JPH07294777A - Optical module - Google Patents

Abstract

PURPOSE:To provide an optical module capable of dealing with a higher speed in optical communication technology while simplifying production stages. CONSTITUTION:This optical module has a substrate 1 consisting of an insulating material which has a projecting part 11 on its one surface and is formed with a blind hole to be fitted with an optical operating element 3 and a sleeve 2 consisting of an insulating material which has a substrate joining part 22 to be fitted with the projecting part 11 in tight contact therewith on the surface opposite to the substrate l and is formed with a through-hole to be inserted with an optical fiber held by a ferrule 21. The optical axis of the optical operating element 3 positioned by being fitted into the blind hole and the optical axis of the optical fiber positioned by being inserted into the through-hole are aligned when the projecting part 11 is fitted into the substrate joining part 22.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical data link that uses light as an information transmission medium, an optical module used in an optical communication system such as an optical LAN, and a method of manufacturing the same.

[0002]

2. Description of the Related Art In recent years, attention has been paid to the application of optical communication technology to various communication systems in response to the demand for more sophisticated telecommunication networks and higher speed of information communication processing. In such optical communication technology, an optical module for transmitting and receiving optical signals is indispensable. Such optical modules include a transmitting module using a light emitting element such as a semiconductor laser as an optical actuating element and a receiving module using a light receiving element such as a pin photodiode as an optical actuating element.

The prior art of such an optical module is as follows. First, JP-A-59-16
In the optical module of Japanese Patent No. 389 (hereinafter, referred to as a first conventional technique), a receiving module chamber and a transmitting module chamber are provided on a ceramic substrate. An optical device such as a light emitting element or a light receiving element and an IC chip for driving are mounted in each of these module chambers. Further, each module chamber is hermetically sealed, and a glass window for inputting / outputting an optical signal of the optical device is provided. It is provided. The outside of the optical module thus formed is connected to the optical connector by plastic molding.

Separately from this, JP-A-57-177
In the optical module of Japanese Patent Laid-Open No. 580 (hereinafter, referred to as second prior art), an optical device and various drive ICs are provided on a lead frame, and a part of the lead frame is molded with an epoxy resin to form a first envelope. Vessel is formed. Then, the outside of the first envelope is molded with a conductive member to form a second envelope.
The enclosure is electrically shielded. The optical fiber is fitted into a sleeve provided on the second envelope.

Further, in Japanese Patent Application Laid-Open No. 5-304306 (hereinafter referred to as a third prior art), a recess for fitting an optical device to a silicon substrate is formed by anisotropic chemical etching, and the optical device is placed in this recess. The optical modules are aligned by fitting and the optical device is fixed to a substrate or the like with an adhesive to obtain an optical module. It should be noted that this is used not only for optical components but also for electrical components.

In addition to these, Japanese Patent Laid-Open No. 1-92
In the optical module of Japanese Patent No. 689 (hereinafter, referred to as the fourth conventional technique), an electronic circuit component is provided on the lead frame and a metallic optical connector is fixed by welding. An optical actuation element is fixed to this optical connector,
The optical fiber is optically coupled to the light actuating element via the optical connector.

[0007]

In the optical modules such as the above-mentioned first, second and third prior arts, it is difficult to align the optical axes of the optical actuating element and the optical fiber with high precision. Therefore, it is general that the light receiving surface of an optical device, particularly a light receiving element, is made large so that an optical signal from an optical fiber can easily enter the light receiving element. That is, regardless of the slight deviation of the position of the emitting surface of the optical fiber,
The light receiving surface is enlarged so that an optical signal is incident on the light receiving surface. However, if the light receiving surface is made larger in this way, the transmission speed becomes slower, and it becomes impossible to meet the demand for higher speed in optical communication technology and the like.

