JP2008147383A - Photoelectric conversion module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a photoelectric conversion module having high strength and reduced in affection due to electromagnetic wave noise while achieving miniaturization. <P>SOLUTION: The photoelectric conversion module is provided with a photoelectric conversion element 3 for detecting the outgoing of light of a predetermined wavelength to the outside or the incidence of light of the predetermined wavelength from outside, an electronic component 5 electrically connected to the photoelectric conversion element 3 to receive light emitting signal from outside or transmit light emitting signal to the outside and a three-dimensional circuit board 1 with the photoelectric conversion element 3 and the electronic component 5 which are mounted thereon. In this case, a recess 1a is formed on the three-dimensional circuit board 1 at the side of a predetermined mounting surface to mount the photoelectric conversion element 3 on the bottom surface of the recess 1a, further, a shield layer 15 is formed on the rear side of the predetermined mounting surface with the photoelectric conversion element 3 mounted thereon. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a photoelectric conversion module in which a photoelectric conversion element and an electronic component are formed on a substrate, and light is emitted or incident on the photoelectric conversion element to perform electrical processing by the electronic component.

  2. Description of the Related Art Conventionally, as a wiring board on which a photoelectric conversion element and an electronic component that processes signals input / output by the photoelectric conversion element are mounted, those described in Patent Document 1 below are known.

A photoelectric conversion module in which a photoelectric conversion element and an electronic component are mounted on this wiring board is formed by mounting an electronic component on a substrate made of an insulating material and a heat sink material.
Japanese Patent Application Laid-Open No. 2005-312102

  However, in recent years, there has been a demand for improvement in the strength of the substrate along with downsizing of the substrate, and reduction in electromagnetic wave noise by downsizing the photoelectric conversion module.

  Therefore, the present invention has been proposed in view of the above-described circumstances, and provides a photoelectric conversion module that improves the reliability by reducing the influence of high strength and electromagnetic wave noise while realizing downsizing. Objective.

  The photoelectric conversion module according to the present invention receives a light emission signal from the outside by emitting light of a predetermined wavelength to the outside or detecting the incidence of light of a predetermined wavelength from the outside, and the photoelectric conversion element. Alternatively, in order to solve the above-described problem, an electronic component that transmits a light emission signal to the outside and a three-dimensional circuit board on which a photoelectric conversion element and an electronic component are mounted on a predetermined mounting surface side are provided. A recess is formed on a predetermined mounting surface side, a photoelectric conversion element is mounted on the bottom surface of the recess, and a shield layer is formed on the back surface or side surface of the predetermined mounting surface on which the photoelectric conversion element is mounted.

  According to the photoelectric conversion module of the present invention, since the photoelectric conversion element is mounted on the bottom surface of the concave portion formed on the three-dimensional circuit board, the convex portion where the photoelectric conversion element is not formed even if the size and thickness are reduced. The strength of the three-dimensional circuit board can be improved, and since the shield layer is formed on the back surface or the side surface of the predetermined mounting surface on which the photoelectric conversion element is mounted, the influence of electromagnetic noise can be reduced and the reliability can be improved. Can be improved.

  Embodiments of the present invention will be described below with reference to the drawings.

  In the present invention, for example, as shown in a plan view in FIG. 1 and a cross-sectional view in FIG. 2, a plurality of recesses 1 a are formed on a three-dimensional circuit board 1, and a photoelectric conversion element 3, an electrical wiring 4 and an electronic component 5 are mounted. The present invention is applied to a photoelectric conversion module configured as described above.

  The photoelectric conversion element 3 emits light having a predetermined wavelength to the outside or detects the incidence of light having a predetermined wavelength from the outside. The photoelectric conversion element 3 is a light-emitting element that emits light of a predetermined wavelength or a light-receiving element that receives light of a predetermined wavelength. As shown in FIG. 2, the photoelectric conversion element 3 constitutes a photoelectric conversion unit 13 with a lens 11 provided in a light passage path and a lens mounting unit 12 integrated with the lens 11. The lens 11 and the lens mounting portion 12 are integrally formed and are made of the same resin material such as an acrylic material.

