WO2004057677A2 - Integrated circuit structure comprising an optoelectronic part which is covered with a lid through which light can pass - Google Patents

Integrated circuit structure comprising an optoelectronic part which is covered with a lid through which light can pass Download PDF

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Publication number
WO2004057677A2
WO2004057677A2 PCT/EP2003/014151 EP0314151W WO2004057677A2 WO 2004057677 A2 WO2004057677 A2 WO 2004057677A2 EP 0314151 W EP0314151 W EP 0314151W WO 2004057677 A2 WO2004057677 A2 WO 2004057677A2
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WO
WIPO (PCT)
Prior art keywords
integrated circuit
cover
support
structure according
zone
Prior art date
Application number
PCT/EP2003/014151
Other languages
French (fr)
Other versions
WO2004057677A3 (en
Inventor
Roland Walther
André Grandjean
Original Assignee
Em Microelectronic-Marin Sa
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Publication date
Application filed by Em Microelectronic-Marin Sa filed Critical Em Microelectronic-Marin Sa
Publication of WO2004057677A2 publication Critical patent/WO2004057677A2/en
Publication of WO2004057677A3 publication Critical patent/WO2004057677A3/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Definitions

  • the invention relates to an integrated circuit structure.
  • Said structure comprises a support with conductive connection tracks, at least one integrated circuit mounted on one face of the support and electrically connected by wires or conductive studs for connection to conductive tracks of said support, and a cover having at least one passage of light, said cover covering at least one optoelectronic part of the integrated circuit.
  • the light passage of the cover is a diaphragm so that the optoelectronic part acts as a light detector.
  • an integrated circuit structure of the optoelectronic type it is often necessary to cover the integrated circuit with a cover in which an opening is made for the passage of light.
  • the integrated circuit is partially coated with a resin to protect in particular connection wires connecting the integrated circuit to connection tracks of a support carrying said circuit.
  • part of the integrated circuit capturing or emitting light must be covered by a cover provided with a light passage opening.
  • the opening must be precisely positioned above the integrated circuit to allow light beams to pass, this requires on the one hand to position the integrated circuit on its support and also the cover to be fixed on said support.
  • the tolerances relating to the positioning of the integrated circuit on the support and also of the cover on the integrated circuit must be taken into account, which is a drawback.
  • An object of the present invention therefore relates to an integrated circuit structure to overcome the drawbacks of mounting the structures of the prior art mentioned above.
  • the object of the invention relates to an integrated circuit structure mentioned above, which is characterized in that the cover comprises an internal cavity arranged to come into direct contact with the integrated circuit so as to allow adjustment automatic hood on said integrated circuit.
  • An advantage of the integrated circuit structure according to the invention is that this makes it possible to precisely position the cover on the integrated circuit by direct contact with a part of an interior cavity of the cover covering said integrated circuit.
  • This makes it possible to avoid taking account of a positioning tolerance, since the integrated circuit no longer needs to be precisely positioned on the support.
  • the cover comes into direct contact with the integrated circuit and provides self-adjustment of the passage of light on the integrated circuit. If the integrated circuit must be well positioned, it must be taken into account a tolerance of 50 to 70 ⁇ m, while the tolerance for the positioning of the cover on the integrated circuit is of the order of 45 ⁇ m.
  • FIG. 1 represents a three-dimensional view partially in section of the integrated circuit structure according to the invention
  • Figures 2a to 2c schematically show in side and top views of the steps of a method for producing the integrated circuit structure according to the invention
  • Figures 3a and 3b show partial sections along AA and BB of the figure 2c of a first embodiment of the structure according to the invention with the cover shown before adjustment on the integrated circuit
  • FIGS. 4a and 4b represent partial sections along AA and BB of FIG. 2c of a second form d execution of the structure according to the invention with the cover shown before adjustment on the integrated circuit
  • FIG. 5a and 5b show sectional views They according to AA and BB of FIG. 2c of a third embodiment of the structure according to the invention with the cover shown before adjustment on the integrated circuit.
  • the structure 1 comprises a support 2 on which the integrated circuit 3 is fixed on a flat face with a preferably non-conductive adhesive.
