example. In addition, the fabrication can be facilitated. Specifically, by adopting the optical communication module 11 as shown in FIG. 1C or the optical communication module 101 as shown in FIG. 1D, the size can be reduced. It has become. Each of the optical communication modules 11 and 101 has a single component configuration.

  In FIG. 1C, the optical communication module 11 has a resin block 12. The resin block 12 is provided with an electric circuit 13 based on this. The resin block 12 is provided with an electronic circuit portion 14, an optical coupling portion 15, and surface mounting terminal portions 16 and 17 based on the resin block 12. The optical communication module 11 is made smaller by integrating an optical transmitter (TX: Transmitter) and an optical receiver (Rx: Receiver) in the same module. The optical communication module 11 will be described in detail in the first and second embodiments.

  In FIG. 1D, the optical communication module 101 has a resin block 102. The resin block 102 is provided with an electric circuit 103 based on this. The resin block 102 is provided with an electronic circuit unit 104, an optical coupling unit 105, and surface mounting terminal units 106 and 107 based on the resin block 102. The optical communication module 101 is made smaller by integrating an optical transmitter (TX: Transmitter) and an optical receiver (Rx: Receiver) in the same module. The optical communication module 101 will be described in detail in the column of the third embodiment.

  Embodiment 1 will be described below with reference to the drawings. FIG. 2 is a perspective view of the optical communication module according to the present invention, which is surface-mounted on the parent substrate. 3 is a perspective view of the optical communication module viewed from the upper surface side of the resin block, and FIG. 4 is a perspective view of the optical communication module viewed from the lower surface side of the resin block.

  In the following description, specific shapes, materials, numerical values, directions, and the like are examples for facilitating the understanding of the present invention, and can be appropriately changed according to use, purpose, specifications, and the like. To do.

  In FIG. 2, an optical communication module 11 according to the present invention is mounted by reflow connection on the surface of a circuit board 1 as a parent board and in the vicinity of the edge 2. The optical communication module 11 has a resin block 12. The resin block 12 has a plurality of surfaces. Such a resin block 12 is provided with an electric circuit 13 based thereon. The electric circuit 13 has a plurality of circuit portions. The resin block 12 is provided with an electronic circuit portion 14, an optical coupling portion 15, and surface mounting terminal portions 16 and 17 based on the resin block 12. The optical communication module 11 is configured to be able to input and output light from the side of the circuit board 1.

  2 to 4, the resin block 12 is an injection molded product having a three-dimensional solid shape, and is formed in a substantially U shape in this embodiment. This shape is only an example. For example, when compared to a resin block having a rectangular parallelepiped shape, the substantially U-shaped three-dimensional shape makes the thickness uniform and prevents “sinking” in resin molding. Can do. For this reason, it is preferable to adopt the shape of this embodiment. The resin block 12 has insulating properties.

  The resin block 12 has a plurality of surfaces as described above. More specifically, the optical communication module 11 is mounted on the surface of the circuit board 1 so that the resin block 12 has a lower surface 18 as an electrical connection surface with the circuit board 1. Yes. In addition, the resin block 12 has an upper surface 19 as a surface that is substantially parallel to the circuit board 1 on the opposite side of the lower surface 18. The resin block 12 has a first side surface 20 as a surface that is substantially perpendicular to the upper surface 19, the lower surface 18, and the optical axis (coincident with the direction of the arrow P).

  The resin block 12 has a second side surface 21 and a third side surface 22 as two surfaces substantially perpendicular to the first side surface 20, the upper surface 19 and the lower surface 18. The resin block 12 has a fourth side surface 23 as a surface that is substantially perpendicular to the upper surface 19, the lower surface 18, the second side surface 21, and the third side surface 22 on the opposite side of the first side surface 20. The first side surface 20 may be referred to as the front surface, the second side surface 21 as the left side surface, the third side surface 22 as the right side surface, and the fourth side surface 23 as the rear surface.

  The resin block 12 is provided with a groove-like cavity 24 that is recessed from the lower surface 18 toward the upper surface 19. The resin block 12 is provided with a protruding portion 25 so that the first side surface 20 protrudes.

  The hollow portion 24 is an effective portion that makes the shape of the resin block 12 a substantially U-shaped three-dimensional shape. The hollow portion 24 is an effective portion for reducing the resin material as compared with the lump of resin. Further, the cavity 24 is an effective part that improves the heat dissipation of the resin block 12. Regarding the cavity 24, the optical communication module 11 may mount components such as a thermoelectric cooling element (TEC: Thermoelectric Cooler, peltier, etc.) 151 on the inner surface forming the cavity 24 (see FIG. 11).