  The photoelectric conversion element 3 and the electronic component 5 are connected by an electric wiring 4 including a signal line for transmitting a signal and a power line for driving the photoelectric conversion element 3 and the electronic component 5. The electrical wiring 4 is connected to an external cable 7 through a power supply terminal 6a, a signal terminal 6b, and a ground terminal 6c.

  The electronic component 5 constitutes a control circuit unit 14 that is electrically connected to the photoelectric conversion element 3 and receives a light emission signal from the outside or transmits a light emission signal to the outside. When the photoelectric conversion element 3 is a light emitting element, the control circuit unit 14 uses a power supply circuit that supplies power supplied from the cable 7 to the light emitting element via the power supply terminal 6a, and a control signal supplied from the cable 7. The control circuit is configured to control the start and stop of the emission of light having a predetermined wavelength. When the photoelectric conversion element 3 is a light receiving element, the control circuit unit 14 is based on a power supply circuit that supplies power supplied from the cable 7 to the light receiving element via the power supply terminal 6a, and light received by the light receiving element. The circuit includes a processing circuit that performs amplification and noise removal processing on the electrical signal and outputs the electrical signal to the cable 7 via the signal terminal 6b.

  The three-dimensional circuit board 1 is made of, for example, a resin such as polyphthalamide and is three-dimensionally molded. There are injection molding, compression molding (press molding), casting molding, and the like as a method for manufacturing the ceramic sintered body of the three-dimensional circuit board 1, but any method may be used for manufacturing the three-dimensional circuit board 1. .

  The electrical wiring 4 formed on the three-dimensional circuit board 1 can be easily formed by a thin film outline removing method. This thin film outline removing method includes the following processes.

  First, in the thin film contour removal method, a heat treatment process is performed, and the sintered body is heat treated under the conditions of a temperature of 1000 ° C. and a holding time of 1 hour to clean the surface.

Subsequently, in the thin film outline removing method, a conductive thin film forming process is executed. In this conductive thin film formation process, a conductive thin film is formed on the surface of a specimen by a physical vapor deposition method using a vacuum vapor deposition apparatus, a DC magnetron sputtering apparatus, or a wet method such as electroless plating. As an example, the test specimen is set in the chamber of the plasma processing apparatus, the pressure in the chamber is reduced to about 10 ⁻⁴ Pa, and then the specimen is preheated at a temperature of 150 ° C. for about 3 minutes. Thereafter, oxygen gas is circulated in the chamber, and the gas pressure in the chamber is controlled to about 10 Pa. Then, plasma treatment is performed by applying a high-frequency voltage of 1 kW (RF: 13.56 MHz) between the electrodes for 300 seconds. Subsequently, the pressure in the chamber is controlled to 10 ⁻⁴ Pa or less, and in this state, argon gas is introduced into the chamber so that the gas pressure is about 0.6 Pa, and then a DC voltage of 500 V is applied. Thus, the metal target is bombarded to form a conductive thin film having a thickness of about 300 nm on the surface of the test body. Note that copper, nickel, chromium, titanium, or the like is used as the conductive material.

  Subsequently, in the thin film outline removing method, a circuit pattern forming process which is the electric wiring 4 is executed. The circuit pattern contour portion of the conductive thin film formed on the alumina substrate by scanning the laser along the contour of the circuit pattern using the third harmonic of the YAG laser (THG-YAG laser) in the atmosphere. A thin film removal portion is formed by removing only the thin film. Thereby, a circuit part and a non-circuit part are electrically insulated.

  Subsequently, in the thin film contour removal method, a plating process is executed, and only the electric circuit portion on the surface of the sintered body is subjected to copper plating by electrolytic plating to form a thick film, thereby forming a copper film having a thickness of about 15 μm. Thereafter, the conductive thin film remaining in the non-electric circuit portion is removed by etching. At this time, the copper plating of the electric circuit portion remains because it is formed thicker than the conductive thin film. Then, nickel plating or gold plating is applied to the electric circuit portion by electroplating.

  Thus, even if the three-dimensional circuit board 1 is miniaturized, the electric wiring 4 can be easily formed as being miniaturized by the thin film outline removing method.