  • the support comprises conductive connection tracks 5 for electrically connecting connection conductive wires 6 to the output pads 8 of the integrated circuit 3.
  • the structure also comprises a cover 4 provided with at least one passage for the light 7 on an upper part. Said cover covers at least one optoelectronic part or zone 3b of the integrated circuit 3.
  • the cover 4 comprises an interior cavity arranged to come into direct contact with the integrated circuit so as to allow automatic adjustment of the cover on said integrated circuit.
  • a chamfered part 10 is produced on the edges of the interior cavity. This chamfered part may also be necessary if the adhesive for fixing the integrated circuit to the support spreads out below the edges of said circuit.
  • At least two portions of the interior cavity of the cover come into direct contact with at least two edges of the integrated circuit to ensure self-adjustment of the cover on said integrated circuit. These two portions of the cavity are for example two vertical surfaces of the interior cavity of the cover coming into direct contact with the integrated circuit to ensure good positioning of the cover and its passage of light on the optoelectronic part of the integrated circuit.
  • the upper part of the cover comprises a portion, for example of frustoconical shape through which the passage of light 7 is made.
  • the portion can be of different shape depending on the element of an appliance to be connected to the portion of the part top of the hood.
  • This light passage is a diaphragm to allow the optoelectronic part 3b of the integrated circuit 3 to capture a light beam from a light source.
  • the integrated circuit 3 is divided into a first zone or optoelectronic part 3b for picking up or emitting light signals by the passage of light 7 and a second zone or electronic part 3a for processing signals from the first zone.
  • the second zone 3a of the integrated circuit 3 comprises all of the output pads 8 of the integrated circuit for electrical connection by wires 6 or conductive pads to conductive tracks 5 of the support 2.
  • a resin 9 d traditional encapsulation may only cover the second zone 3a and the conductive wires 6 to be protected, leaving the optoelectronic zone 3b uncovered.
  • the cover for example made of opaque plastic material, can be dimensioned to cover the entire integrated circuit 3 as well as the encapsulation resin 9 and be fixed with non-conductive glue on the support 2. However in an embodiment not shown, this cover can be dimensioned to cover only the optoelectronic part of the integrated circuit.
  • the integrated circuit 3 is firstly fixed to one face of the support 2 by a non-conductive adhesive not shown and the output areas of the integrated circuit are connected by conductive wires 6 to corresponding conductive tracks 5 of the support 2.
  • an encapsulation resin 8 coats the electronic part 3a of the integrated circuit, as well as the conductive wires 6 to be protected.
  • the cover 4 is self-adjusting on the integrated circuit 3 by its internal cavity coming into direct contact with the integrated circuit. Said cover is preferably fixed by the same non-conductive adhesive on the support.
  • a second embodiment of the integrated circuit structure 1 is presented.
  • the difference of this second embodiment compared to the first embodiment relates only to the contact portions of the interior cavity of the cover coming into direct contact with the integrated circuit.
  • it is provided for example at least three lugs or protrusions 11 each placed on a vertical surface of the cavity.
  • at least two lugs of the cover 4 come into direct contact with at least two vertical surfaces of the strip of sawing of the integrated circuit to ensure self-adjustment of the cover on the integrated circuit.
  • the lugs or protrusions make it possible to guarantee correct positioning of the cover in contact with the integrated circuit even if a few grains of dust or dirt surround the integrated circuit.
  • a third embodiment of the integrated circuit structure 1 is presented.
  • a thickness in a saw strip less than the thickness of the integrated circuit which includes the optoelectronic part.
  • the vertical surfaces 12 of the integrated circuit in contact with vertical surfaces 13 or the lugs of the interior cavity of the cover are located at the thickness transition of the integrated circuit.
  • the cover must normally also be adjusted in height in addition to its horizontal adjustment in order to position the passage of light above the optoelectronic part.
  • the hood with light passage does not cover the resin of the electronic part of the integrated circuit but only the optoelectronic part.
  • the cover and the support can be of any type of opaque insulating material.
  • the adhesive which holds the integrated circuit on the support can be applied for example only under the electronic part of the integrated circuit so as to facilitate self-adjustment of the cover on the optoelectronic part of the integrated circuit.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Light Receiving Elements (AREA)
  • Led Device Packages (AREA)