Therefore, in the optical module shown in the fourth prior art, it is conceivable to reduce the light receiving area to increase the transmission speed. However, if the light receiving area is reduced, it becomes difficult for the optical signal from the optical fiber to enter the light receiving surface. Therefore, accurate optical axis alignment between the optical fiber and the light receiving surface, that is, centering work is indispensable. Since this aligning work requires accuracy and is time consuming, there is a problem in that workability is poor, and a technique is required for the aligning work, resulting in an increase in assembly cost.

Further, for example, in the fourth prior art, when performing the centering work, it is required that the optical connector is firmly fixed to the lead frame. For this purpose, a metal material is used for the optical connector so that it can be easily welded to the lead frame. However, when a metal material is used, it is technically and economically disadvantageous to make a complicated shape. Big aspect.

After all, in the conventional optical module,
If the transmission speed is to be increased, alignment work is indispensable, the cost is increased, and the manufacturing process cannot be simplified.However, if the manufacturing process is simplified, the speed cannot be increased. It was

Therefore, it is an object of the present invention to provide an optical module and a method of manufacturing the same which can cope with speeding up in optical communication technology while simplifying the manufacturing process.

[0012]

In order to solve the above-mentioned problems, an optical module according to the present invention has a fitting section having a convex cross section on one surface and an optical module on the upper surface of the fitting section. A base plate made of an insulating material in which a bottomed hole into which the actuating element is fitted is formed, and a mating part having a concave cross section to be fitted into the fitting part is provided on a surface facing the substrate, and is held by a ferrule. A through hole into which the optical fiber is inserted is formed on the bottom surface of the fitted portion and is made of an insulating material.When the fitting portion is fitted into the fitted portion, the fitting hole is fitted into the bottomed hole. Characterized in that the bottomed hole and the through hole are positioned so that the optical axis of the light actuated element positioned by being aligned with the optical axis of the optical fiber positioned by being inserted into the through hole are aligned. To do.

It is desirable that a wiring pattern for connecting the light actuating element and an external terminal is formed on the surface of the substrate facing the sleeve. Further, a ground pattern is formed by metallization on a part of one surface of the substrate, and a shield pattern is formed by metallization on the surface of the sleeve facing the substrate, and the fitting portion is fitted into the fitted portion. Therefore, it is desirable that the ground pattern and the shield pattern are electrically connected. Further, it is desirable that a lens is attached to the substrate-side open end of the through hole of the sleeve.

[0014]

According to the above structure, the optical module substrate according to the present invention has the fitting portion having a convex cross section, and the fitting operation portion has an upper surface provided with a hole for providing the light actuating element. Therefore, the light actuating element can be provided at a fixed position of the fitting portion.

Further, the optical module sleeve according to the present invention has a fitted portion having a concave cross section to be fitted into the fitting portion of the optical module substrate, and the fitting portion is provided on the bottom surface of the fitted portion. Is provided with a hole having an optical axis that coincides with the optical axis of the light actuating element provided in. Therefore, by simply fitting the mating portion of the optical module sleeve and the mating portion of the optical module substrate in a concave-convex manner, the optical axis of the optical actuating element provided in the mating portion and the mating portion are provided. The optical axis of the hole can be matched.

Further, in the optical module according to the present invention, the ground pattern formed on the fitting portion and the shield pattern formed on the inner peripheral surface of the fitted portion are electrically connected to each other. Can be shielded enough.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Some embodiments of the present invention will be described below with reference to the accompanying drawings. The same elements are designated by the same reference numerals. In addition, the dimensional ratio of each portion in the drawings does not necessarily match the actual dimensional ratio, and the same applies to the area.

The configuration of the optical module according to the first embodiment of the present invention will be described with reference to FIGS. 1, 2 and 3.
As shown in FIG. 1, an optical module according to the present embodiment includes a substrate 1 having a rectangular cross-section with an upper surface and a lower surface both having a convex portion 11 in the center, and a sleeve 2 opposed to and coupled to the substrate 1. Equipped with. The outer edge size of the sleeve 2 is the substrate 1
A substrate joint portion 22 having a concave cross section whose inner edge size matches the size of the convex portion 11 of the substrate 1,
The ferrule joining portion 21 has an opening (through hole) coaxially with which a ferrule (not shown) holding an optical fiber is inserted.

