WO2013053476A2 - Mechanical retention system, assembly comprising such a system and an electronic board and method of assembling such a system and such a board on a surface - Google Patents

Mechanical retention system, assembly comprising such a system and an electronic board and method of assembling such a system and such a board on a surface Download PDF

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Publication number
WO2013053476A2
WO2013053476A2 PCT/EP2012/004259 EP2012004259W WO2013053476A2 WO 2013053476 A2 WO2013053476 A2 WO 2013053476A2 EP 2012004259 W EP2012004259 W EP 2012004259W WO 2013053476 A2 WO2013053476 A2 WO 2013053476A2
Authority
WO
WIPO (PCT)
Prior art keywords
protrusion
card
electronic card
assembly
smi
Prior art date
Application number
PCT/EP2012/004259
Other languages
French (fr)
Other versions
WO2013053476A3 (en
Inventor
Guillaume SANVITO
Hubert Lescot
Pierre Smal
Original Assignee
Valeo Japan Co, Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Valeo Japan Co, Ltd filed Critical Valeo Japan Co, Ltd
Publication of WO2013053476A2 publication Critical patent/WO2013053476A2/en
Publication of WO2013053476A3 publication Critical patent/WO2013053476A3/en

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/14Mounting supporting structure in casing or on frame or rack
    • H05K7/1417Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/14Mounting supporting structure in casing or on frame or rack
    • H05K7/1417Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
    • H05K7/142Spacers not being card guides
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/2049Pressing means used to urge contact, e.g. springs
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209Heat transfer by conduction from internal heat source to heat radiating structure

Definitions

  • Mechanical holding system an assembly comprising such a system and an electronic card and method of assembly on a surface of such a system and such a card.
  • the technical sector of the present invention is that of electronic card holding systems on a surface.
  • Such a holding system is usually found in a rotating machine for a motor vehicle such as an electric air conditioning compressor.
  • a motor vehicle such as an electric air conditioning compressor.
  • Such a machine includes a housing, an electric motor, a high voltage power board, a low voltage control board and electrical connectors.
  • a high voltage power source is connected to the power board via electrical conductors.
  • the current arriving on the power board is continuous.
  • Electrical components are arranged on the power board and their role is to transform the direct current into alternating current.
  • Electrical connectors then connect the power card to the electric motor of the rotating machine to transport the alternating current from the power board to the electric motor.
  • the low voltage control board is powered by a battery providing a low voltage power supply. Electrical components are also arranged on the low voltage control board and their role is to control the electrical components arranged on the power board. These commands are transmitted from the low voltage card to the power card, also via electrical conductors.
  • a known solution is to choose on the one hand a power card comprising a heat dissipation substrate on which are mounted electronic components and on the other hand a housing having good thermal conduction properties.
  • the power board is pressed against the housing to dissipate some of the heat generated by the components through the housing.
  • the power card is typically an isolated metal substrate card or SMI card.
  • the power card To press the power card against the housing, it is known to make holes in the power card, holes in the housing and then screw the power card on the housing.
  • the screws are typically made of a metal material to provide a mechanically strong contact between the board and the case.
  • the card has a safety distance between the holes and the inner part of the board containing the components. A portion of the map is therefore not available for the placement of electronic components and the routing of interconnections between components.
  • the piercing step of the card and the box complicates the manufacturing process.
  • the object of the invention is to overcome the aforementioned problems.
  • a system for mechanically holding an electronic card against a surface of a support characterized in that it comprises a main body intended to come opposite the electronic card and having at least a protrusion which extends in one direction so as to maintain said electronic card against said surface.
  • the holding system performs this role by coming to press the electronic card against the surface of the support.
  • the main body is intended to be fixed to the support.
  • the outgrowth extends in one direction away from the main body.
  • the main body has at least one portion extending substantially in a plane.
  • the direction along which the protuberance extends is transverse to this plane.
  • the support is a compressor housing
  • the surface is a thermal dissipation surface of the housing and the electronic card allows thermal transmission of its components to the heat dissipation surface.
  • the holding system plate the electronic card against the heat dissipation surface to ensure a thermal transfer of the card to the surface.
  • the heat of the components of the electronic board is transmitted through the heat dissipation surface to a compressor fluid for cooling the components of the electronic board.
  • the body and the protrusion are electrically insulating.
  • the body and the protrusion are made of a plastic material.
  • Plastic materials have the necessary insulating characteristics to electrically isolate the electronic card while being rigid enough to allow the projection to ensure its role of plating the electronic card against the support surface.
  • said outgrowth is derived from the body. In other words, the body and the excrescence are of the same holding.
  • the protrusion extends from the main body so that a distal end of the protrusion comes on a periphery of the electronic card.
  • said distal end has a shoulder intended to cooperate with a peripheral edge of the electronic card.
  • This shoulder makes it possible to accurately position the mechanical holding system relative to the electronic card thanks in particular to its complementary shape with the peripheral edge of the electronic card.
  • the protrusion extends from the main body so that a distal end of the protrusion comes to a non device of the electronic card.
  • the outgrowth is a peripheral outgrowth extending from a periphery of the main body.
  • the outgrowth is an intermediate protrusion extending from an intermediate zone of the main body.
  • the intermediate protrusion differs from the peripheral protrusion in that it extends from a non-peripheral portion of the main body, this non-peripheral portion forming said intermediate zone.
  • the system comprises the peripheral outgrowth and the intermediate excrescence.
  • the intermediate protrusion is not in contact with the peripheral protuberance and thus forms a fulcrum of the electronic card on the surface.
  • Such a solution forms a mechanical stress recovery for example in the center of the electronic card.
  • the intermediate protrusion is in contact with the peripheral protrusion.
  • the intermediate protrusion extends between two flanks of the peripheral outgrowth.
  • the intermediate protrusion divides the mechanical support system into two parts and also divides the electronic card against which it is supported.
  • the intermediate protrusion is molded simultaneously with the peripheral protrusion.
  • the protuberance is a wall.
  • the force exerted by the protrusion is distributed on a surface of the electronic card.
  • the maintenance of the card is reinforced.
  • the outgrowth is a rod.
  • the protrusion can exert a force at a point on the electronic card, for example between two components of the electronic card.
  • the main body has a substantially rectangular shape.
  • the body comprises at least one eyelet through which a hole for disposing a fixing member for securing the system on the support.
  • said system comprises a preassembly member with the electronic card. Thanks to the pre-assembly member, it is possible to pre-assemble the holding system with the electronic card before disposing them on the support surface, said protrusion still ensuring its role of plating the electronic card against the surface .
  • the system further comprises electrical conductors intended to conduct a current between the electronic card and the outside of the electronic card, said electrical conductors being held together by said main body, particularly at the of the plane in which at least a portion of the main body extends.
  • said conductors extend at least in a common plane.
  • said electrical conductors are at least partially embedded in the main body.
  • the system according to the invention performs its role of mechanically maintaining an electronic card, in particular in order to guarantee the thermal transfer between the electronic card and a surface of the compressor casing, and also provides an additional role which consists of to carry electric currents (continuous and alternating) to and from the electronic board.
  • the distal end of the electrical connectors is located at a distance from the main body greater than the distance from the distal end of the protrusion.
  • the system further comprises assembly members.
  • the system allows holding and prestressing the connectors before mounting on the support surface.
  • the connectors can be soldered to the electronic board before mounting on the surface. This avoids welding difficulties related to the environment of the surface, particularly when the surface is a portion of a compressor housing.
  • the system comprises at least two primary electrical conductors intended to be traversed by a direct current and at least two secondary electrical conductors intended to be traversed by an alternating current, said primary and secondary electrical conductors being at least partly drowned in the body.
  • the system can conduct direct current from a high voltage power supply battery to the electronic card via the primary electrical conductors and the alternating current transformed by the electronic card from the electronic card to an electric motor via the secondary electrical conductors.
  • the terms "primary” and "secondary" are used to differentiate electrical conductors and do not define order of importance between these conductors.
  • said system comprises a signal connector.
  • the system therefore incorporates an additional function to support the signal connector which allows, in particular, to optimize the size of the system and the signal connector relative to a solution where they would be separated.
  • the invention also relates to a set of an electronic card and a mechanical holding system as described above. According to the invention, at least one protrusion of the holding system is intended to hold the electronic card against a surface of a support.
  • the electronic card allows a thermal transmission of its components to the support surface, especially when the surface is a heat dissipation surface.
  • the electronic board includes electronic components and a heat sink substrate on which the components are mounted.
  • the heat dissipation substrate is for example a ceramic layer.
  • the thickness of the ceramic layer is, for example, 1.6 mm.
  • the electronic card is for example an SMI card (insulated metal substrate).
  • the substrate is then a metal layer separated from the components by an electrically insulating layer.
  • the protrusion is a wall that bears on a periphery of the electronic card.
  • the protrusion plate the electronic card against the surface on the entire periphery of the card.
  • said assembly comprises a resin contained by the protrusion and covering at least a part of the electronic card.
  • the protrusion thus fulfills a role of mold for the resin.
  • the resin is positioned on the electronic card, in particular to protect the electronic components present on the electronic card.
  • said system comprises an intermediate protrusion dividing said assembly into two parts, said resin being contained in at least one of the two parts.
  • the invention further relates to a method of assembly on a surface of a support, an electronic card and a mechanical holding system as described above. According to the invention:
  • the invention thus saves time during the assembly process since it is no longer necessary to have a step of drilling the electronic card and the support.
  • the electronic card is positioned on the surface prior to the positioning of said system on the surface.
  • the invention also relates to a system for mechanically holding an electronic card against a surface of a support, characterized in that it comprises a main body intended to come opposite the electronic card and having at least a protrusion which extends in one direction so as to maintain said electronic card against said surface, said body further comprising a preassembly member with the electronic card.
  • This holding system may have any of the features described above that are compatible with it.
  • FIG. 1 schematically illustrates, in sectional view, a mechanical support system 1 according to the invention, an electronic card 4 and a housing surface 20.
  • Figure 2 illustrates in the same section as that of Figure 1, an end of an outgrowth 11 of the mechanical support system 1 according to the invention.
  • FIG. 3 is a perspective view of a mechanical holding system 1 according to the invention and an electronic card 4.
  • FIG. 4 is a detailed sectional view of a pre-assembly member 25, illustrated in FIG. 3, of the mechanical holding system 1 with the electronic card 4.
  • the invention can be applied in a support such as a housing 20 as shown in FIG. 1.
  • a housing 20 is, for example, a rotary machine housing 20 arranged, in particular, in a vehicle.
  • the housing 20 has a recess 3 adapted to receive a high voltage power card, such as an insulated metal substrate card or SMI card 4.
  • a high voltage power card such as an insulated metal substrate card or SMI card 4.
  • SMI 4 a high voltage power card
  • a holding system mechanical 1 according to the invention comes in vis-à-vis the SMI card 4 to hold against a surface 2 of the housing 20.
  • the surface 2 is in particular a heat dissipation surface.
  • the mechanical support system 1 comprises a main body 19, electrically insulating.
  • the main body 19 has a portion extending substantially along a plane 31, called the common plane.
  • the main body 19 comes opposite the SMI card 4.
  • the body 19 has openings in the common plane 31.
  • the body 19 is present only on the periphery of the mechanical holding system 1 as shown in Figure 3, thus forming a strapping.
  • the body 19 is solid along the common plane 31, that is to say that the material constituting the body 19 extends in the common plane 31 without there being has transverse opening to plane 31 present in this one.
  • a Cartesian coordinate system (x, y, z) is formed and the direction ox is defined as being the direction of the length of the portion.
  • the main body 19 extending substantially along the plane 31, oy the direction of the width of this portion, and oz the direction perpendicular to the plane defined by the directions ox and oy.
  • the SMI board 4 comprises electrical power components, for example, transistors whose role is to transform direct current into alternating and three-phase current since, in one embodiment, this SMI board 4 controls the power supply to a motor with three separate windings.
  • the common plane 31 is parallel to the plane in which the SMI card 4 extends.
  • the direct current is supplied to the SMI board 4 from a high voltage electrical source (not shown), in particular an electric motor supply battery which moves a vehicle in which the case 20 is located.
  • a high voltage electrical source (not shown), in particular an electric motor supply battery which moves a vehicle in which the case 20 is located.