Abstract

The invention relates to an integrated circuit structure (1) consisting of a support (2) comprising conductive tracks (5), at least one integrated circuit (3) which is mounted on one face of the support and which is electrically connected to the conductive tracks of said support by means of conductive leads (6) and a lid (4) comprising at least one light passage (7). The aforementioned lid covers at least one optoelectronic part of the integrated circuit. Moreover, said lid (4) comprises an inner cavity which is arranged in order to come into direct contact with the integrated circuit, such as to enable the automatic adjustment of the lid on the integrated circuit.

Description

STRUCTURE A CIRCUIT INTEGRE AYANT UNE PARTIE OPTOELECTRONIQUE RECOUVERTE PAR UN CAPOT A PASSAGE DE LUMIERE INTEGRATED CIRCUIT STRUCTURE HAVING AN OPTOELECTRONIC PART COVERED BY A LIGHT-PASS COVER
L'invention concerne une structure à circuit intégré. Ladite structure comprend un support à pistes conductrices de connexion, au moins un circuit intégré monté sur une face du support et relié électriquement par des fils ou des plots conducteurs de connexion à des pistes conductrices dudit support, et un capot disposant d'au moins un passage de la lumière, ledit capot recouvrant au moins une partie optoélectronique du circuit intégré. De préférence, le passage de lumière du capot est un diaphragme afin que la partie optoélectronique agisse comme un détecteur de lumière.The invention relates to an integrated circuit structure. Said structure comprises a support with conductive connection tracks, at least one integrated circuit mounted on one face of the support and electrically connected by wires or conductive studs for connection to conductive tracks of said support, and a cover having at least one passage of light, said cover covering at least one optoelectronic part of the integrated circuit. Preferably, the light passage of the cover is a diaphragm so that the optoelectronic part acts as a light detector.
Pour réaliser une structure à circuit intégré du type optoélectronique, il est souvent nécessaire de recouvrir le circuit intégré d'un capot dans lequel est pratiqué une ouverture pour le passage de la lumière. En général, le circuit intégré est partiellement enrobé par une résine pour protéger notamment des fils de connexion reliant le circuit intégré à des pistes de connexion d'un support portant ledit circuit. Par contre, une partie du circuit intégré captant ou émettant de la lumière doit être recouverte par un capot muni d'une ouverture de passage de lumière. Comme l'ouverture doit être précisément positionnée au-dessus du circuit intégré pour laisser passer des faisceaux lumineux, cela exige d'une part de positionner le circuit intégré sur son support et également le capot à fixer sur ledit support. Ainsi on doit tenir compte des tolérances relatives au positionnement du circuit intégré sur le support et également du capot sur le circuit intégré ce qui est un inconvénient. Un but de la présente invention concerne donc une structure à circuit intégré pour pallier aux inconvénients de montage des structures de l'art antérieur cités ci- devant.To make an integrated circuit structure of the optoelectronic type, it is often necessary to cover the integrated circuit with a cover in which an opening is made for the passage of light. In general, the integrated circuit is partially coated with a resin to protect in particular connection wires connecting the integrated circuit to connection tracks of a support carrying said circuit. On the other hand, part of the integrated circuit capturing or emitting light must be covered by a cover provided with a light passage opening. As the opening must be precisely positioned above the integrated circuit to allow light beams to pass, this requires on the one hand to position the integrated circuit on its support and also the cover to be fixed on said support. Thus, the tolerances relating to the positioning of the integrated circuit on the support and also of the cover on the integrated circuit must be taken into account, which is a drawback. An object of the present invention therefore relates to an integrated circuit structure to overcome the drawbacks of mounting the structures of the prior art mentioned above.
A cet effet, l'objet de l'invention concerne une structure à circuit intégré citée ci-devant, qui se caractérise en ce que le capot comprend une cavité intérieure agencée pour venir en contact direct avec le circuit intégré de manière à permettre un ajustement automatique du capot sur ledit circuit intégré.To this end, the object of the invention relates to an integrated circuit structure mentioned above, which is characterized in that the cover comprises an internal cavity arranged to come into direct contact with the integrated circuit so as to allow adjustment automatic hood on said integrated circuit.
