WO2004057677A3 - Integrated circuit structure comprising an optoelectronic part which is covered with a lid through which light can pass - Google Patents

Integrated circuit structure comprising an optoelectronic part which is covered with a lid through which light can pass Download PDF

Info

Publication number
WO2004057677A3
WO2004057677A3 PCT/EP2003/014151 EP0314151W WO2004057677A3 WO 2004057677 A3 WO2004057677 A3 WO 2004057677A3 EP 0314151 W EP0314151 W EP 0314151W WO 2004057677 A3 WO2004057677 A3 WO 2004057677A3
Authority
WO
WIPO (PCT)
Prior art keywords
integrated circuit
lid
circuit structure
covered
pass
Prior art date
Application number
PCT/EP2003/014151
Other languages
French (fr)
Other versions
WO2004057677A2 (en
Inventor
Roland Walther
Andre Grandjean
Original Assignee
Em Microelectronic Marin Sa
Roland Walther
Andre Grandjean
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Em Microelectronic Marin Sa, Roland Walther, Andre Grandjean filed Critical Em Microelectronic Marin Sa
Publication of WO2004057677A2 publication Critical patent/WO2004057677A2/en
Publication of WO2004057677A3 publication Critical patent/WO2004057677A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Light Receiving Elements (AREA)
  • Led Device Packages (AREA)

Abstract

The invention relates to an integrated circuit structure (1) consisting of a support (2) comprising conductive tracks (5), at least one integrated circuit (3) which is mounted on one face of the support and which is electrically connected to the conductive tracks of said support by means of conductive leads (6) and a lid (4) comprising at least one light passage (7). The aforementioned lid covers at least one optoelectronic part of the integrated circuit. Moreover, said lid (4) comprises an inner cavity which is arranged in order to come into direct contact with the integrated circuit, such as to enable the automatic adjustment of the lid on the integrated circuit.
PCT/EP2003/014151 2002-12-20 2003-12-12 Integrated circuit structure comprising an optoelectronic part which is covered with a lid through which light can pass WO2004057677A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP02080658 2002-12-20
EP02080658.4 2002-12-20

Publications (2)

Publication Number Publication Date
WO2004057677A2 WO2004057677A2 (en) 2004-07-08
WO2004057677A3 true WO2004057677A3 (en) 2005-07-07

Family

ID=32668878

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2003/014151 WO2004057677A2 (en) 2002-12-20 2003-12-12 Integrated circuit structure comprising an optoelectronic part which is covered with a lid through which light can pass

Country Status (1)

Country Link
WO (1) WO2004057677A2 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07294777A (en) * 1994-04-22 1995-11-10 Sumitomo Electric Ind Ltd Optical module
US5783815A (en) * 1995-10-24 1998-07-21 Sony Corporation Light receiving device having lens fitting element
WO2002075815A1 (en) * 2001-03-16 2002-09-26 Atmel Grenoble S.A. Low cost electronic camera made with integrated circuit technology

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07294777A (en) * 1994-04-22 1995-11-10 Sumitomo Electric Ind Ltd Optical module
US5783815A (en) * 1995-10-24 1998-07-21 Sony Corporation Light receiving device having lens fitting element
WO2002075815A1 (en) * 2001-03-16 2002-09-26 Atmel Grenoble S.A. Low cost electronic camera made with integrated circuit technology

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 1996, no. 03 29 March 1996 (1996-03-29) *

Also Published As

Publication number Publication date
WO2004057677A2 (en) 2004-07-08

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