JP2002267893A - Optical module, method for manufacturing the same, and optical transmitter - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an optical module which has a property excellent in the handling of an optical fiber and high position accuracy, and to provide a method for manufacturing the same and an optical transmitter. SOLUTION: The method for manufacturing the optical module uses a platform 20 having a recess 30, an optical element 10 having an optical part 12 on one surface, and an optical waveguide 40, and includes a first process in which the optical element 10 is mounted in the recess 30 so that the one surface may turn to the opening side of the recess, and a second process in which guide parts 50 provided in the circumference of the end surface 46 of the optical waveguide 40 are fitted to be positioned in guide parts 24 provided in the platform 20, and at the same time, the optical waveguide 40 is mounted on the platform 20 so as to oppose the end surface of the optical waveguide 40 against the optical part 12.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an optical module, a method of manufacturing the same, and an optical transmission device.

[0002]

2. Description of the Related Art In recent years, information communication has been trending toward higher speed and larger capacity, and optical communication has been developed. Generally, in optical communication, an electric signal is converted into an optical signal, the optical signal is transmitted through an optical fiber, and the received optical signal is converted into an electric signal. The conversion between an electric signal and an optical signal is performed by an optical element. Also, an optical module in which an optical element is mounted on a platform is known.

In the conventional optical module, it has been difficult to align the optical element with the optical fiber. For example, although the position of the optical fiber was adjusted using a V-groove formed in the platform, it was difficult to handle the optical fiber, and it was difficult to perform high-accuracy alignment.

An object of the present invention is to solve this problem, and an object of the present invention is to provide an optical module which is excellent in handling an optical fiber and has high positional accuracy, a method of manufacturing the same, and an optical transmission device. is there.

[0005]

(1) A method for manufacturing an optical module according to the present invention provides an optical module using a platform having a concave portion, an optical element having an optical portion on one surface, and an optical waveguide. A method of manufacturing a module, comprising: a first step of mounting the optical element in the recess so that the one surface faces the opening side of the recess; and providing around the end face of the optical waveguide. A guide portion and a guided portion provided on the platform are fitted and aligned, and the optical waveguide is mounted on the platform such that an end face of the optical waveguide faces the optical portion. And a second step.

According to the present invention, the optical waveguide is aligned with respect to the optical element by using the guide provided around the end face of the optical waveguide. According to this, since the positioning of the optical waveguide can be performed by attaching the guide portion to the guided portion, the handling of the optical waveguide is excellent. Therefore, the optical waveguide can be aligned with the optical element with high positional accuracy.

Further, if the concave portion is formed at a predetermined position and shape, it is not necessary to position the optical element with respect to the platform, so that the optical module can be easily manufactured.

(2) In this method of manufacturing an optical module, the guide portion is a pin projecting in an axial direction of the optical waveguide from an end face of the optical waveguide, and the guided portion avoids the concave portion. The second step may be performed by inserting the pin through the hole.

According to this, the optical waveguide is aligned by inserting the pin into the hole of the platform. Since the pin protrudes in the axial direction of the optical waveguide, the position of the optical waveguide in a plane perpendicular to the axial direction can be determined by inserting the pin through the hole.

(3) In this method of manufacturing an optical module, the optical waveguide may be provided with a fixing portion for fixing the pin around the end face.

Thus, the pins can be provided around the end of the optical waveguide except for the end face.

(4) In this method of manufacturing an optical module, the guided portion is a depression, and the concave portion is formed inside the depression, and the guide portion is fitted into the depression to perform the second step. May be performed.

According to this, the optical waveguide is aligned by fitting the guide portion provided around the end face of the optical waveguide into the recess of the platform. Since the guide portion is merely fitted into the depression, the optical waveguide can be easily aligned.

(5) In this method of manufacturing an optical module, a conductive film is formed on the fixed portion on the side facing the platform, and a wiring layer is formed on the platform. The optical element and the wiring layer may be electrically connected by bringing a wiring layer and the optical element into contact with the conductive film.