Un avantage de la structure à circuit intégré, selon l'invention, est que cela permet de positionner précisément le capot sur le circuit intégré par contact direct d'une partie d'une cavité intérieure du capot recouvrant ledit circuit intégré. Ainsi cela permet d'éviter de tenir compte d'une tolérance de positionnement, car le circuit intégré n'a plus besoin d'être précisément positionné sur le support. Le capot vient en contact direct du circuit intégré et assure un auto-ajustement du passage de lumière sur le circuit intégré. Si le circuit intégré doit être bien positionné, on doit tenir compte d'une tolérance de 50 à 70 μm, alors que la tolérance pour le positionnement du capot sur le circuit intégré est de l'ordre de 45 μm.An advantage of the integrated circuit structure according to the invention is that this makes it possible to precisely position the cover on the integrated circuit by direct contact with a part of an interior cavity of the cover covering said integrated circuit. Thus this makes it possible to avoid taking account of a positioning tolerance, since the integrated circuit no longer needs to be precisely positioned on the support. The cover comes into direct contact with the integrated circuit and provides self-adjustment of the passage of light on the integrated circuit. If the integrated circuit must be well positioned, it must be taken into account a tolerance of 50 to 70 μm, while the tolerance for the positioning of the cover on the integrated circuit is of the order of 45 μm.
Les buts, avantages et caractéristiques de la structure à circuit intégré apparaîtront mieux dans la description suivante de formes d'exécution illustrées par les dessins sur lesquels : la figure 1 représente une vue tridimensionnelle partiellement en coupe de la structure à circuit intégré selon l'invention, les figures 2a à 2c représentent schématiquement en vues de côté et de dessus des étapes d'un procédé de réalisation de la structure à circuit intégré selon l'invention, les figures 3a et 3b représentent des coupes partielles selon A-A et B-B de la figure 2c d'une première forme d'exécution de la structure selon l'invention avec le capot montré avant ajustement sur le circuit intégré, les figures 4a et 4b représentent des coupes partielles selon A-A et B-B de la figure 2c d'une seconde forme d'exécution de la structure selon l'invention avec le capot montré avant ajustement sur le circuit intégré, et les figure 5a et 5b représentent des coupes partielles selon A-A et B-B de la figure 2c d'une troisième forme d'exécution de la structure selon l'invention avec le capot montré avant ajustement sur le circuit intégré. Aux figures 1 à 3, une première forme d'exécution de la structure à circuit intégré et du procédé pour sa réalisation est présentée. La structure 1 comprend un support 2 sur lequel est fixé sur une face plane par une colle de préférence non conductrice le circuit intégré 3. Le support comprend des pistes conductrices de connexion 5 pour relier électriquement par des fils conducteurs de connexion 6 des plages de sortie 8 du circuit intégré 3. La structure comprend encore un capot 4 muni d'au moins un passage de la lumière 7 sur une partie supérieure. Ledit capot recouvre au moins une partie ou zone optoélectronique 3b du circuit intégré 3. Le capot 4 comprend une cavité intérieure agencée pour venir en contact direct avec le circuit intégré de manière à permettre un ajustement automatique du capot sur ledit circuit intégré. Pour faciliter le montage du capot sur le circuit intégré 3 et sur le support 2, une partie chanfreinée 10 est réalisée sur les bords de la cavité intérieure. Cette partie chanfreinée peut être aussi nécessaire si de la colle de fixation du circuit intégré sur le support s'étale en deçà des bords dudit circuit. Au moins deux portions de la cavité intérieure du capot viennent en contact direct avec au moins deux bords du circuit intégré pour assurer un auto-ajustement du capot sur ledit circuit intégré. Ces deux portions de la cavité sont par exemple deux surfaces verticales de la cavité intérieure du capot venant en contact direct avec le circuit intégré pour assurer un bon positionnement du capot et de son passage de lumière sur la partie optoélectronique du circuit intégré.The objects, advantages and characteristics of the integrated circuit structure will appear better in the following description of embodiments illustrated by the drawings in which: FIG. 1 represents a three-dimensional view partially in section of the integrated circuit structure according to the invention , Figures 2a to 2c schematically show in side and top views of the steps of a method for producing the integrated circuit structure according to the invention, Figures 3a and 3b show partial sections along AA and BB of the figure 2c of a first embodiment of the structure according to the invention with the cover shown before adjustment on the integrated circuit, FIGS. 4a and 4b represent partial sections along AA and BB of FIG. 2c of a second form d execution of the structure according to the invention with the cover shown before adjustment on the integrated circuit, and FIGS. 5a and 5b show sectional views They according to AA and BB of FIG. 2c of a third embodiment of the structure according to the invention with the cover shown before adjustment on the integrated circuit. In Figures 1 to 3, a first embodiment of the integrated circuit structure and the method for its production is presented. The structure 1 comprises a support 2 on which the integrated circuit 3 is fixed on a flat face with a preferably non-conductive adhesive. The support comprises conductive connection tracks 5 for electrically connecting connection conductive wires 