  The protruding portion 25 is provided as a common coupling portion for light reception and emission with respect to an optical coupling partner (not shown). The protruding portion 25 is formed in the illustrated shape that protrudes along the side, in other words, along the optical axis (coincident with the direction of the arrow P). The protruding portion 25 is formed in a shape that matches the optical coupling partner (the illustrated shape is an example). The protruding portion 25 is formed as a portion capable of bringing a light emitting element 40 and a light receiving element 41, which will be described later, and an optical fiber end face (not shown) close to each other and capable of highly efficient optical coupling.

  Two protrusions are formed in the protruding portion 25. Specifically, a first concave portion 26 having a concave bottom surface continuous with the upper surface 19 and a second concave portion 27 that is substantially perpendicular to the first concave portion 26 and continuous are formed. The concave bottom surface of the second concave portion 27 is formed as a surface on which a light emitting element 40 and a light receiving element 41 described later are mounted. The concave bottom surface of the first concave portion 26 and the concave bottom surface of the second concave portion 27 are continuous with a chamfered portion 28 interposed therebetween. The chamfered portion 28 is formed as a portion for eliminating a steep (90 degrees) bending of a second circuit portion 36 to be described later and forming a circuit pattern corresponding to a high frequency.

  A guide pin hole 30 used for alignment with the optical coupling partner is formed in the protruding tip surface 29 of the protruding portion 25. The guide pin holes 30 are arranged and formed on both sides of the second recess 27. A guide pin (not shown) of the optical coupling partner is inserted into the guide pin hole 30. In the present embodiment, the guide pin hole 30 serves as a reference position when a light emitting element 40 and a light receiving element 41 described later are mounted on the bottom surface of the second recess 27.

  Several chamfered portions are formed in the resin block 12. Among these, the chamfered portion 31 of the continuous portion between the upper surface 19 and the second side surface 21, the chamfered portion 32 of the continuous portion of the upper surface 19 and the third side surface 22, and the continuous portion of the second side surface 21 and the lower surface 18. As with the chamfered portion 28, the chamfered portion 33 and the chamfered portion 34 that is a continuous portion of the third side surface 22 and the lower surface 18 eliminate the steep (90 degrees) bending of the circuit portion, and a circuit pattern corresponding to high frequencies. It is formed as a part for making.

  An electric circuit 13 having a plurality of circuit parts is provided on the surface of the resin block 12. The resin block 12 and the electric circuit 13 are three-dimensional circuit components formed by a three-dimensional circuit forming technique (MID: Molded Interconnect Devices). In this three-dimensional circuit component, the resin block 12 is a base member. The three-dimensional circuit formation technique (MID) is a known technique, and it is easy to provide a plurality of circuit portions as the electric circuit 13 on the surface of the resin block 12. The process relating to the production of the resin block 12 and the electric circuit 13 is good.

  Specifically describing the plurality of circuit portions of the electric circuit 13, the electric circuit 13 includes a first circuit portion 35, a second circuit portion 36, and third circuit portions 37 and 38.

  A plurality of first circuit portions 35 are provided on the upper surface 19 of the resin block 12 as circuit portions constituting the electronic circuit portion 14. Further, a plurality of second circuit portions 36 are provided as circuit portions constituting the optical coupling portion 15 over the upper surface 19 and the first side surface 20 of the resin block 12. Specifically, a plurality of the protrusions 25 are provided over the bottom surface of the first recess 26 and the bottom surface of the second recess 27. Further, a plurality of third circuit portions 37 are provided as circuit portions constituting the surface mounting terminal portion 16 over the upper surface 19, the second side surface 21, and the lower surface 18 of the resin block 12. The third circuit portion 38 is provided as a circuit portion constituting the surface mounting terminal portion 17 over the upper surface 19, the third side surface 22, and the lower surface 18 of the resin block 12.

  The third circuit portions 37 and 38 are formed so that the circuit portion corresponding to the lower surface 18 of the resin block 12 functions as a surface mounting pad. By forming on the lower surface 18 of the resin block 12, sufficient contact with the circuit board 1 as a parent substrate is ensured (no equipment or management for ensuring the accuracy of contact is required). . In addition, it is preferable that the lower surface 18 is provided with a concave excess relief portion (described in the third embodiment) with respect to the third circuit portions 37 and 38.