  • the voltage supplied by this electrical source high voltage is for example between 80 and 600 volts.
  • the mechanical support system 1 as schematically represented in FIG. 1, has, according to the invention, at least one protrusion 11 which extends in a direction transverse to the plane 31 and which is able to press the SMI card 4 against the surface 2 of the housing 20 to ensure a heat transfer 6 of the SMI card 4 to the housing 20.
  • the direction in which the protrusion extends 1 1 is, in particular, perpendicular to the plane 31, that is to say it is parallel to the axis oz and the protrusion 11 extends in this case in a rectilinear plane.
  • the invention covers the case where the protrusion 11 is inclined with respect to the plane 31.
  • the protrusion 11 is for example integral with the body 19 of the mechanical support system 1. It is understood here that the protrusion 11 and the body 19 are made unitarily, that is to say they are molded simultaneously from the same material. This material is, advantageously, a plastic material chosen for its electrical insulation and rigidity qualities in order to maintain the SMI board 4.
  • the protrusion 11 is, in particular, full of material, that is to say that it does not have an opening crossing it.
  • the mechanical support system 1 is also attached to the housing 20 by means of one or more fasteners 12, including screws 12 '. These screws 12 'pass through holes 37 present in eyelets 13 protruding from a periphery of the mechanical support system 1 in particular projecting from the body 19.
  • the eyelets 13 extend, in particular, in a plane parallel to the common plane 31.
  • the mechanical support system 1 could also be fixed on the housing 20, for example, by riveting or gluing.
  • the mechanical support system 1 comprises four eyelets 13.
  • the transistors 5 present on the SMI board 4 transform the direct current into an alternating and three-phase current intended to power an electric motor. During this "chopping" operation of the AC and three-phase direct current, heat is released by the transistors 5. This heat must be dissipated in order to avoid overheating of the electrical power components and in particular the transistors 5.
  • L protrusion 11 of the mechanical support system 1 presses the SMI card 4 so as to keep it in contact with the surface 2 of the housing 20. Thus, the protrusion 11 plates the SMI card 4 against the surface 2 of the housing 20 so that the heat transfer 6 between the SMI card 4 and the housing 20 can take place.
  • the mechanical support system 1 may comprise one or more protrusions 11, extending in a plane inclined with respect to the plane 31. According to an exemplary embodiment of the invention and as visible in Figure 1, the protrusion, is, in particular, on the periphery of the mechanical support system 1, in particular on the periphery of the main body 19.
  • peripheral protrusion 11 located on the periphery of the mechanical support system 1, peripheral protrusion 11 '. It is understood that the peripheral protrusion 1 'is born on the periphery of the mechanical support system 1 and plate, at a distal end 14 of the peripheral protrusion 11', the card SMI 4 against the surface 2 of the housing 20.
  • the peripheral protrusion 11 ' maintains the SMI card 4 at a peripheral edge 16 of the SMI card 4.
  • FIG. 2 shows a detailed view of the location where the distal end 14 of the peripheral protrusion 11 ', plate the SMI card 4 against the surface 2 of the housing 20.
  • the peripheral protrusion 11' has at its distal end 14 a shoulder 15 adapted to cooperate with the peripheral edge 16 of the card SMI 4.
  • the shoulder 15 corresponds, for example, to a notch made at the distal end 14 of the peripheral protrusion 11 '.
  • the shoulder 15 has, in particular, two mutually perpendicular surfaces, extending respectively in a plane parallel and in a plane perpendicular to the plane 31 defined by the axes ox and oy, and able to conform to two surfaces of the peripheral edge 16 ' extending in the same planes as the two surfaces of the shoulder 15 described above.
  • the protrusion 11 lies, in particular, on an intermediate zone of the mechanical holding system 1, in particular of the main body 19.
  • the protrusion, located on the intermediate zone of the mechanical support system 1, intermediate protrusion 11 ", the mechanical support system 1 may thus comprise at least the peripheral protrusion 11 'and / or at least the intermediate protrusion 11".
  • the intermediate zone of the mechanical holding system 1 is understood to mean an area delimited by the periphery of the mechanical holding system 1, in particular of the main body 19.
  • the intermediate protrusion 11 extends in a volume delimited by the peripheral growth 1 1 'and divides this volume in two
  • the mechanical support system 1 comprises several intermediate excrescences 1 1 ", they share the volume delimited by the peripheral protrusion 11' in several volumes.
  • the intermediate protrusion 11 can press the SMI card 4 at an intermediate zone of the SMI card 4, in particular in the middle of the SMI card 4.
  • the intermediate protrusion 1 1 thus proposes a resumption of efforts of the mechanical support system 1 on the intermediate zone of the SMI card 4, in particular in the middle, to ensure contact with the housing 20, possibly in addition to the proposed force recovery at the periphery of the SMI card 4 by the peripheral protrusion 11 'of the mechanical support system 1.
  • This intermediate protrusion 11 "extends, in particular, from a first flank 21 of the peripheral protrusion 11 'to a second flank 22 of the peripheral protrusion 11'.
  • the main body 19 of the mechanical holding system 1 is rectangular.
  • the peripheral protrusion 1 1 ' which follows the periphery of the mechanical support system 1 is also rectangular.
  • the intermediate protrusion 11 "extends in this case from the first flank 21 of the peripheral outgrowth 11 'corresponding to a first large side of the rectangle towards the second flank 22 of the peripheral outgrowth 1' corresponding to a second major
  • the intermediate protrusion 1 1 "divides the mechanical holding system 1 into two parts and thus makes it possible to delimit two distinct zones 4a, 4b on the SMI card 4.
  • the card SM I 4 is thus pressed against the surface 2 of the housing 20 by the peripheral protrusion 1 1 'has on the periphery of the body 19 in the form of rectangle and also by the intermediate protrusion 11 ".
  • one of the functions of a mechanical holding system 1 according to the invention is to ensure the mechanical strength of the SMI card 4.
  • the direct electric current coming from the high voltage electrical source is guided towards the SMI board 4 via electrical connectors 17 ', 17 "included in the mechanical holding system 1.
  • another function of the holding system 1 is therefore to carry a electrical energy from a first point to a second point via the conductors 17 ', 17 ".
  • the transistors 5 present on the SMI board 4 transform the direct current into an alternating and three-phase current which is then guided, via at least two secondary electrical conductors 17 ", to an electric motor (not shown
  • the electric motor drives, for example, a compression mechanism of an air conditioning compressor.
  • the primary conductors 17 ' are connected on one side of the body 19 to the high voltage electrical source and on the other side to the SM I board 4.
  • the secondary conductors 17 " are connected on one side of the body 19 to the electric motor and on the other side of the board SM I 4.
  • the mechanical support system 1 ensures the mechanical strength of the conductors 17 ', 17 ".
  • the part of the conductors 17 ', 17 "extending in the common plane 31 is free
  • the conductors 17', 17" are held by the body 19, only present on the periphery of the mechanical support system 1.
  • the primary conductors 17' and secondary 17" are thus at least partly embedded in the body 19. This is in particular a part of the primary conductors 17 'and secondary 17 "which extends in the common plane 31 which is embedded in the body 19.
  • a low voltage control card 7 can be connected to the SMI card 4.
  • the control card 7 is, for example, related to the mechanical holding system. 1, above this one.
  • the control card 7 is fixed to the mechanical holding system 1, in particular with the aid of screws 8.
  • it is for example provided on the mechanical support system 1, reinforcements 8 'able to receive the screws 8.
  • the control card 7 extends for example along the axis ox.
  • the control card 7 receives current from a low voltage electrical source (not shown), in particular a conventional vehicle battery via low voltage conductors 18.
  • a low voltage electrical source not shown
  • a conventional vehicle battery provides the control card 7 with a voltage, for example example, between 5 and 15 volts.
  • the conductors 18 of the control card 7 may also be included in the mechanical holding system 1. These conductors 18 then have characteristics similar to the primary conductors 17 'and secondary 17 ".
  • the card 7 has electrical components 9 controlling the transistors 5 located on the SMI card 4, via intermediate connectors 10 going from the control card 7 to the SMI card 4.
  • the SMI 4 and control cards 7 comprise printed circuits that connect together the various elements arranged on the cards 4, 7 (electrical power components, control, intermediate connector 10, transistors 5, electrical conductors).
  • the whole map SMI 4 and the map 7 is called inverter 32. It is therefore the inverter 32 that drives and electrically controls the electric motor to which the SMI card 4 is connected.
  • the mechanical holding system 1 may also comprise a signal connector 23.
  • This signal connector 23 makes it possible to interface the control card 7 with external circuits.
  • the signal connector 23 is located at a longitudinal end of the mechanical holding system 1. In the case where the mechanical holding system 1 is rectangular, the signal connector 23 is located, for example, at the first small side 24 of the rectangle.
  • the signal connector 23 is located in a piece integral with the body 19 of the mechanical holding system 1 and projecting from the short side 24.
  • the mechanical support system 1 may further comprise a pre-assembly member 25 with the SMI card 4.
  • the pre-assembly member 25 comprises, for example, an inverted "L" shaped extension 26.
  • a small branch 27 of the extension 26 at “L” originates at the peripheral outgrowth 11 'and extends outwardly of the mechanical support system 1 in a plane parallel to the common plane 31.
  • a large branch 28 of the extension 26 in “L” is transverse to the small branch 27, in particular, perpendicular to the small branch 27.
  • the large branch 28 moves towards the map SMI 4 and exceeds it.
  • a tooth 29 which cooperates with the peripheral edge 6 of the SMI card 4. The pre-assembly member 25 thus staples the mechanical support system 1 to the SMI card 4.
  • the invention also relates to an assembly 35 illustrated in Figures 1 and 3, comprising at least one SMI card 4 and a mechanical holding system 1 as described above.
  • at least one protrusion 1 1 of the mechanical holding system 1 is able to press the SMI card 4 against the surface 2 of the housing 20, in particular at a periphery of the SMI card 4 and in particular on the peripheral edges 16 of the SMI card 4.
  • the protrusion 1 plates the SMI card 4 against the surface 2 of the housing 20 over the entire periphery of the SMI card 4.
  • FIG. 2 also illustrates an aspect of the invention according to which the assembly 35 comprises a resin 36 contained by the protrusion 11 and covering the SMI card 4.
  • the assembly 35 comprises a resin 36 contained by the protrusion 11 and covering the SMI card 4.
  • resin 36 is disposed on the SMI card 4 and that it is maintained via the outgrowth 11.
  • the outgrowth 1 1 thus plays an additional role of mold for the resin 36.
  • the resin 36 When placed on the SMI board 4 the resin 36 is in liquid form. It can thus include electrical components. It stiffens thereafter to form a protective layer against any element that could potentially damage the various electrical components present on the SMI card 4.
  • the intermediate protrusion 11 "divides the assembly 35 into two parts, the intermediate protrusion 11" dividing in particular the SMI card 4 into a first part 4a and a second part 4b. .
  • the resin 36 is an expensive material, it is then possible thanks to the intermediate protrusion 11 "to choose only the part 4a, 4b that it is desired to protect, without having to have the resin 36 on the two parts 4a, 4b Thus, it is then possible to choose to dispose of the resin 36 on the first part 4a, on the second part 4b, or on the two parts 4a, 4b of the card SMI 4.
  • the peripheral protrusion 1 1 'form then a pattern, otherwise called mold, of reduced size, which avoids casting resin 36 throughout the housing 3 but only on the first part 4a and / or the second part 4b.
  • the invention also relates to a method of assembly of an electronic card and a mechanical holding system according to the invention on a surface of a support
  • An example of a method according to the invention relates to the assembly in the housing 20, the SMI card 4 and the mechanical holding system 1 as described p reviously.
  • This method comprises a first step in which the mechanical support system 1 is positioned on the housing 20 so that the protrusion 1 of the mechanical support system 1 plates the SMI card 4 on the surface 2 of the housing 20.
  • This method comprises a second step in which the mechanical support system 1 is fixed on the housing 20. It is fixed in particular by means of the fasteners 12, for example screws 12 'which are screwed through the holes 37 present in the eyelets 13.
  • the assembly 35 furthermore comprises the control card 7.
  • the SMI card 4 and the control card 7 then form an inverter 32. It is then positioned in the housing 20, in a single mounting step, at the both the inverter 32 and the mechanical support system 1.