6 to the output pads 8 of the integrated circuit 3. The structure also comprises a cover 4 provided with at least one passage for the light 7 on an upper part. Said cover covers at least one optoelectronic part or zone 3b of the integrated circuit 3. The cover 4 comprises an interior cavity arranged to come into direct contact with the integrated circuit so as to allow automatic adjustment of the cover on said integrated circuit. To facilitate mounting of the cover on the integrated circuit 3 and on the support 2, a chamfered part 10 is produced on the edges of the interior cavity. This chamfered part may also be necessary if the adhesive for fixing the integrated circuit to the support spreads out below the edges of said circuit. At least two portions of the interior cavity of the cover come into direct contact with at least two edges of the integrated circuit to ensure self-adjustment of the cover on said integrated circuit. These two portions of the cavity are for example two vertical surfaces of the interior cavity of the cover coming into direct contact with the integrated circuit to ensure good positioning of the cover and its passage of light on the optoelectronic part of the integrated circuit.
La partie supérieure du capot comprend une portion par exemple de forme tronconique à travers laquelle est réalisé le passage de lumière 7. La portion peut être de forme différente en fonction de l'élément d'un appareil devant être relié sur la portion de la partie supérieure du capot. Ce passage de lumière est un diaphragme pour permettre à la partie optoélectronique 3b du circuit intégré 3 de capter un faisceau lumineux d'une source de lumière.The upper part of the cover comprises a portion, for example of frustoconical shape through which the passage of light 7 is made. The portion can be of different shape depending on the element of an appliance to be connected to the portion of the part top of the hood. This light passage is a diaphragm to allow the optoelectronic part 3b of the integrated circuit 3 to capture a light beam from a light source.
Le circuit intégré 3 est divisé en une première zone ou partie optoélectronique 3b pour capter ou émettre des signaux lumineux par le passage de lumière 7 et une seconde zone ou partie électronique 3a de traitement de signaux de la première zone. De préférence, la seconde zone 3a du circuit intégré 3 comprend toutes les plages de sortie 8 du circuit intégré pour la connexion électrique par des fils 6 ou des plots conducteurs à des pistes conductrices 5 du support 2. De cette manière, une résine 9 d'encapsulation traditionnelle peut ne recouvrir que la seconde zone 3a et les fils conducteurs 6 à protéger, en laissant à découvert la zone optoélectronique 3b.The integrated circuit 3 is divided into a first zone or optoelectronic part 3b for picking up or emitting light signals by the passage of light 7 and a second zone or electronic part 3a for processing signals from the first zone. Preferably, the second zone 3a of the integrated circuit 3 comprises all of the output pads 8 of the integrated circuit for electrical connection by wires 6 or conductive pads to conductive tracks 5 of the support 2. In this way, a resin 9 d traditional encapsulation may only cover the second zone 3a and the conductive wires 6 to be protected, leaving the optoelectronic zone 3b uncovered.
Le capot par exemple en matériau plastique opaque peut être dimensionné pour recouvrir tout le circuit intégré 3 ainsi que la résine 9 d'encapsulation et être fixé par de la colle non conductrice sur le support 2. Cependant dans une forme d'exécution non illustrée, ce capot peut être dimensionné pour ne recouvrir que la partie optoélectronique du circuit intégré.The cover, for example made of opaque plastic material, can be dimensioned to cover the entire integrated circuit 3 as well as the encapsulation resin 9 and be fixed with non-conductive glue on the support 2. However in an embodiment not shown, this cover can be dimensioned to cover only the optoelectronic part of the integrated circuit.
Selon le procédé de réalisation de la structure à circuit intégré montré aux figures 2a à 2c, le circuit intégré 3 est tout d'abord fixé sur une face du support 2 par une colle non conductrice non représentée et les plages de sortie du circuit intégré sont reliées par des fils conducteurs 6 à des pistes conductrices 5 correspondantes du support 2. Par la suite, une résine d'encapsulation 8 enrobe la partie électronique 3a du circuit intégré, ainsi que les fils conducteurs 6 à protéger. Finalement, le capot 4 est auto-ajusté sur le circuit intégré 3 par sa cavité intérieure venant en contact direct avec le circuit intégré. Ledit capot est de préférence fixé par une même colle non conductrice sur le support.According to the method for producing the integrated circuit structure shown in FIGS. 2a to 2c, the integrated circuit 3 is firstly fixed to one face of the support 2 by a non-conductive adhesive not shown and the output areas of the integrated circuit are connected by conductive wires 6 to corresponding conductive tracks 5 of the support 2. Subsequently, an encapsulation resin 8 coats the electronic part 3a of the integrated circuit, as well as the conductive wires 6 to be protected. Finally, the cover 4 is self-adjusting on the integrated circuit 3 by its internal cavity coming into direct contact with the integrated circuit. Said cover is preferably fixed by the same non-conductive adhesive on the support.