  The electronic circuit unit 14 is provided on the upper surface 19 of the resin block 12. The electronic circuit unit 14 includes a plurality of electronic components 39 and the first circuit portion 35. The electronic component 39 is a light emitting element driving IC, a receiving IC, or a chip component (L, C, R, etc.), which is not particularly shown, but is connected to a predetermined first circuit portion 35 with a bonding wire or the like. . Since the first circuit portion 35 is provided on the upper surface 19 of the flat resin block 12 and the upper surface 19 is a mounting surface, the plurality of electronic components 39 can be mounted by a known chip component mounting machine. It can be done. That is, the production can be automated, and the production process can be simplified.

  The optical coupling portion 15 is provided over the upper surface 19 and the first side surface 20 of the resin block 12. The optical coupling unit 15 includes a light emitting element 40 and a light receiving element 41, and the second circuit portion 36. Examples of the light emitting element 40 and the light receiving element 41 include, but are not limited to, a surface emitting laser, a light receiving element that receives light on the upper surface, and the like.

  The light emitting element 40 and the light receiving element 41 are mounted on the bottom surface of the second concave portion 27 so that the optical axis coincides with the direction of the arrow P. Known light emitting elements 40 and light receiving elements 41 are used. Since the light emitting element 40 and the light receiving element 41 are mounted on the bottom surface of the concave portion of the second concave portion 27, the light emitting device 40 and the light receiving element 41 are mounted at a position deeper than the protruding front end surface 29 of the protruding portion 25. Therefore, it is possible to prevent damage due to the contact with the optical coupling partner (not shown) (the contact with the ferrule or the like).

  The distance between the light emitting element 40 and the light receiving element 41 and the end face of the optical fiber (not shown) is adjusted by the amount of depression of the second recess 27. In addition, a lens, a fiber stub, etc. shall be mentioned other than the said optical fiber. Adjustment of the dent amount of the second recess 27 is effective in managing the gap distance.

  The light emitting element 40 and the light receiving element 41 can be mounted by a known chip component mounting machine by, for example, tilting the resin block 12 by 90 degrees after mounting a plurality of electronic components 39 in the electronic circuit unit 14. ing. That is, the production can be automated, and the production process can be simplified.

  In this embodiment, the light emitting element 40 and the light receiving element 41 are covered with a transparent resin protective material 42 and protected from humidity, dust, and the like. The resin protective material 42 is provided by molding or potting a transparent resin.

  As described above, a plurality of the second circuit portions 36 are provided on the upper surface 19 of the resin block 12, the bottom surface of the first recess 26 of the protruding portion 25, and the bottom surface of the second recess 27.

  The surface mounting terminal portion 16 is a portion related to the light emitting element 40, and is provided over the upper surface 19, the second side surface 21, and the lower surface 18 of the resin block 12. The surface mounting terminal portion 16 includes a third circuit portion 37. The surface mounting terminal portion 17 is a portion related to the light receiving element 41, and is provided over the upper surface 19, the third side surface 22, and the lower surface 18 of the resin block 12. The surface mounting terminal portion 17 includes a third circuit portion 38. If the mounting positions of the light emitting element 40 and the light receiving element 41 are reversed, the arrangement of the surface mounting terminal portion 16 and the surface mounting terminal portion 17 is also reversed.

  The surface mounting terminal portion 16 and the surface mounting terminal portion 17 are substantially leg-shaped portions, and the length of the legs is set in accordance with the optical coupling position with an optical coupling partner (not shown). The surface mounting terminal portion 16 and the surface mounting terminal portion 17 can be aligned with the optical fiber (not shown) by adjusting the length of the legs. Since the surface mounting terminal portion 16 and the surface mounting terminal portion 17 are arranged apart from each other, the third circuit portion 37 and the third circuit portion 38 are also arranged apart from each other. As a result, crosstalk (electrical) This is effective in suppressing signal transfer.

  In the above-described configuration and structure, the optical communication module 11 according to the present invention integrates the electronic circuit portion 14 and the optical coupling portion 15 with the resin block 12 as a base. Since a housing or the like is unnecessary, and the optical transmitter and the optical receiver are integrated in the same module, it is possible to reduce the size and the number of components.

  Moreover, since the optical communication module 11 according to the present invention is provided with the optical coupling portion 15 including the light emitting element 40 and the light receiving element 41 over the upper surface 19 and the first side surface 20 of the resin block 12, from the side as in the prior art. Light input / output.

  Further, the optical communication module 11 according to the present invention is provided with the optical coupling portion 15 over the upper surface 19 and the first side surface 20 of the resin block 12, thereby eliminating the need for a flexible circuit board, a lead pin, and the like that are conventionally required. be able to.

  In addition, the optical communication module 11 according to the present invention integrates the surface mounting terminal portion 16 and the surface mounting terminal portion 17 with the resin block 12 as a base, so that the optical circuit module 11 is optically coupled to the circuit board 1 as a parent substrate. The communication module 11 can be surface mounted.