  • the method according to the invention may be associated with any of the characteristics described above in connection with the mechanical support system 1 or the assembly 35 according to the invention.
  • a mechanical support system 1 finds application in a rotating machine arranged in a vehicle.
  • a machine is for example an electric air conditioning compressor for motor vehicle.
  • a refrigerant fluid is conventionally circulated inside an air conditioning circuit via the compressor.
  • This compressor comprises a housing 20 as described above, which receives the SMI card 4.
  • This housing 20 is then attached to another housing that encloses the electric motor driving a compression mechanism, the electric motor being powered by the SMI card 4 as seen above, itself connected to the high voltage electrical source, for example by the mechanical holding system 1 as described above when it comprises electrical conductors 17 ', 17 ".
  • the system 1 may comprise a pre-assembly member 25.
  • the pre-assembly member 25 has been described in a particular form. However, this pre-assembly member 25 can take any form capable of ensuring a fastening of the system 1, in particular of the body 19, with the card 4 before a plating of the card 4 on the surface 2.
  • the body 19 comprises the pre-assembly member 25.
  • the pre-assembly member 25 is in particular positioned at a distal end of the peripheral protrusion 11 '.
  • the pre-assembly member 25 may be in one piece with the body 19, in particular with the distal end of the peripheral protrusion 11 '.

Abstract

The invention relates to a system for mechanically retaining an electronic board (4) against a surface (2) of a support (20), characterized in that it comprises a main body (19) intended to come to face the electronic board (4) and having at least one protrusion (11) which extends in a direction such as to hold said electronic board (4) against said surface (2), said body (1) further comprising a member (25) for preassembly with the electronic board (4). The invention also relates to an assembly (35) of such a mechanical retention system (1) and of an electronic board (4). The invention also relates to a method for the assembling on a surface (2) of a support (20), of an electronic board (4), and of a mechanical retention system (1) according to the invention.

Description

Système de maintien mécanique, ensemble comprenant un tel système et une carte électronique et procédé d'assemblage sur une surface d'un tel système et d'une telle carte. Le secteur technique de la présente invention est celui des systèmes de maintien de carte électronique sur une surface. Un tel système de maintien se trouve généralement dans une machine tournante pour véhicule automobile comme par exemple un compresseur électrique de climatisation. Une telle machine comprend un boîtier, un moteur électrique, une carte de puissance haute tension, une carte de commande basse tension et des connecteurs électriques.  Mechanical holding system, an assembly comprising such a system and an electronic card and method of assembly on a surface of such a system and such a card. The technical sector of the present invention is that of electronic card holding systems on a surface. Such a holding system is usually found in a rotating machine for a motor vehicle such as an electric air conditioning compressor. Such a machine includes a housing, an electric motor, a high voltage power board, a low voltage control board and electrical connectors.
Une source électrique haute tension est reliée à la carte de puissance par l'intermédiaire de conducteurs électriques. Le courant arrivant sur la carte de puissance est continu. Des composants électriques sont disposés sur la carte de puissance et leur rôle est de transformer le courant continu en courant alternatif. Des connecteurs électriques relient ensuite la carte de puissance au moteur électrique de la machine tournante pour transporter le courant alternatif depuis la carte de puissance vers le moteur électrique. A high voltage power source is connected to the power board via electrical conductors. The current arriving on the power board is continuous. Electrical components are arranged on the power board and their role is to transform the direct current into alternating current. Electrical connectors then connect the power card to the electric motor of the rotating machine to transport the alternating current from the power board to the electric motor.
La carte de commande basse tension est alimentée en revanche par une batterie lui fournissant une alimentation électrique basse tension. Des composants électriques sont également disposés sur la carte de commande basse tension et leur rôle est de commander les composants électriques disposés sur la carte de puissance. Ces commandes sont transmises depuis la carte basse tension vers la carte de puissance, également par l'intermédiaire de conducteurs électriques. The low voltage control board is powered by a battery providing a low voltage power supply. Electrical components are also arranged on the low voltage control board and their role is to control the electrical components arranged on the power board. These commands are transmitted from the low voltage card to the power card, also via electrical conductors.
Du fait des forts courants circulant dans la carte de puissance et du rôle des composants électriques disposés sur celle-ci, la carte de puissance est amenée à chauffer. Il est donc nécessaire de dissiper un maximum de chaleur provenant de cette carte de puissance. Une solution connue consiste à choisir d'une part une carte de puissance comprenant un substrat de dissipation thermique sur lequel sont montés les composants électroniques et d'autre part un boîtier ayant de bonnes propriétés de conduction thermique. La carte de puissance est plaquée contre le boîtier afin de dissiper une partie de la chaleur dégagée par les composants par l'intermédiaire du boîtier. La carte de puissance est typiquement une carte à substrat métallique isolé ou carte SMI. Due to the strong currents flowing in the power board and the role of the electrical components disposed thereon, the power board is caused to heat up. It is therefore necessary to dissipate a maximum of heat from this power card. A known solution is to choose on the one hand a power card comprising a heat dissipation substrate on which are mounted electronic components and on the other hand a housing having good thermal conduction properties. The power board is pressed against the housing to dissipate some of the heat generated by the components through the housing. The power card is typically an isolated metal substrate card or SMI card.
Pour plaquer la carte de puissance contre le boîtier, il est connu de faire des trous dans la carte de puissance, des trous dans le boîtier et ensuite de visser la carte de puissance sur le boîtier. Les vis sont typiquement en un matériau métallique afin d'assurer un contact résistant mécaniquement entre la carte et le boîtier. Pour des raisons d'isolation électrique, la carte présente une distance de sécurité entre les trous et la partie intérieure de la carte comportant les composants. Une portion de la carte n'est donc pas disponible pour le placement des composants électroniques et le routage des interconnexions entre les composants. En outre, l'étape de perçage de la carte et du boîtier complexifie le procédé de fabrication. To press the power card against the housing, it is known to make holes in the power card, holes in the housing and then screw the power card on the housing. The screws are typically made of a metal material to provide a mechanically strong contact between the board and the case. For reasons of electrical insulation, the card has a safety distance between the holes and the inner part of the board containing the components. A portion of the map is therefore not available for the placement of electronic components and the routing of interconnections between components. In addition, the piercing step of the card and the box complicates the manufacturing process.
L'invention a pour but de surmonter les problèmes précités. The object of the invention is to overcome the aforementioned problems.
Elle propose à cet effet un système de maintien mécanique d'une carte électronique contre une surface d'un support, caractérisé en ce qu'il comprend un corps principal destiné à venir en vis-à-vis de la carte électronique et ayant au moins une excroissance qui s'étend suivant une direction de sorte à maintenir ladite carte électronique contre ladite surface. Ainsi, grâce à l'invention, il n'est plus nécessaire de visser ou de fixer par tout autre organe de fixation connu la carte électronique à la surface. Le système de maintien assure ce rôle en venant plaquer la carte électronique contre la surface du support. En particulier, le corps principal est destiné à être fixé au support. L'excroissance s'étend suivant une direction en s'éloignant du corps principal.It proposes for this purpose a system for mechanically holding an electronic card against a surface of a support, characterized in that it comprises a main body intended to come opposite the electronic card and having at least a protrusion which extends in one direction so as to maintain said electronic card against said surface. Thus, thanks to the invention, it is no longer necessary to screw or fix by any other known fastener the electronic card to the surface. The holding system performs this role by coming to press the electronic card against the surface of the support. In particular, the main body is intended to be fixed to the support. The outgrowth extends in one direction away from the main body.
Par exemple, le corps principal a au moins une portion s'étendant sensiblement suivant un plan. La direction suivant laquelle s'étend l'excroissance est transversale à ce plan. En particulier, le support est un boîtier de compresseur, la surface est une surface de dissipation thermique du boîtier et la carte électronique permet une transmission thermique de ses composants vers la surface de dissipation thermique. Grâce à son excroissance, le système de maintien plaque la carte électronique contre la surface de dissipation thermique en vue d'assurer un transfert thermique de la carte vers la surface. Ainsi, il n'est pas nécessaire de percer la carte et la surface. La chaleur de composants de la carte électronique est transmise à travers la surface de dissipation thermique à un fluide du compresseur en vue de refroidir les composants de la carte électronique. For example, the main body has at least one portion extending substantially in a plane. The direction along which the protuberance extends is transverse to this plane. In particular, the support is a compressor housing, the surface is a thermal dissipation surface of the housing and the electronic card allows thermal transmission of its components to the heat dissipation surface. With its protrusion, the holding system plate the electronic card against the heat dissipation surface to ensure a thermal transfer of the card to the surface. Thus, it is not necessary to pierce the card and the surface. The heat of the components of the electronic board is transmitted through the heat dissipation surface to a compressor fluid for cooling the components of the electronic board.
Selon un aspect de l'invention, le corps et l'excroissance sont électriquement isolants. Ainsi, il n'est pas nécessaire de laisser une distance de sécurité autour d'une extrémité distale de l'excroissance touchant la carte. Par exemple, le corps et l'excroissance sont en un matériau plastique. Les matériaux plastiques possèdent en effet les caractéristiques isolantes nécessaires permettant d'isoler électriquement la carte électronique tout en étant assez rigides pour permettre à l'excroissance d'assurer son rôle de plaquage de la carte électronique contre la surface de support. Avantageusement, ladite excroissance est issue du corps. Autrement dit, le corps et l'excroissance sont d'un même tenant. According to one aspect of the invention, the body and the protrusion are electrically insulating. Thus, it is not necessary to leave a safety distance around a distal end of the protrusion touching the card. For example, the body and the protrusion are made of a plastic material. Plastic materials have the necessary insulating characteristics to electrically isolate the electronic card while being rigid enough to allow the projection to ensure its role of plating the electronic card against the support surface. Advantageously, said outgrowth is derived from the body. In other words, the body and the excrescence are of the same holding.
Par exemple, l'excroissance s'étend depuis le corps principal de sorte qu'une extrémité distale de l'excroissance vienne sur une périphérie de la carte électronique. For example, the protrusion extends from the main body so that a distal end of the protrusion comes on a periphery of the electronic card.
Avantageusement, ladite extrémité distale possède un épaulement destiné à coopérer avec un bord périphérique de la carte électronique. Cet épaulement permet de positionner de manière précise le système de maintien mécanique par rapport à la carte électronique grâce notamment à sa complémentarité de forme avec le bord périphérique de la carte électronique. Advantageously, said distal end has a shoulder intended to cooperate with a peripheral edge of the electronic card. This shoulder makes it possible to accurately position the mechanical holding system relative to the electronic card thanks in particular to its complementary shape with the peripheral edge of the electronic card.
Dans un autre exemple, l'excroissance s'étend depuis le corps principal de sorte qu'une extrémité distale de l'excroissance vienne sur une portion non périphérique de la carte électronique. In another example, the protrusion extends from the main body so that a distal end of the protrusion comes to a non device of the electronic card.
Selon un aspect de l'invention, l'excroissance est une excroissance périphérique s'étendant depuis une périphérie du corps principal. According to one aspect of the invention, the outgrowth is a peripheral outgrowth extending from a periphery of the main body.
Selon un autre aspect de l'invention, l'excroissance est une excroissance intermédiaire s'étendant depuis une zone intermédiaire du corps principal. On notera que l'excroissance intermédiaire se distingue de l'excroissance périphérique en ce qu'elle s'étend depuis une portion non périphérique du corps principal, cette portion non périphérique formant ladite zone intermédiaire. According to another aspect of the invention, the outgrowth is an intermediate protrusion extending from an intermediate zone of the main body. It will be noted that the intermediate protrusion differs from the peripheral protrusion in that it extends from a non-peripheral portion of the main body, this non-peripheral portion forming said intermediate zone.
Selon un aspect de l'invention, le système comprend l'excroissance périphérique et l'excroissance intermédiaire. According to one aspect of the invention, the system comprises the peripheral outgrowth and the intermediate excrescence.
Selon une variante, l'excroissance intermédiaire n'est pas en contact avec l'excroissance périphérique et forme ainsi un point d'appui de la carte électronique sur la surface. Une telle solution forme une reprise d'effort mécanique par exemple au centre de la carte électronique.  According to one variant, the intermediate protrusion is not in contact with the peripheral protuberance and thus forms a fulcrum of the electronic card on the surface. Such a solution forms a mechanical stress recovery for example in the center of the electronic card.