Aux figures 4a et 4b, une seconde forme d'exécution de la structure à circuit intégré 1 est présentée. La différence de cette seconde forme d'exécution par rapport à la première forme d'exécution ne concerne que les portions de contact de la cavité intérieure du capot venant en contact direct avec le circuit intégré. Dans ce cas de figure, il est prévu par exemple au moins trois ergots ou protubérances 11 placés chacun sur une surface verticale de la cavité. Ainsi au moins deux ergots du capot 4 viennent en contact direct avec au moins deux surfaces verticales de la bande de sciage du circuit intégré pour assurer un auto-ajustement du capot sur le circuit intégré. Les ergots ou protubérances permettent de garantir un bon positionnement du capot en contact du circuit intégré même si quelques grains de poussière ou de la saleté entourent le circuit intégré. Aux figures 5a et 5b, une troisième forme d'exécution de la structure à circuit intégré 1 est présentée. Pour faciliter le montage du capot sur la partie optoélectronique du circuit intégré et pour assurer un positionnement précis dudit capot, il est réalisé dans des étapes de fabrication du circuit intégré, une épaisseur dans une bande de sciage inférieure à l'épaisseur du circuit intégré qui comprend la partie optoélectronique. Les surfaces verticales 12 du circuit intégré en contact avec des surfaces verticales 13 ou les ergots de la cavité intérieure du capot sont situées à la transition d'épaisseur du circuit intégré.In Figures 4a and 4b, a second embodiment of the integrated circuit structure 1 is presented. The difference of this second embodiment compared to the first embodiment relates only to the contact portions of the interior cavity of the cover coming into direct contact with the integrated circuit. In this case, it is provided for example at least three lugs or protrusions 11 each placed on a vertical surface of the cavity. Thus at least two lugs of the cover 4 come into direct contact with at least two vertical surfaces of the strip of sawing of the integrated circuit to ensure self-adjustment of the cover on the integrated circuit. The lugs or protrusions make it possible to guarantee correct positioning of the cover in contact with the integrated circuit even if a few grains of dust or dirt surround the integrated circuit. In FIGS. 5a and 5b, a third embodiment of the integrated circuit structure 1 is presented. To facilitate the mounting of the cover on the optoelectronic part of the integrated circuit and to ensure precise positioning of said cover, it is produced in stages of manufacture of the integrated circuit, a thickness in a saw strip less than the thickness of the integrated circuit which includes the optoelectronic part. The vertical surfaces 12 of the integrated circuit in contact with vertical surfaces 13 or the lugs of the interior cavity of the cover are located at the thickness transition of the integrated circuit.
Il est à noter que le capot doit normalement être ajusté également en hauteur en plus de son ajustement horizontalement pour positionner le passage de lumière au-dessus de la partie optoélectronique.It should be noted that the cover must normally also be adjusted in height in addition to its horizontal adjustment in order to position the passage of light above the optoelectronic part.
A partir de la description qui vient d'être faite, de multiples variantes de réalisation de la structure à circuit intégré peuvent être conçues par l'homme du métier sans sortir du cadre de l'invention. Il peut être encore prévu que le capot à passage de lumière ne recouvre pas la résine de la partie électronique du circuit intégré mais seulement la partie optoélectronique. Le capot et le support peuvent être de tout type de matériau isolant opaque. La colle qui maintient le circuit intégré sur le support peut être appliquée par exemple uniquement sous la partie électronique du circuit intégré de manière à faciliter un auto-ajustement du capot sur la partie optoélectronique du circuit intégré. Pour assurer un bon positionnement du capot sur le circuit intégré, il peut être également prévu que la cavité intérieure du capot vienne en contact direct sur des plots de connexion du circuit intégré. From the description which has just been made, multiple alternative embodiments of the integrated circuit structure can be designed by a person skilled in the art without departing from the scope of the invention. It can also be provided that the hood with light passage does not cover the resin of the electronic part of the integrated circuit but only the optoelectronic part. The cover and the support can be of any type of opaque insulating material. The adhesive which holds the integrated circuit on the support can be applied for example only under the electronic part of the integrated circuit so as to facilitate self-adjustment of the cover on the optoelectronic part of the integrated circuit. To ensure correct positioning of the cover on the integrated circuit, provision may also be made for the interior cavity of the cover to come into direct contact on connection pads of the integrated circuit.