Therefore, the substrate bonding portion 22 of the sleeve 2 is
The concave portion and the convex portion 11 of the substrate 1 are fitted to each other so that they can be integrated. A ground pattern 13 for grounding is formed on the side wall surface of the convex portion 11 of the substrate 1 by metal plating or the like, while the substrate joint portion 2 of the sleeve 2 is formed.
A shield pattern (not shown) is provided on the sidewall of the concave inner surface of 2.
Are metallized, and the substrate 1 and the sleeve 2 are hermetically sealed with an adhesive such as a conductive resin. Sleeve 2
The cylindrical ferrule joint portion 21 is provided with a hollow through hole 23 having a circular cross section into which the ferrule is inserted.
This central axis coincides with the optical axis of the light actuating element (light emitting element, light receiving element) 3 mounted on the convex portion 11 of the substrate 1.
The substrate 1 and the sleeve 2 are made of plastics such as liquid crystal polymer. As a material for forming the substrate 1 and the sleeve 2, PEEK (poly ether ether ketone), PPS (polyphenylene sulfide), or the like can be used in addition to the above.

As shown in FIG. 2, a wiring pattern 8 made of a conductive material such as metal is formed on the surface of the substrate 1, particularly on the upper and side surfaces of the convex portion 11 and on the upper surface of the step portion 12 which is lowered by one step. . The ground pattern 1 is provided on the side surface of the convex portion 11.
3 is formed and can electrically contact with the shield pattern formed on the inner peripheral surface of the substrate joint portion 22 in the fitted state of the sleeve 2 and the substrate 1, and the electronic circuit of the optical module and the light actuating element can be connected to the outside. Make an electrical shield between.

Further, the upper surface of the convex portion 11 has five bottomed holes 14a, 14b, 14c, 1 having rectangular openings.
4d and 14e are opened. These bottomed holes 14a
The widths, the lengths, and the depths of 14e to 14e are determined according to the shapes of the optical actuating element, the semiconductor chip, the capacitor chip, and the like to be fitted therein, and are provided in the respective dimensions. Various chip-type electronic components are immersed and installed in the respective portions of the bottomed holes 14a to 14e.

Specifically, the light actuating element 3 such as a semiconductor laser diode or a pin photodiode is immersed in the bottomed hole 14a, and the semiconductor I is placed in the bottomed holes 14b and 14c.
C chips 5a and 5b are inserted and bottomed holes 14d and 14e
The chip capacitors 4a and 4b are to be inserted into this. The light actuating element 3 may be an LED (light emitting diode), an avalanche photodiode, or the like. Therefore, the optical module of this embodiment has the light emitting element 3
In the case of incorporating the semiconductor IC chips 5a and 5b, a drive circuit is configured to form an optical transmission module. When the light receiving element is incorporated, the semiconductor IC chips 5a and 5b are configured to include a reception amplification circuit and the like to perform optical reception. Become a module.

A ground electrode for earthing and a lead electrode for inputting / outputting an electric signal may be provided on the inner peripheral surface and the bottom surface of each of the bottomed holes 14a to 14e by metallization or the like. The electrical connection between the ground electrode and the ground pattern 13 on the side surface of the convex portion 11 and the electrical connection between the lead electrode and the wiring pattern 8 on the upper surface of the convex portion 11 are performed by a bonding wire (not shown). No.) and may be connected by a metal pattern. The electrode pads of the semiconductor IC chips 5a and 5b and the wiring pattern 8 on the upper surface of the convex portion 11 may be connected by a bonding wire.

As shown in FIG. 3, the sleeve 2 is a substantially rectangular parallelepiped-shaped substrate joining portion 22 having a recess on the bottom side, and a cylindrical ferrule joining portion 21 integrated on the upper surface side of the substrate joining portion 22. Consists of. The inner surface dimension of the concave portion and the outer dimension of the convex portion 11 are formed so that the concave portion of the bottom surface of the substrate bonding portion 22 fits with the convex portion 11 of the substrate 1. The through hole 23 provided in the ferrule joint portion 21 penetrates the substrate joint portion 22 and communicates with the inner peripheral surface of the recess.