Thus, the optical waveguide can be aligned and the optical element can be electrically connected to the wiring layer. Therefore, there is no need to newly provide a step of electrically connecting, and the optical module can be manufactured with a small number of steps.

(6) In this optical module manufacturing method, a conductive film is formed on the guide portion on the side facing the platform, and a wiring layer is formed on the platform. The optical element and the wiring layer may be electrically connected by bringing a wiring layer and the optical element into contact with the conductive film.

Thus, the optical waveguide can be aligned and the optical element can be electrically connected to the wiring layer. Therefore, there is no need to newly provide a step of electrically connecting, so that the optical module can be manufactured with a small number of steps.

(7) In this method of manufacturing an optical module, the optical element has an electrode on a surface having the optical portion, and a wiring layer is formed on the platform in a region including the concave portion. The method may further include electrically connecting the wiring layer formed inside the concave portion and the electrode by a wire.

According to this, since the optical element and the wiring layer are electrically connected by the wire, the cost is low.

(8) In this method for manufacturing an optical module, inside the concave portion of the platform,
The method may further include providing a lens portion on the one surface side of the optical portion.

Thus, the light intensity distributions of the optical portion and the optical waveguide can be matched.

(9) In this method for manufacturing an optical module, the concave portion has a plurality of bottom surfaces forming a plurality of steps,
It may be formed so as to widen in the opening direction from the lowermost bottom surface.

(10) In this method of manufacturing an optical module, one end of the wire may be bonded to the wiring layer on a bottom surface of each bottom surface above a bottom surface on which the optical element is mounted.

According to this, for example, if the wire is formed inside the concave portion, it is possible to prevent the wire from breaking even when the optical waveguide is attached to the platform. Therefore, electrical connection between the optical element and the wiring layer can be reliably achieved.

(11) In this method of manufacturing an optical module, the end of the lens portion may be placed on a bottom surface of each bottom surface above the bottom surface on which the optical element is mounted.

Thus, it is possible to dispose the lens portion inside the concave portion where the optical element is mounted and above the optical portion.

(12) In this method of manufacturing an optical module, the method further includes bonding the optical element to the bottom surface of the lowermost portion with an adhesive. A hole may be formed.

Thus, when the optical element is mounted,
Since the excess adhesive enters the holes, the optical element can be prevented from tilting.

(13) In this method of manufacturing an optical module, the platform may further include a second concave portion, and further include mounting an electronic component in the second concave portion.

According to this, if the second concave portion is formed in a predetermined position and shape, it is not necessary to perform the alignment of the electronic component with the platform, so that the optical module can be easily manufactured.

(14) In this method of manufacturing an optical module, the dent has the concave portion and the second concave portion inside, and closes the guide portion with the opening of the concave portion and the second concave portion. As described above.

According to this, since the concave portion is closed by the guide portion, the optical element and the electronic component are not exposed to the outside. Therefore, a highly reliable optical module which is hardly affected by the outside can be manufactured.

(15) An optical module according to the present invention is manufactured by the above-described method for manufacturing an optical module.

(16) An optical module according to the present invention, an optical element having a platform having a concave portion, an optical portion on one surface, and the one surface facing the opening side of the concave portion. An optical waveguide disposed with the end face facing the optical portion; a positioning guide provided around the end face of the optical waveguide; and a guide provided on the platform and fitted with the guide. And a guided portion.

According to the present invention, the guide portion provided around the end face of the optical waveguide is used to align the optical waveguide with the optical element. According to this, since the guide portion is attached to the guided portion and the optical waveguide is aligned, the handling of the optical waveguide is excellent. Therefore, it is possible to provide an optical module in which the optical waveguide is aligned with the optical element with high positional accuracy.

In addition, if the concave portion is formed at a predetermined position and shape, it is not necessary to align the optical element with the platform, so that an optical module can be easily manufactured and a low-cost optical module can be provided.