Claims

REVENDICATIONS
1. Structure à circuit intégré (1) comprenant un support (2) à pistes conductrices de connexion (5), au moins un circuit intégré (3) monté sur une face du support et relié électriquement par des fils (6) ou des plots conducteurs de connexion à des pistes conductrices dudit support, et un capot (4) disposant d'au moins un passage de la lumière (7), ledit capot recouvrant au moins une partie optoélectronique (3b) du circuit intégré, caractérisé en ce que le capot comprend une cavité intérieure agencée pour venir en contact direct avec le circuit intégré de manière à permettre un ajustement automatique du capot sur ledit circuit intégré.1. Integrated circuit structure (1) comprising a support (2) with conductive connection tracks (5), at least one integrated circuit (3) mounted on one face of the support and electrically connected by wires (6) or pads conductors for connection to conductive tracks of said support, and a cover (4) having at least one light passage (7), said cover covering at least one optoelectronic part (3b) of the integrated circuit, characterized in that the cover includes an interior cavity arranged to come into direct contact with the integrated circuit so as to allow automatic adjustment of the cover on said integrated circuit.
2. Structure selon la revendication 1 , caractérisé en ce que le passage de lumière (7) du capot est disposé sur une partie supérieure du capot, et en ce que ledit passage est un diaphragme.2. Structure according to claim 1, characterized in that the light passage (7) of the cover is arranged on an upper part of the cover, and in that said passage is a diaphragm.
3. Structure selon l'une des revendications précédentes, caractérisé en ce que le circuit intégré est divisé en une première zone optoélectronique pour capter ou émettre des signaux lumineux par le passage de lumière et une seconde zone électronique de traitement de signaux de la première zone.3. Structure according to one of the preceding claims, characterized in that the integrated circuit is divided into a first optoelectronic zone for picking up or emitting light signals by the passage of light and a second electronic signal processing zone of the first zone .
4. Structure selon la revendication 3, caractérisé en ce qu'uniquement la seconde zone du circuit intégré comprend des plages de sortie pour la connexion électrique par des fils ou des plots conducteurs à des pistes conductrices du support.4. Structure according to claim 3, characterized in that only the second area of the integrated circuit comprises output pads for electrical connection by son or conductive pads to conductive tracks of the support.
5. Structure selon la revendication 4, caractérisé en ce que la seconde zone et les fils ou plots conducteurs sont recouverts par une résine d'encapsulation, alors que la première zone optoélectronique est recouverte uniquement par le capot en contact direct avec le circuit intégré.5. Structure according to claim 4, characterized in that the second zone and the son or conductive pads are covered by an encapsulation resin, while the first optoelectronic zone is covered only by the cover in direct contact with the integrated circuit.
6. Structure selon la revendication 5, caractérisé en ce que le capot est fixé sur ledit support en recouvrant complètement le circuit intégré et la résine d'encapsulation de la seconde zone.6. Structure according to claim 5, characterized in that the cover is fixed on said support by completely covering the integrated circuit and the encapsulation resin of the second zone.