The lens 6 is fixed to the opening end of the through hole 23 on the concave side, and when the substrate 1 and the sleeve 2 are joined together, the central axis of the through hole 23 (that is, the lens 6 is attached to the through hole 23 through the ferrule). Optical fiber) and the substrate 1
It is formed so that the optical axis of the light actuating element 3 provided on the optical disc may be aligned via the lens 6. Although a spherical lens can be used as the lens 6, a convex lens, a SELFOC lens, or the like can be used instead. Further, the lens 6 may be fixed to the through hole 23 by press fitting or adhesive.

A surface 24, which is the side surface of the concave portion of the board bonding portion 22 and is in contact with the ground pattern 13 of the convex portion 11 of the substrate 1.
A shield pattern (not shown) is formed by metallization. The shield pattern is not limited to the contact surface with the ground pattern 13 and may be metallized on the entire inner surface including the bottom surface of the recess.

When a conductive adhesive is used to bond and seal the substrate 1 and the sleeve 2 or when the shield pattern is metallized on the entire concave inner peripheral surface of the substrate joint portion 22, FIG. The short-circuit prevention processing of the substrate 1 as shown in (1) is performed so that the shield pattern and the wiring pattern (a) formed on the substrate 1 are not short-circuited. That is, as shown in FIG. 4A, a groove 8a corresponding to the wiring pattern 8 is formed on the substrate 1, and a metal layer 8b as a wiring is formed in the groove 8a as shown in FIG. 4B. After the formation, as shown in FIG. 4C, the metal layer 8b is covered with an insulating layer 8c such as a resin to prevent a short circuit. The resin used at this time includes epoxy resin, acrylic resin and the like.

In order to prevent a short circuit, as shown in FIG. 5 (a), depending on the mode of the shield pattern formed on the substrate joint portion 22 (whether the inner peripheral surface of the concave portion is entirely covered or only the side surface thereof is covered). The entire wiring may be covered with resin,
Further, as shown in FIG. 5B, only the necessary wiring may be covered with resin. In FIG. 5A, the convex portion 1 of the substrate 1
A groove corresponding to the wiring pattern 8 is formed on the side surface and the upper surface of the insulating layer 1, and the metal layer 8b is formed on the bottom surface of the groove.
Covered with c. In FIG. 5B, the above-mentioned short-circuit prevention processing is performed only on the side surface of the convex portion 11 of the substrate 1, and the wiring pattern 8 is formed by metallization on the upper surface of the convex portion 11 without forming a groove.

Next, the operation of the optical module according to the first embodiment will be described. In the optical module according to the first embodiment, the bottomed holes 14a, 14 formed in the convex portion 11 of the substrate 1 are formed.
b, 14c, 14d, and 14e are photo-actuators, semiconductors I
The width, length, and depth are determined according to the size of the C chip or the chip type electronic component, and they are provided in the respective dimensions. Therefore, these are fixed positions by being fitted into the bottomed holes 14a to 14e. Fixed to.

Further, the bottom surface of the substrate joint portion 22 of the sleeve 2 is formed in a concave shape having a size to fit with the convex portion 11 of the substrate 1, and the substrate joint portion 22 formed in the concave shape has
A ferrule joint portion 21 having a through hole 23 is integrally provided. Therefore, on the other hand, the outer edge of the convex portion 11 and the bottomed hole 14 for installing the light actuating element 3 on the upper surface of the convex portion 11 are provided.
The outer edge of a is accurately aligned and the substrate 1 is molded, and on the other hand, the inner edge of the recess of the substrate bonding portion 22 and the through hole 2 are formed.
If the inner surface of 3 is accurately aligned and the sleeve 2 is molded, the board joining portion 22 of the sleeve 2 and the convex portion 11 of the board 1 are simply fitted together, and the sleeve 2 is fitted into the bottomed hole 14a. The optical axis of the light actuating element 3 and the optical axis of an optical fiber (not shown) held by a ferrule (not shown) provided in the through hole 23 are set to the lens 6 set at the open end of the through hole 23. Can be matched accurately via.