  Further, since the optical communication module 11 according to the present invention is provided with a circuit portion functioning as a surface mounting pad on the flat lower surface 18 of the resin block 12, high-precision equipment and management for ensuring contact are unnecessary. Can be.

  In addition, the optical communication module 11 according to the present invention has a structure in which a plurality of electronic components 39, light emitting elements 40, and light receiving elements 41 are mounted on the plane of the resin block 12, and thus is mounted by a known chip component mounting machine. As a result, automation of production and simplification of the production process can be achieved.

  Moreover, since the optical communication module 11 according to the present invention uses the protruding portion 25 as a coupling portion common to light receiving and emitting, the protruding portion 25 can be an effective portion for reducing the size of the optical communication module 11.

  Further, the optical communication module 11 according to the present invention mounts the light emitting element 40 and the light receiving element 41 at a position deeper than the projecting tip surface 29 of the projecting portion 25, so that damage due to contact with an optical coupling partner (not shown) is caused. Can be prevented.

  Moreover, since the optical communication module 11 according to the present invention is provided with the second circuit portion 36 in the first concave portion 26 and the second concave portion 27 of the protruding portion 25, for example, connector fitting with an optical coupling partner (not shown). In this case, damage to the second circuit portion 36 can be prevented.

  Further, since the optical communication module 11 according to the present invention is arranged by separating the surface mounting terminal portion 16 and the surface mounting terminal portion 17 from each other, crosstalk between the optical transmitter and the optical receiver is suppressed. be able to.

  Moreover, since the optical communication module 11 according to the present invention can suppress crosstalk, the optical communication module 11 can be easily downsized.

  In addition, since the optical communication module 11 according to the present invention has the chamfered portions 28 and 31 to 34 in the resin block 12, it is possible to eliminate a steep (90 degrees) bending of the circuit portion and make a circuit pattern compatible with high frequency. it can.

  Further, since the optical communication module 11 according to the present invention is formed by resin molding the resin block 12 into a substantially U-shaped three-dimensional shape, “sink” can be prevented and the resin material to be used is also reduced. Furthermore, heat dissipation can be improved.

  Moreover, since the optical communication module 11 according to the present invention forms the cavity portion 24 by forming the resin block 12 into a substantially U-shaped three-dimensional shape, the space generated by the cavity portion 24 can be effectively used. Play.

  Embodiment 2 will be described below with reference to the drawings. FIG. 5 is a perspective view of a modification of the optical communication module according to the first embodiment. FIG. 6 is a perspective view of the optical communication module before the lens component is assembled. In addition, the same code | symbol shall be attached | subjected to the same component as the said Example 1, and detailed description shall be abbreviate | omitted.

  5 and 6, the optical communication module 51 of the second embodiment is different from the optical communication module 11 of the first embodiment in the following points. That is, the difference is that a lens component 52 is provided instead of the transparent resin protective material 42 (see FIGS. 2 and 4). The lens component 52 is provided in order to improve the optical coupling efficiency between the light emitting element 40 and the light receiving element 41 and an optical fiber (not shown).

  The lens component 52 is a transparent resin molded product, and includes a main body 53 that engages with the protruding tip surface 29 and the second concave portion 27 of the protruding portion 25, and a circuit protection portion that engages with the first concave portion 26 of the protruding portion 25. 54. In the main body 53, a pair of lenses 55 is formed at positions corresponding to the light emitting element 40 and the light receiving element 41. Further, a pair of guide pin holes 56 are formed in the main body 53. The guide pin hole 56 is disposed and formed so as to be continuous with the guide pin hole 30 of the protruding portion 25. The circuit protection part 54 is a substantially plate-like part, and is formed so as to cover the second circuit part 36 provided in the first recess 26.

  As described above, the optical communication module 51 according to the second embodiment naturally has the same effects as the optical communication module 11 according to the first embodiment. In addition, since the optical communication module 51 of the second embodiment includes the lens component 52, the optical coupling efficiency can be improved as described above.

  Embodiment 3 will be described below with reference to the drawings. FIG. 7 is a perspective view of an optical communication module according to another embodiment of the present invention, which is another example of surface mounting on a parent substrate. 8 is an enlarged perspective view of the electronic circuit portion, FIG. 9 is an enlarged perspective view of the optical coupling portion, and FIG. 10 is an enlarged view of the excess relief portion in the surface mounting terminal portion.

  In the following description, specific shapes, materials, numerical values, directions, and the like are examples for facilitating the understanding of the present invention, and can be appropriately changed according to use, purpose, specifications, and the like. To do.