  As shown in FIG. 2, the three-dimensional circuit board 1 has a recess 1 a formed on a predetermined mounting surface side, a photoelectric conversion element 3 mounted on the bottom surface of the recess 1 a, and a predetermined mount on which the photoelectric conversion element 3 is mounted. A shield layer 15A is formed on the back surface of the mounting surface. The shield layer 15 </ b> A is formed of a metal material that absorbs electromagnetic wave noise generated when the photoelectric conversion element 3 is operated. A shield layer 15 </ b> B is formed on the inner wall of the recess 1 a and on the side surface of the three-dimensional circuit board 1. Although FIG. 2 shows the case where both the shield layer 15A and the shield layer 15B are formed, only one of them may be provided.

  The concave portion 1 a is formed in a substrate portion where the photoelectric conversion element 3 is mounted and a substrate portion where the electronic component 5 is mounted. By forming the concave portion 1a, a portion where the photoelectric conversion element 3 and the electronic component 5 are not formed is a convex portion 1b. The photoelectric conversion element 3 and the electronic component 5 are formed on the bottom surface of the recess 1a, and the photoelectric conversion element 3 and the electronic component 5 and the electric wiring 4 are electrically connected by a wire bonding technique.

  In the photoelectric conversion unit 13, the lens 11 and the lens attachment unit 12 are fitted to the convex portion 1 c formed on the convex portion 1 b of the three-dimensional circuit board 1. The convex portions 1b and the convex portions 1c are formed at the same time as the molded circuit board 1 is molded. This convex part 1c is formed in order to attach the lens 11 and the lens attaching part 12 to the opening end part of the concave part 1a in which the photoelectric conversion element 3 is provided.

  According to such a photoelectric conversion module, since the photoelectric conversion element 3 is mounted on the bottom surface of the recess 1a, it is possible to reduce the thickness of the three-dimensional circuit board 1 and realize downsizing. Further, since the portion of the three-dimensional circuit board 1 on which the photoelectric conversion element 3 is not mounted is the convex portion 1b, the strength of the three-dimensional circuit board 1 can be increased even when the three-dimensional circuit board 1 is thinned. Further, since the photoelectric conversion module is formed with the shield layer 15A on the back surface of the concave portion 1a on which the photoelectric conversion element 3 is mounted or the shield layer 15B on the side surface, the photoelectric conversion is performed even when the three-dimensional circuit board 1 is thinned. It can suppress that the electromagnetic wave noise which generate | occur | produces at the time of the action | operation of the element 3 affects the electronic component 5. FIG. Thereby, the reliability as a photoelectric conversion module can be improved.

  Furthermore, according to this photoelectric conversion module, not only the photoelectric conversion element 3 but also the electronic component 5 is mounted on the bottom surface of the recess 1a, so that the overall height can be reduced.

  Further, according to this photoelectric conversion module, the photoelectric conversion element 3 is provided on the three-dimensional circuit board 1 in order to mount the lens 11 and the lens mounting portion 12 that support the lens 11 at a position where light of a predetermined wavelength passes. Since the convex portion 1c is formed at the opening end of the concave portion 1a and the lens 11 and the lens attaching portion 12 are fitted, it is not necessary to attach the lens holder to the three-dimensional circuit board 1 with a separate member. Thereby, size reduction and cost reduction of a photoelectric conversion module are attained. Moreover, since the concave portion 1a, the convex portion 1b, and the convex portion 1c are formed at the same time, the arrangement accuracy of the lens mounting portion 12 and the lens 11 with respect to the photoelectric conversion element 3 is improved, and the light between the photoelectric conversion element 3 and the lens 11 is improved. Axis alignment work is unnecessary.

  The photoelectric conversion module described above is provided with a shield case 21 on a predetermined mounting surface on which the photoelectric conversion element 3 and the electronic component 5 of the three-dimensional circuit board 1 are mounted, as shown in a cross-sectional view in FIG. The molded circuit board 1 and the shield case 21 may be accommodated in the case 20. The case 20 is provided with an opening 20a through which light incident or emitted by the photoelectric conversion element 3 passes, and the shield case 21 is also provided with a similar opening.