Further, in the optical module according to this embodiment, the ground pattern 13 formed on the side surface of the convex portion 11 of the substrate 1 and the shield pattern formed on the inner peripheral surface of the concave portion of the substrate bonding portion 22 are provided. Because it is electrically connected,
Along with strengthening around the ground, it is possible to provide a sufficient electrical shield.

From the above, according to the present embodiment, the optical axes can be made to coincide with each other only by fitting the substrate joining portion 22 of the sleeve 2 and the convex portion 11 of the substrate 1, so that the alignment accuracy can be improved. Therefore, it is possible to cope with speeding up of signal transmission in optical communication technology. Further, since no special alignment work is required, a low cost optical module can be provided. Further, since it is electrically sufficiently shielded, it can be made excellent in noise resistance.

Next, a method of manufacturing the optical module according to the first embodiment will be described. First, as the substrate 1, a circuit (wiring pattern) is formed by plating a molded product of polyplastics.
As a kind of three-dimensional circuit board capable of forming a structure, an MID (Molded Interconnection Device), which has recently received attention, is used. MID not only for substrate 1 but also for sleeve 2
However, since the sleeve 2 does not require a wiring pattern, other molded products may be used. There are a one-shot molding method and a two-shot molding method as means for obtaining the MID by plastic-molding the substrate 1 and the sleeve 2, but the former allows higher density wiring, and the latter has a degree of freedom of three-dimensional wiring. high. Of course, when the convex portion 11 of the substrate 1 and the substrate joint portion 22 of the sleeve 2 are fitted to each other, the bottomed hole 14a in which the light actuating element 3 is provided and the through hole 23 of the ferrule holding portion 21 provided in the sleeve 2 are provided. Design in advance so that the center of the image matches.

As described above, the cost can be reduced by using the plastic molded product such as MID as compared with the case of using the metal parts. A liquid crystal polymer (LCP) or the like is used for the MID, but other engineering plastics are also possible, and ceramics can be used for molding.

Then, the substrate 1 is metallized to form the wiring pattern 8 and the ground pattern 13 on the surface thereof. Further, similarly, a necessary surface of the inner peripheral surface of the concave portion of the substrate bonding portion 22 of the sleeve 2 is metallized to form a shield pattern. In this case, the short-circuit prevention process described above is performed as necessary.

Next, the bottomed holes 14a to 14a provided in the substrate 1
14e, an optical actuating element 3 such as a pin photodiode chip, a semiconductor IC chip 5a for signal processing,
5b and chip capacitors 4a and 4b are provided, respectively. At this time, each chip-type element has each bottomed hole 14a-14
It is fixed to e with an adhesive. At this time, various adhesives such as epoxy can be used as the adhesive, and a thermosetting type or an ultraviolet curing type can be used. Since the substrate 1 is made of plastic and has elasticity, the inner diameter of each of the bottomed holes 14a to 14e should be smaller than the outer diameter of each element to be fitted therein. Alternatively, each device may be press-fitted into each bottomed hole 14a to 14e and fixed by friction between the inner peripheral surface of each bottomed hole 14a to 14e and the side surface of each device.

Further, each device is provided in each bottomed hole 14a-14e,
In particular, when installing the light actuating element 3, the following points should be noted. That is, as already shown, the optical axis of the light actuating element 3 and the optical axis of the lens 6 and the optical fiber provided on the sleeve 2 must match. To achieve this, what is required of the bottomed hole 14a is an accurate positioning method of the light actuating element 3, which mainly includes the following. That is, first, as a first method, there is a method of positioning by simply fitting as shown in FIG. 6, and as a second method, as shown in FIG. There is a method of performing a positioning by applying a load to the element 3, and a third method is a method of pressing each element against a reference portion by using a taper member as shown in FIG. Each of these structures will be specifically described below.