  In FIG. 7, the optical communication module 101 according to the present invention is mounted by reflow connection on the surface of the circuit board 1 as a parent board and in the vicinity of the edge 2. The optical communication module 101 has a resin block 102. The resin block 102 has a plurality of surfaces. Such a resin block 102 is provided with an electric circuit 103 based on this. The electric circuit 103 has a plurality of circuit portions. The resin block 102 is provided with an electronic circuit unit 104, an optical coupling unit 105, and surface mounting terminal units 106 and 107 based on the resin block 102. The optical communication module 101 is configured to be able to input and output light from the side of the circuit board 1.

  The resin block 102 is an injection molded product having a three-dimensional solid shape, and is formed in a substantially U shape in the present embodiment. This shape is only an example. For example, when compared to a resin block having a rectangular parallelepiped shape, the substantially U-shaped three-dimensional shape makes the thickness uniform and prevents “sinking” in resin molding. Can do. For this reason, it is preferable to adopt the shape of this embodiment. The resin block 102 has insulating properties.

  The resin block 102 has a plurality of surfaces as described above. Specifically describing the plurality of surfaces, the optical communication module 101 is surface-mounted on the circuit board 1. Therefore, the resin block 102 has a lower surface 108 as an electrical connection surface with the circuit board 1. Yes. Further, the resin block 102 has an upper surface 109 as a surface substantially parallel to the circuit board 1 on the opposite side of the lower surface 108. The resin block 102 has a first side surface 110 as a surface that is substantially perpendicular to the upper surface 109, the lower surface 108, and the optical axis (coincident with the direction of the arrow P).

  The resin block 102 has a second side surface 111 and a third side surface 112 as two surfaces that are substantially perpendicular to the first side surface 110, the upper surface 109, and the lower surface 108. The resin block 102 has a fourth side surface 113 as a surface substantially perpendicular to the upper surface 109, the lower surface 108, the second side surface 111, and the third side surface 112 on the opposite side of the first side surface 110. The first side surface 110 may be referred to as the front surface, the second side surface 111 as the left side surface, the third side surface 112 as the right side surface, and the fourth side surface 113 as the rear surface.

  The resin block 102 is provided with a groove-like cavity 114 that is recessed from the lower surface 108 toward the upper surface 109. In addition, the resin block 102 is provided with a plurality of electronic component housing recesses 115 so that the upper surface 109 is recessed. Further, the resin block 102 is provided with a pair of element receiving recesses 116 (recesses) so as to recess the continuous portion of the upper surface 109 and the first side surface 110.

  The hollow portion 114 is an effective portion that makes the shape of the resin block 102 a substantially U-shaped three-dimensional shape. The cavity 114 is an effective part for reducing the resin material as compared with the resin lump. Furthermore, the cavity 114 is an effective part that improves the heat dissipation of the resin block 102. With regard to the cavity 114, the optical communication module 101 may mount components such as a thermoelectric cooling element (TEC: Thermoelectric Cooler, Peltier, etc.) 151 on the inner surface forming the cavity 114 (see FIG. 11).

  The electronic component housing recess 115 is formed as a recessed portion for housing an electronic component 126 described later of the electronic circuit unit 104. The element housing recess 116 is formed as a recessed portion that houses a light emitting element 128 and a light receiving element 129 described later of the optical coupling unit 105. The element accommodating recess 116 is formed as a recessed portion that opens on the upper surface 109 side and also opens on the first side surface 110 side.

  Several chamfered portions are formed in the resin block 102. Among these, the chamfered portion 117 of the continuous portion of the upper surface 109 and the second side surface 111, the chamfered portion 118 of the continuous portion of the upper surface 109 and the third side surface 112, and the continuous portion of the second side 111 and the lower surface 108. The chamfered portion 119 and the chamfered portion 120 which is a continuous portion of the third side surface 112 and the lower surface 108 eliminate a steep (90 degree) bending of a circuit portion described later of the electric circuit 103 and form a circuit pattern corresponding to a high frequency. It is formed as a part for.

  An electric circuit 103 having a plurality of circuit portions is provided on the surface of the resin block 102. The resin block 102 and the electric circuit 103 are three-dimensional circuit components formed by a three-dimensional circuit forming technique (MID: Molded Interconnect Devices). In this three-dimensional circuit component, the resin block 102 is a base member. The three-dimensional circuit formation technique (MID) is a known technique, and it is easy to provide a plurality of circuit portions as the electric circuit 103 on the surface of the resin block 102. The steps related to the production of the resin block 102 and the electric circuit 103 are good.