(17) In this optical module, the guide portion is a pin projecting in the axial direction of the optical waveguide from an end face of the optical waveguide, and the guided portion is formed so as to avoid the concave portion. And the pin may be inserted through the hole.

According to this, the optical waveguide is aligned by inserting the pin into the hole of the platform. Since the pins protrude in the axial direction of the optical waveguide, their positions on a plane perpendicular to the axial direction of the optical waveguide are determined.

(18) In this optical module, the optical waveguide may be provided with a fixing portion for fixing the pin around the end face.

Thus, the pins can be provided around the optical waveguide except for the end face.

(19) In this optical module, the guided portion may be a depression, and the recess may be formed inside the depression, and the guide portion may be fitted into the depression.

According to this, the optical waveguide is aligned by fitting the guide portion into the recess.

(20) In this optical module, a conductive film is formed on the fixed portion on the side facing the platform, a wiring layer is formed on the platform, and the wiring layer and the optical element are connected to each other. The optical element and the wiring layer may be electrically connected by contacting the conductive film.

Thus, the position of the optical waveguide is aligned, and the electrical connection between the optical element and the wiring layer is achieved. Therefore, it is not necessary to newly provide a step of electrically connecting, and the optical module can be manufactured in a small number of steps, so that a low-cost optical module can be provided.

(21) In this optical module, a conductive film is formed on the guide portion on the side facing the platform, a wiring layer is formed on the platform, and the wiring layer and the optical element are connected to each other. The optical element and the wiring layer may be electrically connected by contacting the conductive film.

Thus, the position of the optical waveguide is adjusted, and the electrical connection between the optical element and the wiring layer is achieved. Therefore, it is not necessary to newly provide a step of electrically connecting, and the optical module can be manufactured in a small number of steps, so that a low-cost optical module can be provided.

(22) In this optical module, the optical element has an electrode on a surface having the optical portion, and a wiring layer is formed on the platform in a region including the concave portion. And the electrode may be electrically connected by a wire.

According to this, since the optical element and the wiring layer are electrically connected by the wire, the cost is low.

(23) In this optical module, the optical module may further include a lens portion provided inside the concave portion of the platform and on the one surface side of the optical portion.

As a result, the light intensity distributions of the optical portion and the optical waveguide can be matched.

(24) In this optical module, the concave portion may have a plurality of bottom surfaces forming a plurality of steps, and may be formed so as to widen from the lowermost bottom surface in the opening direction.

(25) In this optical module, the wires may be bonded to the wiring layer on a bottom surface of each bottom surface above a bottom surface on which the optical element is mounted.

According to this, for example, if the wire is formed inside the concave portion, it is possible to prevent the wire from breaking even when the optical waveguide is attached to the platform. Therefore, electrical connection between the optical element and the wiring layer can be reliably achieved.

(26) In this optical module, an end of the lens portion may be placed on a bottom surface of each of the bottom surfaces above the bottom surface on which the optical element is mounted.

This makes it possible to dispose the lens portion inside the concave portion where the optical element is mounted and above the optical portion.

(27) In this optical module, the optical element may be bonded to the lowermost bottom surface with an adhesive, and a hole into which the adhesive enters may be formed in the lowermost bottom surface.

Thus, when the optical element is mounted,
Since the excess adhesive enters the recess, the optical element can be prevented from tilting.

(28) In this optical module, the platform may have a second concave portion, and may further include an electronic component mounted in the second concave portion.

According to this, if the second concave portion is formed in a predetermined position and shape, it is not necessary to perform the alignment with respect to the platform in the electronic component, so that the optical module can be easily manufactured and the cost can be reduced. An optical module can be provided.

(29) In this optical module, the dent has the concave portion and the second concave portion inside, and the guide portion covers the opening of the concave portion and the second concave portion so as to cover the opening. It may be fitted in the depression.

According to this, since the concave portion is closed by the guide portion, the optical element and the electronic component are not exposed to the outside. Therefore, it is possible to provide a highly reliable optical module that is hardly affected by external influences.