(1) A method of positioning by simply fitting (first method: FIG. 6). FIG. 6A is an explanatory view of the bottomed hole 14a seen from the upper surface, and FIG. 6B is a bottomed hole 14b.
FIG. 6C is a cross-sectional view as seen from the side, and FIG.
It is sectional drawing which looked at the state which installed the light actuating element 3 in c from the side surface. As shown in FIG. 6, the inner peripheral dimension of the bottomed hole 14a is formed to be substantially equal to the outer diameter dimension of the light actuating element 3 to be fitted therein, and the light actuating element 3 is fitted into the bottomed hole 14a. Positioning is performed by inserting. Therefore, the bottomed hole 14
a is a substrate 1 and a sleeve 2 which are accurately formed so that the optical axis of the light actuating element 3 and the optical axis of the lens 6 and the optical fiber coincide with each other when the light actuating element 3 is fitted. .
It should be noted that the bottomed hole 14a is formed on the optical axis of the light actuating element 3 and the lens 6
Since it suffices to perform positioning with respect to the optical axis of, the depth is not particularly limited, and the light actuating element 3 is not limited.
The bottomed hole 14a may be shallower than the thickness of.

(2) A method in which a reference portion is provided and positioning is performed by its own weight or load (second method: FIG. 7). FIG. 7A is an explanatory view of the bottomed hole 14a as viewed from above,
7B is a cross-sectional view of the bottomed hole 14a viewed from the side, and FIG. 7C is a cross-sectional view of the state where the light actuating element 3 is installed in the bottomed hole 14a viewed from the side. As shown in FIG. 7, two sides of the bottomed hole 14a which are orthogonal to each other are sloped, and a projecting reference portion 15 is provided on the other two sides, and the weight or load of the reference portion 15 and the light actuating element is used. It is a method of installing. That is, this means that the light actuating element 3 is provided with a bottomed hole 14a.
When placed on the
Alternatively, by applying a constant weight, the bottomed hole 14a
Positioning is carried out by sliding the sloped surface of the device and abutting the light actuating element 3 on the reference portion 15. Therefore, bottomed hole 1
Reference numeral 4a forms the reference portion 15 so that the optical axis of the light operating element 3 and the optical axis of the lens 6 coincide with each other when the light operating element 3 abuts on the reference portion 15.

(3) A method of positioning each device by pressing each device against a reference portion using a taper member (third method: FIG. 8). 8A is an explanatory view of the bottomed hole 14a viewed from the top, FIG. 8B is a cross-sectional view of the bottomed hole 14b viewed from the side, and FIG. It is sectional drawing which looked at the state which installed the actuation element 3 from the side surface. Figure 8
As shown in, the inner circumference of the bottomed hole 14a is formed larger than the outer diameter of the light actuating element 3 provided therein, and the reference portions 15 are provided on two sides orthogonal to each other. The light actuating element 3 is provided with a bottomed hole 14a by the taper member 7.
Positioning is performed by abutting on the. Therefore, the bottomed hole 14a forms the reference portion 15 so that the optical axis of the light operating element 3 and the optical axis of the lens 6 coincide with each other when the light operating element 3 abuts on the reference portion 15.

When an electrode is provided on the back surface of the photo-actuator or other semiconductor device, a reference portion as shown in FIG. 7 is provided and the weight of the photo-actuator is used for positioning. The third method of positioning by pressing each device against the reference portion using a taper member as shown in FIG. 8 is more effective than the second method of performing. In the second method,
This is because the electrode provided on the back surface of the light actuating element or the like may not come into contact with the wiring (pad electrode or the like) provided in the bottomed hole, whereas the third method allows reliable connection.