Selon une autre variante, l'excroissance intermédiaire est en contact avec l'excroissance périphérique. En particulier, l'excroissance intermédiaire s'étend entre deux flancs de l'excroissance périphérique. De cette manière, l'excroissance intermédiaire divise en deux parties le système de maintien mécanique et divise également la carte électronique contre laquelle elle appuie. Avantageusement, l'excroissance intermédiaire est moulée simultanément avec l'excroissance périphérique.  According to another variant, the intermediate protrusion is in contact with the peripheral protrusion. In particular, the intermediate protrusion extends between two flanks of the peripheral outgrowth. In this way, the intermediate protrusion divides the mechanical support system into two parts and also divides the electronic card against which it is supported. Advantageously, the intermediate protrusion is molded simultaneously with the peripheral protrusion.
Selon un autre aspect de l'invention, l'excroissance est une paroi. Ainsi, l'effort exercé par l'excroissance est réparti sur une surface de la carte électronique. Le maintien de la carte est renforcé. Selon encore un autre aspect de l'invention, l'excroissance est une tige. Ainsi, l'excroissance peut exercer un effort en un point de la carte électronique, par exemple entre deux composants de la carte électronique. Selon un exemple de réalisation, le corps principal a une forme sensiblement rectangulaire. According to another aspect of the invention, the protuberance is a wall. Thus, the force exerted by the protrusion is distributed on a surface of the electronic card. The maintenance of the card is reinforced. According to yet another aspect of the invention, the outgrowth is a rod. Thus, the protrusion can exert a force at a point on the electronic card, for example between two components of the electronic card. According to an exemplary embodiment, the main body has a substantially rectangular shape.
Avantageusement, le corps comprend au moins un œillet traversé par un trou en vue d'y disposer un organe de fixation destiné à solidariser le système sur le support. Advantageously, the body comprises at least one eyelet through which a hole for disposing a fixing member for securing the system on the support.
Selon un aspect de l'invention, ledit système comprend un organe de préassemblage avec la carte électronique. Grâce à l'organe de pré-assemblage, il est possible de pré-assembler le système de maintien avec la carte électronique avant de les disposer sur la surface de support, ladite excroissance assurant toujours son rôle de plaquage de la carte électronique contre la surface. According to one aspect of the invention, said system comprises a preassembly member with the electronic card. Thanks to the pre-assembly member, it is possible to pre-assemble the holding system with the electronic card before disposing them on the support surface, said protrusion still ensuring its role of plating the electronic card against the surface .
Selon un mode de réalisation de l'invention, le système comprend en outre des conducteurs électriques destinés à conduire un courant entre la carte électronique et l'extérieur de la carte électronique, lesdits conducteurs électriques étant maintenus ensemble par ledit corps principal, notamment au niveau du plan dans lequel s'étend au moins une portion du corps principal. According to one embodiment of the invention, the system further comprises electrical conductors intended to conduct a current between the electronic card and the outside of the electronic card, said electrical conductors being held together by said main body, particularly at the of the plane in which at least a portion of the main body extends.
Par exemple, lesdits conducteurs s'étendent au moins dans un plan commun. Par exemple, lesdits conducteurs électriques sont au moins en partie noyés dans le corps principal.  For example, said conductors extend at least in a common plane. For example, said electrical conductors are at least partially embedded in the main body.
On comprend donc que le système selon l'invention assure son rôle de maintien mécanique d'une carte électronique, notamment en vue de garantir le transfert thermique entre la carte électronique et une surface de boîtier de compresseur, et assure aussi un rôle supplémentaire qui consiste à transporter des courants électriques (continu et alternatif) vers et depuis la carte électronique. It is thus clear that the system according to the invention performs its role of mechanically maintaining an electronic card, in particular in order to guarantee the thermal transfer between the electronic card and a surface of the compressor casing, and also provides an additional role which consists of to carry electric currents (continuous and alternating) to and from the electronic board.
Dans une variante de ce mode de réalisation, l'extrémité distale des connecteurs électriques est située à une distance du corps principal supérieure à la distance de l'extrémité distale de l'excroissance. Ainsi, lorsque le système de maintien vient sur la carte électronique, les connecteurs exercent sur elle une contrainte. Ainsi, les soudures des connecteurs sur la carte électronique sont renforcées. In an alternative embodiment of this embodiment, the distal end of the electrical connectors is located at a distance from the main body greater than the distance from the distal end of the protrusion. Thus, when the holding system comes on the electronic card, the connectors exert on it a constraint. Thus, the welds of the connectors on the electronic board are strengthened.
Dans un exemple particulier de cette variante, le système comprend en outre des organes d'assemblage. Ainsi , le système permet un maintien et une précontrainte des connecteurs avant un montage sur la surface de support. Ainsi, les connecteurs peuvent être soudés à la carte électronique avant le montage sur la surface. On évite donc des difficultés de soudage liées à l'environnement de la surface, en particulier lorsque la surface est une portion d'un boîtier de compresseur.  In a particular example of this variant, the system further comprises assembly members. Thus, the system allows holding and prestressing the connectors before mounting on the support surface. Thus, the connectors can be soldered to the electronic board before mounting on the surface. This avoids welding difficulties related to the environment of the surface, particularly when the surface is a portion of a compressor housing.
Dans un exemple particulier de ce mode de réalisation, le système comprend au moins deux conducteurs électriques primaires destinés à être parcourus par un courant continu et au moins deux conducteurs électriques secondaires destinés à être parcourus par un courant alternatif, lesdits conducteurs électriques primaires et secondaires étant au moins en partie noyés dans le corps. Ainsi le système peut conduire du courant continu depuis une batterie d'alimentation haute tension vers la carte électronique par l'intermédiaire des conducteurs électriques primaires et du courant alternatif transformé par la carte électronique depuis la carte électronique vers un moteur électrique par l'intermédiaire des conducteurs électriques secondaires. On notera que les termes « primaire » et « secondaire » sont employés pour différencier les conducteurs électriques et ne définissent pas d'ordre d'importance entre ces conducteurs. In a particular example of this embodiment, the system comprises at least two primary electrical conductors intended to be traversed by a direct current and at least two secondary electrical conductors intended to be traversed by an alternating current, said primary and secondary electrical conductors being at least partly drowned in the body. Thus, the system can conduct direct current from a high voltage power supply battery to the electronic card via the primary electrical conductors and the alternating current transformed by the electronic card from the electronic card to an electric motor via the secondary electrical conductors. It should be noted that the terms "primary" and "secondary" are used to differentiate electrical conductors and do not define order of importance between these conductors.
Selon un exemple particulier de ce mode de réalisation, ledit système comprend un connecteur signal. Le système intègre donc une fonction supplémentaire pour supporter le connecteur signal ce qui permet, notamment, d'optimiser l'encombrement du système et du connecteur signal par rapport à une solution où ils seraient séparés. According to a particular example of this embodiment, said system comprises a signal connector. The system therefore incorporates an additional function to support the signal connector which allows, in particular, to optimize the size of the system and the signal connector relative to a solution where they would be separated.
L'invention concerne également un ensemble d'une carte électronique et d'un système de maintien mécanique tel que décrit précédemment. Selon l'invention, au moins une excroissance du système de maintien est destinée à maintenir la carte électronique contre une surface d'un support. The invention also relates to a set of an electronic card and a mechanical holding system as described above. According to the invention, at least one protrusion of the holding system is intended to hold the electronic card against a surface of a support.
En particulier, la carte électronique permet une transmission thermique de ses composants vers la surface de support, notamment lorsque la surface est une surface de dissipation thermique. In particular, the electronic card allows a thermal transmission of its components to the support surface, especially when the surface is a heat dissipation surface.
Par exemple, la carte électronique comprend des composants électroniques et un substrat de dissipation thermique sur lequel sont montés les composants.  For example, the electronic board includes electronic components and a heat sink substrate on which the components are mounted.
Le substrat de dissipation thermique est par exemple une couche de céramique. The heat dissipation substrate is for example a ceramic layer.
L'épaisseur de la couche de céramique est par exemple de 1 ,6 mm. The thickness of the ceramic layer is, for example, 1.6 mm.
La carte électronique est par exemple une carte SMI (substrat métallique isolé). Le substrat est alors une couche métallique séparée des composants par une couche isolante électriquement.  The electronic card is for example an SMI card (insulated metal substrate). The substrate is then a metal layer separated from the components by an electrically insulating layer.
Dans un exemple, l'excroissance est une paroi qui vient en appui sur une périphérie de la carte électronique. Ainsi, l'excroissance plaque la carte électronique contre la surface sur toute la périphérie de la carte. En répartissant les efforts transmis du système de maintien sur la carte, on optimise le contact entre la carte électronique et la surface. En particulier, lorsque la surface est une surface de dissipation thermique, notamment d'un boîtier de compresseur, le transfert thermique entre la carte électronique et la surface de dissipation thermique en est amélioré. In one example, the protrusion is a wall that bears on a periphery of the electronic card. Thus, the protrusion plate the electronic card against the surface on the entire periphery of the card. By distributing the transmitted forces of the holding system on the card, the contact between the electronic card and the surface is optimized. In particular, when the surface is a heat dissipation surface, in particular a compressor housing, the heat transfer between the electronic card and the heat dissipation surface is improved.
Selon un autre aspect de l'invention, ledit ensemble comprend une résine contenue par l'excroissance et couvrant au moins une partie de la carte électronique. L'excroissance rempli ainsi un rôle de moule pour la résine. La résine est positionnée sur la carte électronique, notamment, pour protéger les composants électroniques présents sur la carte électronique. Avantageusement, ledit système comprend une excroissance intermédiaire divisant ledit ensemble en deux parties, ladite résine étant contenue dans au moins une des deux parties. According to another aspect of the invention, said assembly comprises a resin contained by the protrusion and covering at least a part of the electronic card. The protrusion thus fulfills a role of mold for the resin. The resin is positioned on the electronic card, in particular to protect the electronic components present on the electronic card. Advantageously, said system comprises an intermediate protrusion dividing said assembly into two parts, said resin being contained in at least one of the two parts.
L'invention concerne en outre un procédé d'assemblage sur une surface d'un support, d'une carte électronique et d'un système de maintien mécanique tel que décrit précédemment. Selon l'invention : The invention further relates to a method of assembly on a surface of a support, an electronic card and a mechanical holding system as described above. According to the invention:
- on positionne ledit système sur ladite surface de sorte qu'au moins une excroissance dudit système maintient la carte électronique sur la surface ; - on fixe ledit système sur le support. positioning said system on said surface so that at least one protrusion of said system holds the electronic card on the surface; - Fixing said system on the support.
L'invention permet ainsi de gagner du temps lors du procédé d'assemblage puisqu'il n'est plus nécessaire d'avoir une étape de perçage de la carte électronique et du support. The invention thus saves time during the assembly process since it is no longer necessary to have a step of drilling the electronic card and the support.
Selon un aspect de l'invention, on positionne la carte électronique sur la surface préalablement au positionnement dudit système sur la surface. Alternativement, on pré-assemble ledit système avec ladite carte électronique préalablement au positionnement dudit système sur la surface à l'aide de l'organe de pré-assemblage formé sur le système. According to one aspect of the invention, the electronic card is positioned on the surface prior to the positioning of said system on the surface. Alternatively, one pre-assembles said system with said electronic card prior to the positioning of said system on the surface using the pre-assembly member formed on the system.
L'invention concerne aussi un système de maintien mécanique d'une carte électronique contre une surface d'un support, caractérisé en ce qu'il comprend un corps principal destiné à venir en vis-à-vis de la carte électronique et ayant au moins une excroissance qui s'étend suivant une direction de sorte à maintenir ladite carte électronique contre ladite surface, ledit corps comprenant en outre un organe de préassemblage avec la carte électronique. The invention also relates to a system for mechanically holding an electronic card against a surface of a support, characterized in that it comprises a main body intended to come opposite the electronic card and having at least a protrusion which extends in one direction so as to maintain said electronic card against said surface, said body further comprising a preassembly member with the electronic card.
Ce système de maintien peut présenter l'une quelconque des caractéristiques décrites précédemment qui lui sont compatibles.  This holding system may have any of the features described above that are compatible with it.