7. Structure selon la revendication 1 , caractérisé en ce qu'au moins deux portions de la cavité intérieure du capot viennent en contact direct avec au moins deux bords du circuit intégré pour assurer un auto-ajustement du capot sur ledit circuit intégré. 7. Structure according to claim 1, characterized in that at least two portions of the interior cavity of the cover come into direct contact with at least two edges of the integrated circuit to ensure self-adjustment of the cover on said integrated circuit.
8. Structure selon la revendication 7, caractérisé en ce que la cavité intérieure du capot comprend au moins trois ergots placés chacun sur une surface verticale de la cavité par rapport à la face horizontale du support portant le circuit intégré de manière qu'au moins deux ergots du capot viennent en contact direct avec au moins deux surfaces verticales du circuit intégré pour assurer un auto-ajustement du capot sur le circuit intégré. 8. Structure according to claim 7, characterized in that the interior cavity of the cover comprises at least three lugs each placed on a vertical surface of the cavity relative to the horizontal face of the support carrying the integrated circuit so that at least two cover lugs come into direct contact with at least two vertical surfaces of the integrated circuit to ensure self-adjustment of the cover on the integrated circuit.
9. Structure selon l'une des revendications 1 et 8, caractérisé en ce que l'épaisseur dans une bande de sciage du circuit intégré est inférieure à l'épaisseur du circuit intégré qui comprend la partie optoélectronique, et en ce que des surfaces verticales du circuit intégré en contact avec des surfaces verticales ou les ergots de la cavité intérieure du capot sont situées à la transition d'épaisseur du circuit intégré. 9. Structure according to one of claims 1 and 8, characterized in that the thickness in a sawing strip of the integrated circuit is less than the thickness of the integrated circuit which comprises the optoelectronic part, and in that vertical surfaces of the integrated circuit in contact with vertical surfaces or the lugs of the interior cavity of the cover are located at the thickness transition of the integrated circuit.
PCT/EP2003/014151 2002-12-20 2003-12-12 Integrated circuit structure comprising an optoelectronic part which is covered with a lid through which light can pass WO2004057677A2 (en)

Applications Claiming Priority (2)

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EP02080658 2002-12-20
EP02080658.4 2002-12-20

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WO2004057677A3 WO2004057677A3 (en) 2005-07-07

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07294777A (en) * 1994-04-22 1995-11-10 Sumitomo Electric Ind Ltd Optical module
US5783815A (en) * 1995-10-24 1998-07-21 Sony Corporation Light receiving device having lens fitting element
WO2002075815A1 (en) * 2001-03-16 2002-09-26 Atmel Grenoble S.A. Low cost electronic camera made with integrated circuit technology

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07294777A (en) * 1994-04-22 1995-11-10 Sumitomo Electric Ind Ltd Optical module
US5783815A (en) * 1995-10-24 1998-07-21 Sony Corporation Light receiving device having lens fitting element
WO2002075815A1 (en) * 2001-03-16 2002-09-26 Atmel Grenoble S.A. Low cost electronic camera made with integrated circuit technology

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 1996, no. 03, 29 mars 1996 (1996-03-29) -& JP 07 294777 A (SUMITOMO ELECTRIC IND LTD), 10 novembre 1995 (1995-11-10) *

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