  Specifically, a plurality of circuit portions of the electric circuit 103 will be described. The electric circuit 103 includes a first circuit portion 121, a second circuit portion 122, and third circuit portions 123 and 124.

  A plurality of first circuit portions 121 are provided on the upper surface 109 of the resin block 102 as circuit portions constituting the electronic circuit unit 104. A plurality of second circuit portions 122 are provided on the upper surface 109 of the resin block 102 as circuit portions constituting the optical coupling portion 105. A plurality of third circuit portions 123 are provided as circuit portions constituting the surface mounting terminal portion 106 over the upper surface 109, the second side surface 111, and the lower surface 108 of the resin block 102. The third circuit portion 124 is provided as a circuit portion constituting the surface mounting terminal portion 107 over the upper surface 109, the third side surface 112, and the lower surface 108 of the resin block 102.

  The third circuit portions 123 and 124 are formed so that the circuit portion corresponding to the lower surface 108 of the resin block 102 functions as a surface mounting pad. By forming on the lower surface 108 of the resin block 102, sufficient contact with the circuit board 1 as the parent substrate is ensured (no equipment or management for ensuring the accuracy of contact is required). .

  A plurality of concave excess relief portions 125 (see FIG. 10) are provided on the lower surface 108 of the resin block 102. The surplus relief portion 125 is a portion that escapes surplus solder, Ag paste, and the like, and is formed and formed with a desired width on both sides of each circuit of the third circuit portions 123 and 124. The excess relief portion 125 is provided as a portion for preventing conduction between the circuits due to solder or the like. As long as the surplus escape portion 125 can escape the surplus, the shape, the arrangement, and the like are not particularly limited (other arrangement examples will be described later with reference to FIG. 12).

  7 and 8, the electronic circuit unit 104 is provided on the upper surface 109 of the resin block 102. The electronic circuit unit 104 includes a plurality of electronic components 126 and the first circuit portion 121. The electronic component 126 is a light emitting element driving IC, a receiving IC, or a chip component (L, C, R, etc.), and is connected to a predetermined first circuit portion 121 by a bonding wire 127. Since the bonding wire 127 in this embodiment accommodates the electronic component 126 in the electronic component accommodating recess 115, it is a transmission line that is shortened compared to the case where it is not accommodated. It is assumed that transmission characteristics can be improved and noise resistance can be improved by shortening the length.

  Since the plurality of electronic components 126 are mounted from the top surface 109 side of the resin block 12, they can be mounted by a known chip component mounting machine. That is, the production can be automated, and the production process can be simplified.

  The optical coupling portion 105 is provided over the upper surface 109 and the first side surface 110 of the resin block 102. The optical coupling unit 105 includes a light emitting element 128, a light receiving element 129, and the second circuit portion 122.

  The light emitting element 128 and the light receiving element 129 are mounted on the bottom surface of the element receiving recess 116 so that the optical axis thereof coincides with the direction of the arrow P. Known light emitting elements 128 and light receiving elements 129 are used. The light emitting element 128 and the light receiving element 129 can be aligned with the optical fiber (not shown) by adjusting the depth dimension Q of the element receiving recess 116 (adjustment of the depth dimension Q). Can simplify alignment with optical components (optical fiber, lens, fiber stub). The light emitting element 128 and the light receiving element 129 are accommodated in the element accommodating recess 116 so that an optical coupling partner (not shown) does not come into contact therewith. Although not particularly limited, examples of the light emitting element 128 and the light receiving element 129 include an edge emitting laser and a side light receiving type light receiving element.

  The light emitting element 128 and the light receiving element 129 are mounted simultaneously with a plurality of electronic components 126 in, for example, the electronic circuit unit 104 by a known chip component mounting machine. In this embodiment, the production can be automated, and the production process can be simplified.

  The surface mounting terminal portion 106 is a portion related to the light emitting element 128 and is provided over the upper surface 109, the second side surface 111, and the lower surface 108 of the resin block 102. The surface mounting terminal portion 106 includes a third circuit portion 123. Further, the surface mounting terminal portion 107 is a portion related to the light receiving element 129 and is provided over the upper surface 109, the third side surface 112, and the lower surface 108 of the resin block 102. The surface mounting terminal portion 107 includes a third circuit portion 124. If the mounting positions of the light emitting element 128 and the light receiving element 129 are reversed, the arrangement of the surface mounting terminal portion 106 and the surface mounting terminal portion 107 is also reversed.