Les figures annexées feront bien comprendre comment l'invention peut être réalisée. Sur ces figures, des références identiques désignent des éléments semblables. The appended figures will make it clear how the invention can be realized. In these figures, identical references designate similar elements.
Il faut noter que les figures exposent l'invention de manière détaillée pour mettre en œuvre l'invention, lesdites figures pouvant bien entendu servir à mieux définir l'invention le cas échéant. It should be noted that the figures disclose the invention in detail to implement the invention, said figures can of course be used to better define the invention where appropriate.
La figure 1 illustre schématiquement et en vue de coupe un système de maintien mécanique 1 selon l'invention, une carte électronique 4 ainsi qu'une surface 2 de boîtier 20. La figure 2 illustre dans la même coupe que celle de la figure 1 , une extrémité d'une excroissance 11 du système de maintien mécanique 1 selon l'invention. La figure 3 est une vue en perspective d'un système de maintien mécanique 1 selon l'invention et une carte électronique 4. FIG. 1 schematically illustrates, in sectional view, a mechanical support system 1 according to the invention, an electronic card 4 and a housing surface 20. Figure 2 illustrates in the same section as that of Figure 1, an end of an outgrowth 11 of the mechanical support system 1 according to the invention. FIG. 3 is a perspective view of a mechanical holding system 1 according to the invention and an electronic card 4.
La figure 4 est une vue détaillée en coupe d'un organe de pré assemblage 25, illustré à la figure 3, du système de maintien mécanique 1 avec la carte électronique 4. FIG. 4 is a detailed sectional view of a pre-assembly member 25, illustrated in FIG. 3, of the mechanical holding system 1 with the electronic card 4.
L'invention peut trouver son application dans un support tel qu'un boîtier 20 tel que représenté sur la figure 1. Un tel boîtier 20 est, par exemple, un boîtier 20 de machine tournante disposée, notamment, dans un véhicule. The invention can be applied in a support such as a housing 20 as shown in FIG. 1. Such a housing 20 is, for example, a rotary machine housing 20 arranged, in particular, in a vehicle.
Le boîtier 20 possède un évidement 3 apte à recevoir une carte de puissance haute tension, telle qu'une carte à substrat métallique isolé ou carte SMI 4. Dans la suite de la description, nous l'appellerons carte SMI 4. Un système de maintien mécanique 1 selon l'invention vient en vis-à-vis de la carte SMI 4 afin de la maintenir contre une surface 2 du boîtier 20. La surface 2 est notamment une surface de dissipation thermique. The housing 20 has a recess 3 adapted to receive a high voltage power card, such as an insulated metal substrate card or SMI card 4. In the remainder of the description, we will call it card SMI 4. A holding system mechanical 1 according to the invention comes in vis-à-vis the SMI card 4 to hold against a surface 2 of the housing 20. The surface 2 is in particular a heat dissipation surface.
Le système de maintien mécanique 1 comprend un corps principal 19, électriquement isolant. Le corps principal 19 a une portion s'étendant sensiblement suivant un plan 31 , dit plan commun. Le corps principal 19 vient en vis-à-vis de la carte SMI 4. The mechanical support system 1 comprises a main body 19, electrically insulating. The main body 19 has a portion extending substantially along a plane 31, called the common plane. The main body 19 comes opposite the SMI card 4.
Dans un mode de réalisation, le corps 19 présente des ouvertures dans le plan commun 31. Par exemple, le corps 19 est présent uniquement sur la périphérie du système de maintien mécanique 1 comme représenté sur la figure 3, formant ainsi un cerclage.  In one embodiment, the body 19 has openings in the common plane 31. For example, the body 19 is present only on the periphery of the mechanical holding system 1 as shown in Figure 3, thus forming a strapping.
Dans un autre mode de réalisation représenté à la figure 1 , le corps 19 est plein suivant le plan commun 31 , c'est-à-dire que la matière constituant le corps 19 s'étend dans le plan commun 31 sans qu'il y ait d'ouverture transversale au plan 31 présente dans celui-ci. In another embodiment shown in FIG. 1, the body 19 is solid along the common plane 31, that is to say that the material constituting the body 19 extends in the common plane 31 without there being has transverse opening to plane 31 present in this one.
Par convention et pour simplifier la description du système de maintien mécanique 1 et des autres éléments selon l'invention, on forme un repère cartésien (x, y, z) et on définit la direction o-x comme étant la direction de la longueur de la portion du corps principal 19 s'étendant sensiblement suivant le plan 31 , o-y la direction de la largeur de cette portion, et o-z la direction perpendiculaire au plan défini par les directions o-x et o-y. La carte SMI 4 comprend des composants électriques de puissance, par exemple, des transistors 5 dont le rôle est de transformer du courant continu en courant alternatif et triphasé puisque, dans un exemple de réalisation, cette carte SMI 4 contrôle l'alimentation électrique d'un moteur à trois bobinages distincts. Notamment, le plan commun 31 est parallèle au plan dans lequel s'étend la carte SMI 4. By convention and to simplify the description of the mechanical support system 1 and the other elements according to the invention, a Cartesian coordinate system (x, y, z) is formed and the direction ox is defined as being the direction of the length of the portion. the main body 19 extending substantially along the plane 31, oy the direction of the width of this portion, and oz the direction perpendicular to the plane defined by the directions ox and oy. The SMI board 4 comprises electrical power components, for example, transistors whose role is to transform direct current into alternating and three-phase current since, in one embodiment, this SMI board 4 controls the power supply to a motor with three separate windings. In particular, the common plane 31 is parallel to the plane in which the SMI card 4 extends.
Le courant continu est fourni à la carte SMI 4 depuis une source électrique haute tension (non représentée), notamment, une batterie d'alimentation de moteur électrique qui déplace un véhicule dans lequel se trouve le boîtier 20. La tension fournie par cette source électrique haute tension est par exemple comprise entre 80 et 600 Volt. The direct current is supplied to the SMI board 4 from a high voltage electrical source (not shown), in particular an electric motor supply battery which moves a vehicle in which the case 20 is located. The voltage supplied by this electrical source high voltage is for example between 80 and 600 volts.
Le système de maintien mécanique 1 tel que représenté schématiquement à la figure 1 , présente selon l'invention, au moins une excroissance 11 qui s'étend dans une direction transversale au plan 31 et qui est apte à plaquer la carte SMI 4 contre la surface 2 du boîtier 20 en vue d'assurer un transfert thermique 6 de la carte SMI 4 vers le boîtier 20. La direction dans laquelle s'étend l'excroissance 1 1 est, notamment, perpendiculaire au plan 31 , c'est-à-d ire parallèle à l'axe o-z et l'excroissance 11 s'étend dans ce cas dans un plan rectiligne. Bien entendu, l'invention couvre le cas où l'excroissance 11 est inclinée par rapport au plan 31. The mechanical support system 1 as schematically represented in FIG. 1, has, according to the invention, at least one protrusion 11 which extends in a direction transverse to the plane 31 and which is able to press the SMI card 4 against the surface 2 of the housing 20 to ensure a heat transfer 6 of the SMI card 4 to the housing 20. The direction in which the protrusion extends 1 1 is, in particular, perpendicular to the plane 31, that is to say it is parallel to the axis oz and the protrusion 11 extends in this case in a rectilinear plane. Of course, the invention covers the case where the protrusion 11 is inclined with respect to the plane 31.
L'excroissance 11 est par exemple venue de matière avec le corps 19 du système de maintien mécanique 1. On comprend ici que l'excroissance 11 et le corps 19 sont réalisés de manière unitaire, c'est-à-dire qu'ils sont moulés simultanément à partir d'un même matériau. Ce matériau est, avantageusement, un matériau plastique, choisi pour ses qualités d'isolation électrique et de rigidité afin de maintenir la carte SMI 4. L'excroissance 11 est, notamment, pleine de matière, c'est- à-dire qu'elle ne présente pas d'ouverture la traversant. The protrusion 11 is for example integral with the body 19 of the mechanical support system 1. It is understood here that the protrusion 11 and the body 19 are made unitarily, that is to say they are molded simultaneously from the same material. This material is, advantageously, a plastic material chosen for its electrical insulation and rigidity qualities in order to maintain the SMI board 4. The protrusion 11 is, in particular, full of material, that is to say that it does not have an opening crossing it.
Le système de maintien mécanique 1 est par ailleurs fixé au boîtier 20 grâce à un ou plusieurs organes de fixation 12, notamment des vis 12'. Ces vis 12' passent à travers des trous 37 présents dans des œillets 13, en saillie par rapport à une périphérie du système de maintien mécanique 1 notamment en saillie par rapport au corps 19. Les oeillets 13 s'étendent, notamment, dans un plan parallèle au plan commun 31. Le système de maintien mécanique 1 pourrait également être fixé sur le boîtier 20, par exemple, par rivetage ou par collage. Notamment le système de maintien mécanique 1 comprend quatre œillets 13. The mechanical support system 1 is also attached to the housing 20 by means of one or more fasteners 12, including screws 12 '. These screws 12 'pass through holes 37 present in eyelets 13 protruding from a periphery of the mechanical support system 1 in particular projecting from the body 19. The eyelets 13 extend, in particular, in a plane parallel to the common plane 31. The mechanical support system 1 could also be fixed on the housing 20, for example, by riveting or gluing. In particular, the mechanical support system 1 comprises four eyelets 13.
L'avantage du système de maintien mécanique 1 selon l'invention sera mieux compris dans ce qui suit. The advantage of the mechanical support system 1 according to the invention will be better understood in what follows.
Les transistors 5 présents sur la carte SMI 4 transforment le courant continu en un courant alternatif et triphasé destiné à alimenter un moteur électrique. Pendant cette opération de « hachage » du courant continu en courant alternatif et triphasé, de la chaleur est dégagée par les transistors 5. Cette chaleur doit être dissipée afin d'éviter la surchauffe des composants électriques de puissance et en particulier des transistors 5. L'excroissance 11 du système de maintien mécanique 1 appuie sur la carte SMI 4 de manière à la maintenir en contact avec la surface 2 du boîtier 20. Ainsi, l'excroissance 11 plaque la carte SMI 4 contre la surface 2 du boîtier 20 pour que le transfert thermique 6 entre la carte SMI 4 et le boîtier 20 puisse avoir lieu. The transistors 5 present on the SMI board 4 transform the direct current into an alternating and three-phase current intended to power an electric motor. During this "chopping" operation of the AC and three-phase direct current, heat is released by the transistors 5. This heat must be dissipated in order to avoid overheating of the electrical power components and in particular the transistors 5. L protrusion 11 of the mechanical support system 1 presses the SMI card 4 so as to keep it in contact with the surface 2 of the housing 20. Thus, the protrusion 11 plates the SMI card 4 against the surface 2 of the housing 20 so that the heat transfer 6 between the SMI card 4 and the housing 20 can take place.
On peut choisir en outre une carte SMI 4 et un boîtier 20 présentant des propriétés de conduction thermique améliorant le refroidissement des composants. Par exemple, le boîtier 20 est en métal, et en particulier en aluminium ou en alliage d'aluminium, voire du cuivre. La chaleur des composants est ainsi transmise au boîtier 20 par l'intermédiaire de la carte SMI 4 et ce transfert de chaleur est représenté sur la figure 1 par la flèche 6. Le système de maintien mécanique 1 selon l'invention peut comprendre une ou plusieurs excroissances 11 , s'étendant dans un plan incliné par rapport au plan 31. Selon un exemple de réalisation de l'invention et comme visible à la figure 1 , l'excroissance , se situe, notamment, sur la périphérie du système de maintien mécanique 1 , en particulier sur la périphérie du corps principal 19. On appelle l'excroissance, située sur la périphérie du système de maintien mécanique 1 , excroissance périphérique 11'. On comprend par là, que l'excroissance périphérique 1 ' naît sur la périphérie du système de maintien mécanique 1 et plaque, au niveau d'une extrémité distale 14 de l'excroissance périphérique 11', la carte SMI 4 contre la surface 2 du boîtier 20. One can further choose a SMI card 4 and a housing 20 having thermal conduction properties improving the cooling of the components. For example, the housing 20 is made of metal, and in particular aluminum or aluminum alloy, or even copper. The heat of the components is thus transmitted to the casing 20 via the card SMI 4 and this heat transfer is represented in FIG. 1 by the arrow 6. The mechanical support system 1 according to the invention may comprise one or more protrusions 11, extending in a plane inclined with respect to the plane 31. According to an exemplary embodiment of the invention and as visible in Figure 1, the protrusion, is, in particular, on the periphery of the mechanical support system 1, in particular on the periphery of the main body 19. The protrusion, located on the periphery of the mechanical support system 1, peripheral protrusion 11 '. It is understood that the peripheral protrusion 1 'is born on the periphery of the mechanical support system 1 and plate, at a distal end 14 of the peripheral protrusion 11', the card SMI 4 against the surface 2 of the housing 20.