  In this photoelectric conversion module, a shield case 21 is provided on the upper surface of the three-dimensional circuit board 1 so that electromagnetic noise emitted by the photoelectric conversion element 3 is not emitted to the outside. Thereby, as shown in FIG. 2, the effect similar to shield layer 15A and shield layer 15B which absorbs the electromagnetic wave noise from the photoelectric conversion element 3 can be exhibited.

  The photoelectric conversion module provided with such a photoelectric conversion element 3 can be used, for example, for product inspection as shown in FIG. In order to detect whether or not the inspection object 32 passing on the mounting table 30 has passed, the photoelectric conversion module 31A and the photoelectric conversion module 31B provided opposite to each other in the width direction of the mounting table 30 are provided. Prepare. The photoelectric conversion module 31 </ b> A includes a photoelectric conversion element 3 that emits light of a predetermined wavelength and a control circuit unit 14 that controls emission of the photoelectric conversion element 3. The photoelectric conversion module 31B includes a photoelectric conversion element 3 that receives light of a predetermined wavelength and a control circuit unit 14 that processes an electrical signal converted by the photoelectric conversion element 3. Photoelectric conversion module 31B The photoelectric conversion module 31A and the photoelectric conversion module 31B are connected to the sensor control device 33 via the cable 7, respectively.

  When the inspection is performed by sliding the inspection object 32 in the inspection direction, the photoelectric conversion module 31A is controlled by the sensor control device 33 to emit light having a predetermined wavelength from the photoelectric conversion element 3, and the photoelectric conversion module 31B is When light of a predetermined wavelength emitted from the photoelectric conversion element 3 of the photoelectric conversion module 31 </ b> A is received, an electric signal is supplied to the sensor control device 33.

  The above-described embodiment is an example of the present invention. For this reason, the present invention is not limited to the above-described embodiment, and various modifications can be made depending on the design and the like as long as the technical idea according to the present invention is not deviated from this embodiment. Of course, it is possible to change.

It is a top view of the photoelectric conversion module to which this invention is applied. It is sectional drawing of the photoelectric conversion module to which this invention is applied. It is sectional drawing which shows the state which accommodated the photoelectric conversion module to which this invention was applied in the case. It is a block diagram explaining the usage example of the photoelectric conversion module to which this invention is applied.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 3D circuit board 1a Concave part 1b Convex part 1c Convex part 3 Photoelectric conversion element 4 Electrical wiring 5 Electronic component 6a Power supply terminal 6b Signal terminal 6c Grounding terminal 7 Cable 11 Lens 12 Lens attachment part 13 Photoelectric conversion part 14 Control circuit unit 15 Shield Layer 20 Case 20a Opening 21 Shield case 30 Mounting base 31A, 31B Photoelectric conversion module 32 Inspected object 33 Sensor control device

Claims (4)

A photoelectric conversion element that detects light of a predetermined wavelength to be emitted to the outside or detects the incidence of light of a predetermined wavelength from the outside;
An electronic component that is electrically connected to the photoelectric conversion element and receives a light emission signal from the outside or transmits a light emission signal to the outside;
A three-dimensional circuit board on which the photoelectric conversion element and the electronic component are mounted on a predetermined mounting surface;
The three-dimensional circuit board has a recess formed on the predetermined mounting surface side, the photoelectric conversion element is mounted on the bottom surface of the recess, and on the back surface or side surface of the predetermined mounting surface on which the photoelectric conversion element is mounted. A photoelectric conversion module, wherein a shield layer is formed.   2. The photoelectric conversion module according to claim 1, wherein the three-dimensional circuit board has a recess formed at a position where the electronic component is mounted, and the electronic component is mounted on a bottom surface of the recess.   3. The photoelectric conversion module according to claim 1, wherein a lens that passes light emitted or incident by the photoelectric conversion element is provided on an upper surface of a concave portion in which the photoelectric conversion element is mounted on a bottom surface. . A lens support member that supports the lens at a position where the light of the predetermined wavelength passes;
4. The photoelectric conversion according to claim 3, wherein the three-dimensional circuit board has a convex portion into which the lens support member is fitted at an opening end portion of the concave portion provided with the photoelectric conversion element. module.

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