  The surface mounting terminal portion 106 and the surface mounting terminal portion 107 are substantially leg-shaped portions, and the length of the legs is set in accordance with the optical coupling position with an optical coupling partner (not shown). The surface mounting terminal portion 106 and the surface mounting terminal portion 107 can be optically aligned with an optical fiber (not shown) by adjusting the length of the legs. Since the surface mounting terminal portion 106 and the surface mounting terminal portion 107 are arranged apart from each other, the third circuit portion 123 and the third circuit portion 124 are also arranged apart from each other. As a result, crosstalk (electrical) This is effective in suppressing signal transfer.

  In the above-described configuration and structure, the optical communication module 101 according to the present invention integrates the electronic circuit unit 104 and the optical coupling unit 105 on the basis of the resin block 102. Since a housing or the like is unnecessary, and the optical transmitter and the optical receiver are integrated in the same module, it is possible to reduce the size and the number of components.

  In addition, the optical communication module 101 according to the present invention is provided with the optical coupling portion 105 including the light emitting element 128 and the light receiving element 129 over the upper surface 109 and the first side surface 110 of the resin block 102, so that the optical communication module 101 from the side as in the prior art. Light input / output.

  Further, since the optical communication module 101 according to the present invention is provided with the optical coupling portion 105 over the upper surface 109 and the first side surface 110 of the resin block 102, the conventionally required flexible circuit board, lead pins, etc. are unnecessary. be able to.

  In addition, the optical communication module 101 according to the present invention has the surface mounting terminal portion 106 and the surface mounting terminal portion 107 integrated with each other on the basis of the resin block 102. The communication module 101 can be surface mounted.

  Further, since the optical communication module 101 according to the present invention is provided with the circuit portion functioning as a surface mounting pad on the flat lower surface 108 of the resin block 102, high-precision equipment and management for ensuring contact are unnecessary. Can be.

  Further, the optical communication module 101 according to the present invention has a structure in which a plurality of electronic components 126, light emitting elements 128, and light receiving elements 129 are mounted on the same surface of the resin block 102, so that it is mounted by a known chip component mounting machine. As a result, the production can be automated, the production process can be simplified, and the mounting cost can be reduced.

  In addition, since the optical communication module 101 according to the present invention mounts the light emitting element 128 and the light receiving element 129 in the element housing recess 116, it can prevent damage due to contact with an optical coupling partner (not shown).

  Further, since the optical communication module 101 according to the present invention is provided with the surface mounting terminal portion 106 and the surface mounting terminal portion 107 separated from each other, crosstalk between the optical transmitter and the optical receiver is suppressed. be able to.

  Moreover, since the optical communication module 101 according to the present invention can suppress crosstalk, the optical communication module 101 can be easily downsized.

  In addition, since the optical communication module 101 according to the present invention has the chamfered portions 117 to 120 in the resin block 102, it is possible to eliminate a steep (90 degrees) bending of the circuit portion and to make a circuit pattern corresponding to a high frequency.

  Further, since the optical communication module 101 according to the present invention is formed by resin-molding the resin block 102 into a substantially U-shaped three-dimensional shape, “sink” can be prevented and the resin material to be used is also reduced. Furthermore, heat dissipation can be improved.

  In addition, the optical communication module 101 according to the present invention has the resin block 102 formed into a substantially U-shaped three-dimensional shape to form the cavity 114, so that the space generated by the cavity 114 can be effectively used. Play.

  In addition, since the optical communication module 101 according to the present invention is provided with the excess relief portion 125 on the lower surface 108 of the resin block 102, even if the pitch of the electric circuit is reduced in order to reduce the size of the optical communication module 101, It is possible to prevent conduction between adjacent electric circuits due to solder or the like. Thereby, the optical communication module 101 with high reliability can be provided.

  The surplus relief part 125 may be changed as shown in FIG. In FIG. 12, the third circuit portion 152 disposed on the lower surface 108 of the resin block 102 is formed with an excessive relief portion 153 having a concave shape (groove shape). The excess relief portion 153 is formed as a portion for releasing excess solder, Ag paste, and the like. Therefore, when the optical communication module 101 is downsized, it is possible to prevent conduction between adjacent electric circuits due to solder or the like even if the pitch of the electric circuits is narrowed. Thereby, the optical communication module 101 with high reliability can be provided.

  In addition, the present invention can of course be modified in various ways within the scope not changing the gist of the present invention.