En particulier, l'excroissance périphérique 11' maintient la carte SMI 4 au niveau d'un bord périphérique 16 de la carte SMI 4. La figure 2 montre une vue détaillée de l'endroit où l'extrémité distale 14 de l'excroissance périphérique 11 ', plaque la carte SMI 4 contre la surface 2 du boîtier 20. Selon un aspect de l'invention, l'excroissance périphérique 11 ' possède au niveau de son extrémité distale 14 un épaulement 15 apte à coopérer avec le bord périphérique 16 de la carte SMI 4. L'épaulement 15 correspond, par exemple, à une encoche faite au niveau de l'extrémité distale 14 de l'excroissance périphérique 11 '. L'épaulement 15 possède, notamment, deux surfaces perpendiculaires entre elles, s'étendant respectivement dans un plan parallèle et dans un plan perpendiculaire au plan 31 défini par les axes o-x et o-y, et aptes à épouser deux surfaces du bord périphérique 16 s'étendant dans les mêmes plans que les deux surfaces de l'épaulement 15 décrites précédemment. In particular, the peripheral protrusion 11 'maintains the SMI card 4 at a peripheral edge 16 of the SMI card 4. FIG. 2 shows a detailed view of the location where the distal end 14 of the peripheral protrusion 11 ', plate the SMI card 4 against the surface 2 of the housing 20. According to one aspect of the invention, the peripheral protrusion 11' has at its distal end 14 a shoulder 15 adapted to cooperate with the peripheral edge 16 of the card SMI 4. The shoulder 15 corresponds, for example, to a notch made at the distal end 14 of the peripheral protrusion 11 '. The shoulder 15 has, in particular, two mutually perpendicular surfaces, extending respectively in a plane parallel and in a plane perpendicular to the plane 31 defined by the axes ox and oy, and able to conform to two surfaces of the peripheral edge 16 ' extending in the same planes as the two surfaces of the shoulder 15 described above.
Avantageusement, et comme visible à la figure 3, l'excroissance 11 , se situe, notamment, sur une zone intermédiaire du système de maintien mécanique 1 , en particulier du corps principal 19. On appelle l'excroissance, située sur la zone intermédiaire du système de maintien mécanique 1 , excroissance intermédiaire 11". Le système de maintien mécanique 1 peut ainsi comprendre au moins l'excroissance périphérique 11' et/ou au moins l'excroissance intermédiaire 11". On entend par zone intermédiaire du système de maintien mécanique 1 , une zone délimitée par la périphérie du système de maintien mécanique 1 , notamment du corps principal 19. Autrement dit, l'excroissance intermédiaire 11 " s'étend dans un volume délimité par l'excroissance périphérique 1 1 ' et partage ce volume en deux. Dans le cas où le système de maintien mécanique 1 comprend plusieurs excroissances intermédiaires 1 1 " , elles partagent le volume délimité par l'excroissance périphérique 11 ' en plusieurs volumes. Advantageously, and as can be seen in FIG. 3, the protrusion 11 lies, in particular, on an intermediate zone of the mechanical holding system 1, in particular of the main body 19. The protrusion, located on the intermediate zone of the mechanical support system 1, intermediate protrusion 11 ", the mechanical support system 1 may thus comprise at least the peripheral protrusion 11 'and / or at least the intermediate protrusion 11". The intermediate zone of the mechanical holding system 1 is understood to mean an area delimited by the periphery of the mechanical holding system 1, in particular of the main body 19. In other words, the intermediate protrusion 11 "extends in a volume delimited by the peripheral growth 1 1 'and divides this volume in two In the case where the mechanical support system 1 comprises several intermediate excrescences 1 1 ", they share the volume delimited by the peripheral protrusion 11' in several volumes.
L'excroissance intermédiaire 11 " peut plaquer la carte SMI 4 au niveau d'une zone intermédiaire de la carte SMI 4, notamment, au milieu de la carte SMI 4. L'excroissance intermédiaire 1 1 " propose ainsi une reprise d'efforts du système de maintien mécanique 1 sur la zone intermédiaire de la carte SMI 4, notamment au milieu, pour garantir le contact avec le boîtier 20, éventuellement en supplément de la reprise d'effort proposée en périphérie de la carte SMI 4 par l'excroissance périphérique 11 ' du système de maintien mécanique 1. The intermediate protrusion 11 "can press the SMI card 4 at an intermediate zone of the SMI card 4, in particular in the middle of the SMI card 4. The intermediate protrusion 1 1" thus proposes a resumption of efforts of the mechanical support system 1 on the intermediate zone of the SMI card 4, in particular in the middle, to ensure contact with the housing 20, possibly in addition to the proposed force recovery at the periphery of the SMI card 4 by the peripheral protrusion 11 'of the mechanical support system 1.
Cette excroissance intermédiaire 11 " s'étend, notamment, depuis un premier flanc 21 de l'excroissance périphérique 11' vers un deuxième flanc 22 de l'excroissance périphérique 11'. This intermediate protrusion 11 "extends, in particular, from a first flank 21 of the peripheral protrusion 11 'to a second flank 22 of the peripheral protrusion 11'.
Dans le cas illustré à la figure 3, le corps principal 19 du système de maintien mécanique 1 est de forme rectangulaire. L'excroissance périphérique 1 1 ' qui suit la périphérie du système de maintien mécanique 1 est également rectangulaire. L'excroissance intermédiaire 11 " s'étend dans ce cas depuis le premier flanc 21 de l'excroissance périphérique 11 ' correspondant à un premier grand coté du rectangle vers le deuxième flanc 22 de l'excroissance périphérique 1 1 ' correspondant à un deuxième grand côté du rectangle. L'excroissance intermédiaire 1 1 " divise le système de maintien mécanique 1 en deux parties et permet ainsi de délimiter deux zones distinctes 4a, 4b sur la carte SMI 4. La carte SM I 4 est ainsi plaquée contre la surface 2 du boîtier 20 par l'excroissance périphérique 1 1 ' présente sur la périphérie du corps 19 en forme de rectangle et aussi par l'excroissance intermédiaire 11 ". On a vu précédemment qu'une des fonctions d'un système de maintien mécanique 1 selon l'invention est d'assurer la tenue mécanique de la carte SMI 4. Dans les exemples présentés en figures 1 et 3, le courant électrique continu provenant de la source électrique haute tension est guidé vers la carte SMI 4 par l'intermédiaire de connecteurs électriques 17', 17" compris dans le système de maintien mécanique 1 . Dans ces exemples, une autre fonction du système de maintien 1 est donc de transporter une énergie électrique d'un premier point vers un second point par l'intermédiaire des conducteurs 17', 17". Au moins deux conducteurs électriques primaires 17' sont ainsi destinés à conduire un courant continu depuis la source électrique vers la carte SMI 4. In the case illustrated in Figure 3, the main body 19 of the mechanical holding system 1 is rectangular. The peripheral protrusion 1 1 'which follows the periphery of the mechanical support system 1 is also rectangular. The intermediate protrusion 11 "extends in this case from the first flank 21 of the peripheral outgrowth 11 'corresponding to a first large side of the rectangle towards the second flank 22 of the peripheral outgrowth 1' corresponding to a second major The intermediate protrusion 1 1 "divides the mechanical holding system 1 into two parts and thus makes it possible to delimit two distinct zones 4a, 4b on the SMI card 4. The card SM I 4 is thus pressed against the surface 2 of the housing 20 by the peripheral protrusion 1 1 'has on the periphery of the body 19 in the form of rectangle and also by the intermediate protrusion 11 ". It has been seen previously that one of the functions of a mechanical holding system 1 according to the invention is to ensure the mechanical strength of the SMI card 4. In the examples presented in FIGS. 1 and 3, the direct electric current coming from the high voltage electrical source is guided towards the SMI board 4 via electrical connectors 17 ', 17 "included in the mechanical holding system 1. In these examples, another function of the holding system 1 is therefore to carry a electrical energy from a first point to a second point via the conductors 17 ', 17 ". At least two primary electrical conductors 17 'are thus intended to conduct a direct current from the electrical source to the SMI card 4.
Ainsi, les transistors 5 présents sur la carte SMI 4 transforment le courant continu en un courant alternatif et triphasé qui est ensuite guidé, par l'intermédiaire d'au moins deux conducteurs électriques secondaires 17", jusqu'à un moteur électrique (non représenté) . Le moteur électrique entraîne par exemple un mécanisme de compression d'un compresseur de climatisation. Thus, the transistors 5 present on the SMI board 4 transform the direct current into an alternating and three-phase current which is then guided, via at least two secondary electrical conductors 17 ", to an electric motor (not shown The electric motor drives, for example, a compression mechanism of an air conditioning compressor.
Les conducteurs primaires 17' sont reliés d'un coté du corps 19 à la source électrique haute tension et de l'autre coté à la carte SM I 4. Les conducteurs secondaires 17" sont reliés d'un coté du corps 19 au moteur électrique et de l'autre coté à la carte SM I 4. Le système de maintien mécanique 1 assure la tenue mécanique des conducteurs 17', 17". Les conducteurs 17', 17" s'étendent dans le système de maintien mécanique 1 au moins dans le plan commun 31 , tout en étant maintenus par le système de maintien mécanique 1. The primary conductors 17 'are connected on one side of the body 19 to the high voltage electrical source and on the other side to the SM I board 4. The secondary conductors 17 "are connected on one side of the body 19 to the electric motor and on the other side of the board SM I 4. The mechanical support system 1 ensures the mechanical strength of the conductors 17 ', 17 ". The conductors 17 ', 17 "extend in the mechanical support system 1 at least in the common plane 31, while being held by the mechanical support system 1.
Les conducteurs primaires 17', secondaires 17" sont de forme similaire. Ils s'étendent au moins en partie dans le plan commun 31 et ils possèdent des branches 33 transversales au plan commun 31 connectées à la carte SMI 4. The primary conductors 17 ', secondary 17 "are of similar shape, they extend at least partly in the common plane 31 and they have branches 33 transverse to the common plane 31 connected to the SMI card 4.
En figure 3, la partie des conducteurs 17', 17" s'étendant dans le plan commun 31 est libre. Les conducteurs 17', 17" sont maintenus par le corps 19, uniquement présent sur la périphérie du système de maintien mécanique 1. En figure 1 , il y a de la matière constituant le corps 19 tout autour de la partie des conducteurs 17', 17" s'étendant dans le plan commun 31 . Les conducteurs primaires 17' et secondaires 17" sont ainsi au moins en partie noyés dans le corps 19. C'est en particulier une partie des conducteurs primaires 17' et secondaires 17" qui s'étend dans le plan commun 31 qui est noyée dans le corps 19. In FIG. 3, the part of the conductors 17 ', 17 "extending in the common plane 31 is free The conductors 17', 17" are held by the body 19, only present on the periphery of the mechanical support system 1. In Figure 1, there is material constituting the body 19 all around the portion of the conductors 17 ', 17 "extending in the common plane 31. The primary conductors 17' and secondary 17" are thus at least partly embedded in the body 19. This is in particular a part of the primary conductors 17 'and secondary 17 "which extends in the common plane 31 which is embedded in the body 19.
Afin de commander les opérations, notamment, des transistors 5, une carte de commande 7 basse tension peut être connectée à la carte SMI 4. Comme représenté sur la figure 1 la carte de commande 7 est, par exemple, rapportée au système de maintien mécanique 1 , au dessus de celui-ci. La carte de commande 7 est fixée au système de maintien mécanique 1 , notamment, à l'aide de vis 8. A cet effet, il est par exemple prévu sur le système de maintien mécanique 1 , des renforts 8' aptes à recevoir les vis 8. La carte de commande 7 s'étend par exemple suivant l'axe o-x. In order to control the operations, in particular, transistors 5, a low voltage control card 7 can be connected to the SMI card 4. As shown in FIG. 1, the control card 7 is, for example, related to the mechanical holding system. 1, above this one. The control card 7 is fixed to the mechanical holding system 1, in particular with the aid of screws 8. For this purpose, it is for example provided on the mechanical support system 1, reinforcements 8 'able to receive the screws 8. The control card 7 extends for example along the axis ox.