Next, an optical module according to the second embodiment will be described with reference to FIG. This is different from the optical module according to the first embodiment, as is apparent from FIGS. 1 and 9, in which the shape of the substrate and the shape of the sleeve fitting portion are rectangular in the first embodiment. In the embodiment, it is a circular point. There are no particular differences in other points. That is, both the substrate 310 and the sleeve 320 are made of MID or the like, and the light actuating element is immersed in the bottomed hole of the substrate 31. The wiring is formed by metallization. The manufacturing process is also shown in FIG.
As shown in (a), this is common to the first embodiment, and is performed by fitting the substrate joint portion 322 of the sleeve 320 into the convex portion 311 of the plastic-molded substrate 310. In addition,
9B is an overall perspective view of the optical module according to the second embodiment, and FIG. 9C is a sectional perspective view of the sleeve 320 cut.

Next, an optical module according to the third embodiment will be described with reference to FIG. This differs from the optical module according to the first embodiment in that the number of the convex portions 11 provided on the substrate 1 is one in the first embodiment, whereas the convex portion provided on the substrate 410 is the third embodiment. The number of 411 is two, and accordingly, in the third embodiment, the substrate 41
The point is that the number of sleeves 420 that fit with the convex portions 411 of 0 is two. Therefore, in the optical module according to the third embodiment, a light receiving element is provided on one convex portion 411 provided on the substrate 410, and a light emitting element is provided on the other convex portion 411, so that the optical transmitting and receiving module can be obtained. it can. Also,
Only one of the light emitting element and the light receiving element may be provided on both convex portions 411.

In the same manner as the first embodiment, in the third embodiment as well, the substrate joint portion 422 of the sleeve 420 is fitted to the convex portion 411 of the plastic substrate 410 as shown in FIGS. 10A and 10B. Do it together. At this time, since two concave portions are formed in the board bonding portion 22, forming a shield pattern on the inner surface has an effect of preventing mutual crosstalk in the transmission / reception module.

Next, an optical module according to the fourth embodiment will be described with reference to FIG. This differs from the optical module according to the first embodiment in that one substrate joint 522 has two
The point is that two ferrules 521 are provided and a sleeve 520 is formed.

FIG. 11A is an overall perspective view of the optical module according to the fourth embodiment, and FIGS.
(D) shows the convex portions 511a, 511b of the substrate 510,
It is a partial cross-section perspective view which showed various variations about the shape of the bottom surface of 511c and the sleeve 520. In FIG. 11B, the substrate 5 provided with two protrusions 511a is provided.
10 shows an optical module consisting of 10 and a sleeve 520 having a substrate joint 522 having a bottom face provided with one horizontally long concave part that fits with both of these two convex parts 511a.

In FIG. 11C, one horizontally long convex portion 51 is formed.
There is shown an optical module including a substrate 510 provided with 1b and a sleeve 520 having a substrate joining portion 522 provided on the bottom surface with one laterally long concave portion that fits with the convex portion 511b.

In FIG. 11 (d), there is a substrate 510 provided with two convex portions 511c, and a substrate joining portion 522 having two concave portions fitted on the bottom surface, which are fitted into the respective convex portions 511c. An optical module comprising a sleeve 520 is shown. Of the positions corresponding to the openings of the two ferrules 521a, b, c on the protrusions 511a, b, c shown in FIGS. 11 (b), (c), and (d), respectively. When the light emitting element is provided on one side and the light receiving element is provided on the other side, these optical modules become optical transmitting and receiving modules. Further, only one of the light emitting element and the light receiving element may be provided at any position corresponding to the opening of the ferrule.

In any case, two ferrules 521
Since a, b, and c can be integrated by the single board | substrate joining part 522, the positioning by fitting can be performed easily.

As described above, the number and shape of the convex portions provided on the substrate 510 have various forms as shown in FIGS. 11B and 11C, and other than those shown in FIG. However, it is not particularly limited. In addition, the shape of the bottom surface of the substrate bonding portion 522 is also shown in FIG.
(B), there are various forms as shown in FIG. 11 (d),
There is no particular limitation other than that shown in FIG.