  P: Side (or direction of optical axis), 1 ... Circuit board (parent substrate), 2 ... Edge part, 3 ... Pigtail part, 4 ... Connector part, 5 ... Optical fiber part, 11 ... Optical communication module, 12 ... Resin block, 13 ... Electric circuit, 14 ... Electronic circuit part, 15 ... Optical coupling part, 16, 17 ... Surface mounting terminal part, 18 ... Lower surface, 19 ... Upper surface, 20 ... First side surface, 21 ... Second side surface, 22 ... 3rd side surface, 23 ... 4th side surface, 24 ... Cavity part, 25 ... Projection part, 26 ... 1st recessed part, 27 ... 2nd recessed part, 28 ... Chamfering part, 29 ... Projection front end surface, 30 ... Guide pin hole 31 to 34: chamfered portion, 35 ... first circuit portion, 36 ... second circuit portion, 37, 38 ... third circuit portion, 39 ... electronic component, 40 ... light emitting element, 41 ... light receiving element, 42 ... resin protection Material 51 ... Optical communication module 52 ... Lens component 53 ... Main body 54 ... Circuit protector 55 ... Lens 56 ... Guide pin hole 101 ... Optical communication module 102 ... Resin block 103 ... Electrical circuit 104 ... Electronic circuit unit 105 ... Optical 106, 107 ... surface mounting terminal, 108 ... lower surface, 109 ... upper surface, 110 ... first side surface, 111 ... second side surface, 112 ... third side surface, 113 ... fourth side surface, 114 ... hollow portion, DESCRIPTION OF SYMBOLS 115 ... Electronic component accommodation recessed part, 116 ... Element accommodation recessed part (concave part), 117-120 ... Chamfering part, 121 ... 1st circuit part, 122 ... 2nd circuit part, 123, 124 ... 3rd circuit part, 125 ... Excess relief 126: Electronic component 127: Bonding wire 128: Light emitting element 129: Light receiving element 151 ... Thermoelectric cooling element 152 ... third circuit part, 153 ... excess relief part

Claims (6)

An electric circuit having a plurality of circuit portions is provided on the surface of a resin block having a plurality of surfaces,
An electronic circuit portion on which electronic components are mounted and including a first circuit portion of the electric circuit; and an optical coupling portion on which a light emitting element and a light receiving element are mounted and including a second circuit portion of the electric circuit; A surface mounting terminal portion which is a surface mounting portion with respect to the parent substrate and includes a third circuit portion of the electric circuit,
Further, the optical communication module, wherein the light emitting element and the light receiving element are mounted such that the optical axis thereof is along the side of the parent substrate. The optical communication module according to claim 1,
Regarding the plurality of surfaces of the resin block, an electrical connection surface with the parent substrate is a lower surface, a surface that is substantially parallel to the parent substrate on the opposite side of the lower surface is an upper surface, and approximately the upper surface and the optical axis. When the surface that is perpendicular is the first side surface, and the two surfaces that are substantially perpendicular to the first side surface and the top surface are the second side surface and the third side surface,
The electronic circuit part is provided on the upper surface,
The surface mounting terminal portion according to the light emitting element is provided over the upper surface, the second side surface, and the lower surface,
The surface mounting terminal portion according to the light receiving element is provided over the upper surface, the third side surface, and the lower surface,
The optical coupling portion is provided over the upper surface and the first side surface,
In providing the optical coupling portion, the light emitting element and the light receiving element are mounted from the first side surface side. The optical communication module according to claim 1,
Regarding the plurality of surfaces of the resin block, an electrical connection surface with the parent substrate is a lower surface, a surface that is substantially parallel to the parent substrate on the opposite side of the lower surface is an upper surface, and approximately the upper surface and the optical axis. When the surface that is perpendicular is the first side surface, and the two surfaces that are substantially perpendicular to the first side surface and the top surface are the second side surface and the third side surface,
The electronic circuit part is provided on the upper surface,
The surface mounting terminal portion according to the light emitting element is provided over the upper surface, the second side surface, and the lower surface,
The surface mounting terminal portion according to the light receiving element is provided over the upper surface, the third side surface, and the lower surface,
The optical coupling portion is provided while providing a recess in the continuous portion over the upper surface and the first side surface,
In providing the optical coupling portion, the light emitting element and the light receiving element are mounted on the concave portion from the upper surface side. The optical communication module according to claim 2 or 3,
An optical communication module, wherein the first side surface of the resin block is provided with a protruding portion as a coupling portion common to light reception and emission with respect to an optical coupling partner. The optical communication module according to claim 2, 3, or 4,
An optical communication module, wherein the resin block is provided with a groove-like cavity that is recessed from the lower surface toward the upper surface. The optical communication module according to claim 2, 3, 4, or 5,
An optical communication module, wherein a concave excess relief portion for the third circuit portion of the surface mounting terminal portion is provided on the lower surface of the resin block.

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