La carte de commande 7 reçoit du courant depuis une source électrique basse tension (non représentée), notamment, une batterie classique de véhicule par l'intermédiaire de conducteurs basse tension 18. Une telle batterie procure à la carte de commande 7 une tension, par exemple, comprise entre 5 et 15 Volt. The control card 7 receives current from a low voltage electrical source (not shown), in particular a conventional vehicle battery via low voltage conductors 18. Such a battery provides the control card 7 with a voltage, for example example, between 5 and 15 volts.
Les conducteurs 18 de la carte de commande 7 peuvent être également compris dans le système de maintien mécanique 1. Ces conducteurs 18 présentent alors des caractéristiques similaires aux conducteurs primaires 17' et secondaires 17". The conductors 18 of the control card 7 may also be included in the mechanical holding system 1. These conductors 18 then have characteristics similar to the primary conductors 17 'and secondary 17 ".
La carte 7 possède des composants électriques 9 commandant les transistors 5 situés sur la carte SMI 4, par l'intermédiaire de connecteurs intermédiaires 10 allant de la carte de commande 7 à la carte SMI 4. Les cartes SMI 4 et de commande 7 comprennent des circuits imprimés qui connectent entre eux les différents éléments disposés sur les cartes 4, 7 (composants électriques de puissance, de commande, connecteur intermédiaire 10, transistors 5, conducteurs électriques). L'ensemble de la carte SMI 4 et de la carte de commande 7 est appelé onduleur 32. C'est donc l'onduleur 32 qui pilote et contrôle électriquement le moteur électrique auquel la carte SMI 4 est connectée. The card 7 has electrical components 9 controlling the transistors 5 located on the SMI card 4, via intermediate connectors 10 going from the control card 7 to the SMI card 4. The SMI 4 and control cards 7 comprise printed circuits that connect together the various elements arranged on the cards 4, 7 (electrical power components, control, intermediate connector 10, transistors 5, electrical conductors). The whole map SMI 4 and the map 7 is called inverter 32. It is therefore the inverter 32 that drives and electrically controls the electric motor to which the SMI card 4 is connected.
Le système de maintien mécanique 1 peut également comprendre un connecteur signal 23. Ce connecteur signal 23 permet de faire l'interface entre la carte de commande 7 et des circuits extérieurs. Le connecteur signal 23 est situé au niveau d'une extrémité longitudinale du système de maintien mécanique 1. Dans le cas où le système de maintien mécanique 1 est rectangulaire, le connecteur signal 23 est situé, par exemple, au niveau du premier petit coté 24 du rectangle. Le connecteur signal 23 est situé dans une pièce venue de matière avec le corps 19 du système de maintien mécanique 1 et faisant saillie par rapport au petit coté 24. The mechanical holding system 1 may also comprise a signal connector 23. This signal connector 23 makes it possible to interface the control card 7 with external circuits. The signal connector 23 is located at a longitudinal end of the mechanical holding system 1. In the case where the mechanical holding system 1 is rectangular, the signal connector 23 is located, for example, at the first small side 24 of the rectangle. The signal connector 23 is located in a piece integral with the body 19 of the mechanical holding system 1 and projecting from the short side 24.
Le système de maintien mécanique 1 selon l'invention peut en outre comprendre un organe de pré-assemblage 25 avec la carte SMI 4. The mechanical support system 1 according to the invention may further comprise a pre-assembly member 25 with the SMI card 4.
Un tel organe de pré-assemblage 25 est représenté plus en détails sur la figure 4. L'organe de pré-assemblage 25 comprend, par exemple, un prolongement 26 en forme de « L » inversé. Une petite branche 27 du prolongement 26 en « L » naît au niveau de l'excroissance périphérique 11 ' et s'étend vers l'extérieur du système de maintien mécanique 1 dans un plan parallèle au plan commun 31. Une grande branche 28 du prolongement 26 en « L » est transversale à la petite branche 27, notamment, perpendiculaire à la petite branche 27. La grande branche 28 se dirige vers la carte SMI 4 et la dépasse. Au niveau de l'extrémité distale de la grande branche 28 se situe une dent 29 qui vient coopérer avec le bord périphérique 6 de la carte SMI 4. L'organe de pré-assemblage 25 vient ainsi agrafer le système de maintien mécanique 1 à la carte SMI 4. Such a pre-assembly member 25 is shown in more detail in FIG. 4. The pre-assembly member 25 comprises, for example, an inverted "L" shaped extension 26. A small branch 27 of the extension 26 at "L" originates at the peripheral outgrowth 11 'and extends outwardly of the mechanical support system 1 in a plane parallel to the common plane 31. A large branch 28 of the extension 26 in "L" is transverse to the small branch 27, in particular, perpendicular to the small branch 27. The large branch 28 moves towards the map SMI 4 and exceeds it. At the distal end of the large branch 28 is a tooth 29 which cooperates with the peripheral edge 6 of the SMI card 4. The pre-assembly member 25 thus staples the mechanical support system 1 to the SMI card 4.
L'invention concerne aussi un ensemble 35 illustré aux figures 1 et 3, comprenant au moins une carte SMI 4 et un système de maintien mécanique 1 tels que décrits précédemment. Selon l'invention, au moins une excroissance 1 1 du système de maintien mécanique 1 est apte à plaquer la carte SMI 4 contre la surface 2 du boîtier 20, notamment au niveau d'une périphérie de la carte SMI 4 et en particulier sur les bords périphériques 16 de la carte SMI 4. De manière avantageuse, l'excroissance 1 plaque la carte SMI 4 contre la surface 2 du boîtier 20 sur toute la périphérie de la carte SMI 4. The invention also relates to an assembly 35 illustrated in Figures 1 and 3, comprising at least one SMI card 4 and a mechanical holding system 1 as described above. According to the invention, at least one protrusion 1 1 of the mechanical holding system 1 is able to press the SMI card 4 against the surface 2 of the housing 20, in particular at a periphery of the SMI card 4 and in particular on the peripheral edges 16 of the SMI card 4. Advantageously, the protrusion 1 plates the SMI card 4 against the surface 2 of the housing 20 over the entire periphery of the SMI card 4.
La figure 2 illustre également un aspect de l'invention selon lequel l'ensemble 35 comprend une résine 36 contenue par l'excroissance 1 1 et couvrant la carte SMI 4. On entend par là que de la résine 36 est disposée sur la carte SMI 4 et qu'elle est maintenue par l'intermédiaire de l'excroissance 11. L'excroissance 1 1 joue donc ici un rôle supplémentaire de moule pour la résine 36. FIG. 2 also illustrates an aspect of the invention according to which the assembly 35 comprises a resin 36 contained by the protrusion 11 and covering the SMI card 4. By this is meant that resin 36 is disposed on the SMI card 4 and that it is maintained via the outgrowth 11. The outgrowth 1 1 thus plays an additional role of mold for the resin 36.
Lorsqu'elle est disposée sur la carte SMI 4 la résine 36 est sous forme liquide. Elle peut ainsi englober les composants électriques. Elle se rigidifie par la suite pour former une couche protectrice contre tout élément pouvant potentiellement endommager les différents composants électriques présents sur la carte SMI 4.  When placed on the SMI board 4 the resin 36 is in liquid form. It can thus include electrical components. It stiffens thereafter to form a protective layer against any element that could potentially damage the various electrical components present on the SMI card 4.
Dans l'exemple de réalisation illustré à la figure 3, l'excroissance intermédiaire 11 " divise l'ensemble 35 en deux parties. L'excroissance intermédiaire 1 1 " divise notamment la carte SMI 4 en une première partie 4a et une deuxième partie 4b. La résine 36 étant un matériau onéreux, il est alors possible grâce à l'excroissance intermédiaire 11 " de choisir uniquement la partie 4a, 4b que l'on souhaite protéger, sans être obligé de disposer de la résine 36 sur les deux parties 4a, 4b. Ainsi, il est alors possible de choisir de disposer de la résine 36 sur la première partie 4a, sur la deuxième partie 4b, ou sur les deux parties 4a, 4b de la carte SMI 4. L'excroissance périphérique 1 1 ' forme alors un patron, autrement appelé moule, de taille réduite, ce qui évite de couler de la résine 36 dans tout le logement 3 mais uniquement sur la première partie 4a et/ou la seconde partie 4b. L'invention concerne aussi un procédé d'assemblage d'une carte électronique et d'un système de maintien mécanique selon l'invention sur une surface d'un support. Un exemple de procédé selon l'invention concerne l'assemblage dans le boîtier 20, de la carte SMI 4 et du système de maintien mécanique 1 tels que décrits précédemment.  In the exemplary embodiment illustrated in FIG. 3, the intermediate protrusion 11 "divides the assembly 35 into two parts, the intermediate protrusion 11" dividing in particular the SMI card 4 into a first part 4a and a second part 4b. . The resin 36 is an expensive material, it is then possible thanks to the intermediate protrusion 11 "to choose only the part 4a, 4b that it is desired to protect, without having to have the resin 36 on the two parts 4a, 4b Thus, it is then possible to choose to dispose of the resin 36 on the first part 4a, on the second part 4b, or on the two parts 4a, 4b of the card SMI 4. The peripheral protrusion 1 1 'form then a pattern, otherwise called mold, of reduced size, which avoids casting resin 36 throughout the housing 3 but only on the first part 4a and / or the second part 4b.The invention also relates to a method of assembly of an electronic card and a mechanical holding system according to the invention on a surface of a support An example of a method according to the invention relates to the assembly in the housing 20, the SMI card 4 and the mechanical holding system 1 as described p reviously.
Ce procédé comprend une première étape selon laquelle on positionne le système de maintien mécanique 1 sur le boîtier 20 de sorte que l'excroissance 1 du système de maintien mécanique 1 plaque la carte SMI 4 sur la surface 2 du boîtier 20. This method comprises a first step in which the mechanical support system 1 is positioned on the housing 20 so that the protrusion 1 of the mechanical support system 1 plates the SMI card 4 on the surface 2 of the housing 20.
Ce procédé comprend une deuxième étape selon laquelle on fixe le système de maintien mécanique 1 sur le boîtier 20. On le fixe notamment grâce aux organes de fixation 12, par exemple, des vis 12' que l'on visse au travers des trous 37 présents dans les œillets 13. This method comprises a second step in which the mechanical support system 1 is fixed on the housing 20. It is fixed in particular by means of the fasteners 12, for example screws 12 'which are screwed through the holes 37 present in the eyelets 13.
Il est possible d'effectuer une étape préalable à la première étape du procédé et correspondant à la variante de réalisation illustrée à la figure 1 , étape préalable selon laquelle on positionne la carte SMI 4 sur la surface 2 du boîtier 20. Dans ce cas, la carte SMI 4 est positionnée sur la surface 2 avant d'être plaquée contre celle-ci par le système de maintien mécanique 1. It is possible to carry out a step prior to the first step of the method and corresponding to the variant embodiment illustrated in FIG. 1, the preliminary step according to which the SMI card 4 is positioned on the surface 2 of the case 20. In this case, the SMI card 4 is positioned on the surface 2 before being pressed against it by the mechanical support system 1.
Alternativement à la variante décrite au paragraphe précédent, on peut effectuer une autre étape préalable à la première étape d u procédé, et correspondant à la variante de réalisation illustrée à la figure 3, étape préalable selon laquelle on pré-assemble le système de maintien mécanique 1 avec la carte SMI 4 à l'aide de l'organe de pré-assemblage 25 formé sur le système de maintien mécanique 1. Dans ce cas, c'est l'ensemble 35 qui est positionné directement sur la surface 2 du boîtier 20. On positionne ainsi sur la surface 2 du boîtier 20, selon une unique étape de montage, à la fois la carte SMI 4 et le système de maintien mécanique 1.  Alternatively to the variant described in the preceding paragraph, it is possible to perform another step prior to the first step of the method, and corresponding to the embodiment variant illustrated in FIG. 3, the preliminary step according to which the mechanical holding system 1 is pre-assembled. with the SMI card 4 using the pre-assembly member 25 formed on the mechanical support system 1. In this case, it is the assembly 35 which is positioned directly on the surface 2 of the housing 20. Positioned on the surface 2 of the housing 20, in a single mounting step, both the SMI card 4 and the mechanical support system 1.