The optical module shown in this embodiment is
It can be used for both a single-core module and a multi-core connector (including both a sleeve separation type and a sleeve integrated type), and is not limited to either one.

Further, as in the fifth embodiment shown in FIG. 12, a plurality of linear projections 625 are provided on the inner side surface of the sleeve 620, and the tips of the linear projections 625 are brought into contact with the side surfaces of the convex portion of the substrate to fit the two. You may let me. In this case, the inner side surface of the sleeve 620 can be prevented from contacting the wiring pattern metalized on the side wall of the convex portion of the substrate.

[0053]

As described above in detail, according to the present invention, the fitting portion of the optical module sleeve and the fitting portion of the optical module substrate are simply fitted to provide the fitting portion. Since the optical axis of the optical actuating element provided and the optical axis of the hole provided in the fitted portion can be made to coincide with each other, it is possible to cope with speeding up in optical communication technology without requiring alignment work. It is possible to provide an optical module that can be manufactured at low cost. In addition, it is possible to obtain an excellent noise resistance by electrically sufficiently shielding.

[Brief description of drawings]

FIG. 1 is an exploded perspective view, partly in section, showing an optical module according to a first embodiment of the present invention.

FIG. 2 is an assembled perspective view showing a substrate used in the optical module according to the first embodiment of the present invention.

FIG. 3 is a sectional perspective view showing a sleeve portion used in the optical module according to the first embodiment of the present invention.

FIG. 4 is a perspective view showing a contact prevention structure for wiring of a substrate used in the optical module according to the present invention.

FIG. 5 is a perspective view showing a contact prevention structure for wiring of a substrate used in the optical module according to the present invention.

FIG. 6 is an explanatory diagram illustrating a positioning method when providing a light actuating element or another semiconductor device in a bottomed hole of a substrate.

FIG. 7 is an explanatory diagram illustrating a positioning method when providing a photo-actuator or another semiconductor device in a bottomed hole of a substrate.

FIG. 8 is an explanatory diagram illustrating a positioning method when providing a light actuating element or another semiconductor device in a bottomed hole of a substrate.

FIG. 9 is a perspective view showing an optical module according to a second embodiment of the present invention.

FIG. 10 is a perspective view showing an optical module according to a third embodiment of the present invention.

FIG. 11 is a perspective view showing an optical module according to a fourth embodiment of the present invention.

FIG. 12 is a perspective view showing an optical module sleeve according to a fifth embodiment of the present invention.

[Explanation of symbols]

1, 310, 410, 510 ... Substrate, 2, 320, 42
0 ... Sleeve, 3 ... Optical actuation element, 11, 311, 511
a, 511b, 511c ... Convex portion, 14a, 14b, 14
c, 14d, 14e ... bottomed hole, 21 ... ferrule joint part, 22, 322, 522 ... substrate joint part, 23 ... through hole

Claims (4)

[Claims] 1. A substrate made of an insulating material, having a fitting portion having a convex cross-section on one surface, and having a bottomed hole into which an optical actuating element is fitted is formed on the upper surface of the fitting portion. , A mating portion having a concave cross section to be fitted into the mating portion on a surface facing the substrate, and a through hole into which the optical fiber held by a ferrule is inserted is formed on the bottom surface of the mating portion. An optical axis of the light actuating element, which is positioned by being fitted into the bottomed hole when the fitting portion is fitted into the fitted portion; An optical module, wherein the bottomed hole and the through hole are positioned so that the optical axis of the optical fiber positioned by being inserted into the through hole is aligned. 2. The optical module according to claim 1, wherein a wiring pattern for connecting the light actuating element and an external terminal is formed on a surface of the substrate facing the sleeve. 3. A ground pattern is formed by metallization on a part of one surface of the substrate, and a shield pattern is formed by metallization on a surface of the sleeve facing the substrate. The optical module according to claim 1, wherein the optical module is fitted into the fitted portion to electrically connect the ground pattern and the shield pattern. 4. The optical module according to claim 1, wherein a lens is attached to an opening end of the through hole of the sleeve on the substrate side.