Dans un exemple, l'ensemble 35 comprend en outre la carte de commande 7. La carte SMI 4 et la carte de commande 7 forment alors un onduleur 32. On positionne alors dans le boîtier 20, selon une unique étape de montage, à la fois l'onduleur 32 et le système de maintien mécanique 1.  In one example, the assembly 35 furthermore comprises the control card 7. The SMI card 4 and the control card 7 then form an inverter 32. It is then positioned in the housing 20, in a single mounting step, at the both the inverter 32 and the mechanical support system 1.
Le procédé selon l'invention peut être associé à l'une quelconque des caractéristiques décrites précédemment en rapport avec le système de maintien mécanique 1 ou l'ensemble 35 selon l'invention. The method according to the invention may be associated with any of the characteristics described above in connection with the mechanical support system 1 or the assembly 35 according to the invention.
On a vu qu'un système de maintien mécanique 1 conformément à l'invention trouve une application dans une machine tournante disposée dans un véhicule. Une telle machine est par exemple un compresseur électrique de climatisation pour véhicule automobile. Dans cette application, un fluide réfrigérant est classiquement mis en circulation à l'intérieur d'un circuit de climatisation par l'intermédiaire du compresseur. Ce compresseur comprend un boîtier 20 tel que décrit précédemment, qui reçoit la carte SMI 4. We have seen that a mechanical support system 1 according to the invention finds application in a rotating machine arranged in a vehicle. Such a machine is for example an electric air conditioning compressor for motor vehicle. In this application, a refrigerant fluid is conventionally circulated inside an air conditioning circuit via the compressor. This compressor comprises a housing 20 as described above, which receives the SMI card 4.
Ce boîtier 20 est rapporté ensuite sur un autre boîtier qui renferme le moteur électrique entraînant un mécanisme de compression, le moteur électrique étant alimenté par la carte SMI 4 comme vu précédemment, elle-même reliée à la source électrique haute tension, par exemple par le système de maintien mécanique 1 tel que décrit précédemment lorsqu'il comprend des conducteurs électriques 17', 17".  This housing 20 is then attached to another housing that encloses the electric motor driving a compression mechanism, the electric motor being powered by the SMI card 4 as seen above, itself connected to the high voltage electrical source, for example by the mechanical holding system 1 as described above when it comprises electrical conductors 17 ', 17 ".
Le système 1 peut comprendre un organe de pré-assemblage 25. L'organe de pré-assemblage 25 a été décrit sous une forme particulière. Cependant cet organe de pré-assemblage 25 peut prendre toute forme apte à assurer une solidarisation du système 1 , en particulier du corps 19, avec la carte 4 avant un plaquage de la carte 4 sur la surface 2. En particulier, le corps 19 comprend l'organe de pré-assemblage 25. L'organe de pré-assemblage 25 est notamment positionné à une extrémité distale de l'excroissance périphérique 11 '. L'organe de pré-assemblage 25 peut être d'un seul tenant avec le corps 19, notamment avec l'extrémité distale de l'excroissance périphérique 11'.  The system 1 may comprise a pre-assembly member 25. The pre-assembly member 25 has been described in a particular form. However, this pre-assembly member 25 can take any form capable of ensuring a fastening of the system 1, in particular of the body 19, with the card 4 before a plating of the card 4 on the surface 2. In particular, the body 19 comprises the pre-assembly member 25. The pre-assembly member 25 is in particular positioned at a distal end of the peripheral protrusion 11 '. The pre-assembly member 25 may be in one piece with the body 19, in particular with the distal end of the peripheral protrusion 11 '.

Claims

REVENDICATIONS
1. Système de maintien mécanique d'une carte électronique (4) contre une surface (2) d'un support (20), caractérisé en ce qu'il comprend un corps (19) principal destiné à venir en vis-à-vis de la carte électronique (4) et ayant au moins une excroissance (11 ) qui s'étend suivant une direction de sorte à maintenir ladite carte électronique (4) contre ladite surface (2), ledit corps (1) comprenant en outre un organe de pré-assemblage (25) avec la carte électronique (4). 1. System for mechanically holding an electronic card (4) against a surface (2) of a support (20), characterized in that it comprises a main body (19) intended to come opposite each other of the electronic card (4) and having at least one protrusion (11) which extends in one direction so as to maintain said electronic card (4) against said surface (2), said body (1) further comprising an organ pre-assembly (25) with the electronic card (4).
2. Système (1) selon la revendication 1 dans lequel le corps (19) et l'excroissance (11) sont électriquement isolants. 2. System (1) according to claim 1 wherein the body (19) and the protrusion (11) are electrically insulating.
3. Système (1) selon la revendication 1 ou 2 dans lequel ladite excroissance (11) est issue du corps (19). 3. System (1) according to claim 1 or 2 wherein said protrusion (11) is derived from the body (19).
4. Système selon l'une des revendications 1 à 3, dans lequel l'excroissance (11 ') s'étend depuis le corps principal (19) de sorte qu'une extrémité distale de l'excroissance (11') vienne sur une périphérie de la carte électronique (4). 4. System according to one of claims 1 to 3, wherein the protrusion (11 ') extends from the main body (19) so that a distal end of the protrusion (11') comes on a periphery of the electronic card (4).
5. Système (1) selon la revendication 4, dans lequel ladite extrémité distale (14) possède un épaulement (15) destiné à coopérer avec un bord périphérique (16) de la carte électronique (4). 5. System (1) according to claim 4, wherein said distal end (14) has a shoulder (15) for cooperating with a peripheral edge (16) of the electronic card (4).
6. Système selon l'une des revendications 1 à 3, dans lequel l'excroissance6. System according to one of claims 1 to 3, wherein the excrescence
(1 1 ") s'étend depuis le corps principal (19) de sorte qu'une extrémité distale de l'excroissance (11") vienne sur une portion non périphérique de la carte électronique (4). (1 1 ") extends from the main body (19) so that a distal end of the protuberance (11") comes to a non-peripheral portion of the electronic card (4).
7. Système (1 ) selon l'une quelconque des revendications 1 à 6, dans lequel l'excroissance (1 1 ) est une excroissance périphérique (11 ') s'étendant depuis une périphérie du corps principal (19). 7. System (1) according to any one of claims 1 to 6, wherein the protrusion (1 1) is a peripheral protrusion (11 ') extending from a periphery of the main body (19).
8. Système (1) selon l'une quelconque des revendications 1 à 6, dans lequel l'excroissance (11) est une excroissance intermédiaire (11") s'étendant depuis une zone intermédiaire du corps principal (19). 8. System (1) according to any one of claims 1 to 6, wherein the protrusion (11) is an intermediate protrusion (11 ") extending from an intermediate zone of the main body (19).
9. Système (1) selon les revendications 7 et 8, comprenant l'excroissance périphérique ( 1 ') et l'excroissance intermédiaire (1 1"), et dans lequel l'excroissance intermédiaire (11 ") s'étend entre deux flancs (21 , 22) de l'excroissance périphérique (1 1 '). 9. System (1) according to claims 7 and 8, comprising the peripheral outgrowth (1 ') and the intermediate protrusion (1 1 "), and wherein the intermediate protrusion (11") extends between two flanks (21, 22) of the peripheral outgrowth (11 ').
10. Système (1) selon l'une quelconque des revendications précédentes dans lequel l'excroissance (11) est une paroi. 10. System (1) according to any one of the preceding claims wherein the protrusion (11) is a wall.
11. Système (1) selon l'une quelconque des revendications 1 à 9 dans lequel l'excroissance (11) est une tige. 11. System (1) according to any one of claims 1 to 9 wherein the protrusion (11) is a rod.
12. Système (1) selon l'une quelconque des revendications précédentes dans lequel le corps ( 9) a une forme sensiblement rectangulaire. 12. System (1) according to any one of the preceding claims wherein the body (9) has a substantially rectangular shape.
13. Système (1) selon l'une quelconque des revendications précédentes, dans lequel le corps (19) comprend au moins un œillet (13) traversé par un trou en vue d'y disposer un organe de fixation destiné à solidariser le système (1 ) sur le support (20). 13. System (1) according to any one of the preceding claims, wherein the body (19) comprises at least one eyelet (13) through which a hole to have a fixing member for securing the system ( 1) on the support (20).
14. Système (1 ) selon l'une quelconque des revendications précédentes comprenant en outre des conducteurs électriques (17', 17") destinés à conduire un courant entre la carte électronique (4) et l'extérieur de la carte électronique (4), lesdits conducteurs électriques ( 7', 17") étant maintenus ensemble par ledit corps principal (19). 14. System (1) according to any one of the preceding claims further comprising electrical conductors (17 ', 17 ") intended to conduct a current between the electronic card (4) and the outside of the electronic card (4) said electrical conductors (7 ', 17 ") being held together by said main body (19).
15. Ensemble (35) d'une carte électronique (4), et d'un système de maintien mécanique (1) selon l'une quelconque des revendications précédentes, dans lequel au moins une excroissance (1 1) du système de maintien (1) est destinée à maintenir la carte électronique (4) contre une surface (2) d'un support (20). 15. Assembly (35) of an electronic card (4), and a mechanical support system (1) according to any one of the preceding claims, wherein at least one protrusion (1 1) of the holding system ( 1) is intended to hold the electronic card (4) against a surface (2) of a support (20).
16. Ensemble (35) selon la revendication 15, dans lequel ledit ensemble (35) comprend une résine (36) contenue par l'excroissance (11) et couvrant au moins une partie de la carte électronique (4). 16. The assembly (35) of claim 15, wherein said assembly (35) comprises a resin (36) contained by the protrusion (11) and covering at least a portion of the electronic card (4).
17. Ensemble (35) selon la revendication 16, dans lequel ledit système (1) comprend une excroissance intermédiaire (11 ") divisant ledit ensemble (35) en deux parties, ladite résine (36) étant contenue dans au moins une des deux parties. The assembly (35) according to claim 16, wherein said system (1) comprises an intermediate protrusion (11 ") dividing said assembly (35) into two parts, said resin (36) being contained in at least one of the two parts .
18. Procédé d'assemblage sur une surface (2) d'un support (20), d'une carte électronique (4), et d'un système de maintien mécanique (1) selon l'une quelconque des revendications 1 à 14, caractérisé en ce que : 18. A method of assembling on a surface (2) a support (20), an electronic card (4), and a mechanical holding system (1) according to any one of claims 1 to 14 characterized in that
- on positionne ledit système (1) sur ladite surface (2) de sorte qu'au moins une excroissance (11) dudit système (1) maintient la carte électronique (4) sur la surface (2) ;  - Positioning said system (1) on said surface (2) so that at least one protrusion (11) of said system (1) holds the electronic card (4) on the surface (2);
- on fixe ledit système (1) sur le support (20).  - Fixing said system (1) on the support (20).
19. Procédé selon la revendication 18, dans lequel on pré-assemble ledit système (1) avec ladite carte électronique (4) préalablement au positionnement dudit système (1) sur la surface (2) à l'aide de l'organe de pré-assemblage (25) formé sur le système (1). 19. The method of claim 18, wherein said system (1) is pre-assembled with said electronic card (4) prior to the positioning of said system (1) on the surface (2) by means of the pre-assembly member. assembly (25) formed on the system (1).
PCT/EP2012/004259 2011-10-12 2012-10-12 Mechanical retention system, assembly comprising such a system and an electronic board and method of assembling such a system and such a board on a surface WO2013053476A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1103104A FR2981537B1 (en) 2011-10-12 2011-10-12 MECHANICAL MAINTENANCE SYSTEM, ASSEMBLY COMPRISING SUCH A SYSTEM AND AN ELECTRONIC BOARD AND METHOD OF ASSEMBLING ON A SURFACE OF SUCH A SYSTEM AND SUCH A CARD
FR1103104 2011-10-12

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WO2013053476A2 true WO2013053476A2 (en) 2013-04-18
WO2013053476A3 WO2013053476A3 (en) 2013-06-20

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FR2981537A1 (en) 2013-04-19
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