(30) The light transmission device according to the present invention comprises a first and a second platform having a concave portion,
A light-emitting element mounted with the surface having the light-emitting portion facing the opening side of the recess of the platform, and a light-receiving element mounted with the surface having the light receiving portion facing the opening side of the recess of the second platform. An element, an optical waveguide arranged with one end face facing the light emitting section, and an optical waveguide arranged with the other end face facing the light receiving section, and an alignment guide provided around both end faces of the optical waveguide. A guide portion; and a guided portion provided on the first and second platforms and having any one of the guide portions attached thereto.

According to the present invention, the guide portion provided around the end face of the optical waveguide is used to align the optical waveguide with the optical element. According to this, since the guide portion is attached to the guided portion and the optical waveguide is aligned, the handling of the optical waveguide is excellent. Therefore, it is possible to provide a light transmission device in which the optical waveguide is aligned with the optical element with high positional accuracy.

In addition, if the concave portion is formed at a predetermined position and shape, it is not necessary to align the optical element with the platform, so that an optical module can be easily manufactured and a low-cost optical transmission device can be provided. .

(31) The light transmission device may further include a plug connected to the light receiving element and a plug connected to the light emitting element.

[0066]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below with reference to the drawings. However, the present invention
The present invention is not limited to the following embodiment.

(First Embodiment) FIGS. 1 to 3 show an optical module according to a first embodiment of the present invention and a method for manufacturing the same. As shown in FIG. 3, the optical module includes an optical element 10 and a platform 20.
And an optical fiber 40. The relative position between the optical element 10 and the optical fiber 40 is determined by a pin 50 (guide portion). The optical fiber 40 is an example of an optical waveguide.

The optical element 10 may be a light emitting element or a light receiving element. A surface-emitting element as an example of a light-emitting element,
In particular, a surface emitting laser can be used. Surface emitting devices such as surface emitting lasers emit light in a direction perpendicular to the platform. The optical element 10 has an optical part 12. When the optical element 10 is a light emitting element, the optical part 12 is a light emitting part, and when the optical element 10 is a light receiving element, the optical part 12 is a light receiving part.

The optical element 10 is in a state where the position relative to the optical fiber 40 is fixed. Specifically, the optical portion 12 of the optical element 10 is
The position relative to is fixed. Optical fiber 4
The zero end surface 46 is fixed in a state facing the optical part 12.

The optical element 10 has at least one (typically two or more) electrodes. For example, the first electrode 14 may be provided on the surface on which the optical portion 12 is formed. Further, the second electrode 16 may be provided on a surface different from the surface on which the first electrode 14 is provided.
The second electrode 16 may be formed on a surface opposite to the surface on which the optical part 12 of the optical element 10 is formed.

The optical element 10 is mounted on a platform 20. Specifically, the optical element 10 is mounted inside a concave portion 30 (see FIG. 1) formed in the platform 20. The shape of the platform 20 is not particularly limited, and may be, for example, any of a rectangular parallelepiped, a cube, and a sphere, and has at least one concave portion 30.
The material constituting the platform 20 is not particularly limited either, and may be any of an insulator, a conductor, or a semiconductor, and may be, for example, any of a metal such as silicon, ceramic, iron, and copper, or a resin. When a resin is used, the platform 20 may be formed by injection molding.

The wiring layer 22 is formed on the platform 20. Since the wiring layer 22 is electrically connected to the optical element 10, the wiring layer 22 may have a wiring pattern as necessary. When the platform 20 is formed from a conductive material, it is preferable to form the wiring layer 22 via an insulating film. For example, when the platform 20 is made of silicon, a silicon oxide film may be formed on the surface, and the wiring layer 22 may be formed thereon. The wiring layer 22 is formed by sputtering, etching or plating on a conductive foil (electrolytic or non-electrolytic).
And the like. The wiring layer 22 is formed at least in a region where the optical element 10 is mounted. Specifically, the wiring layer 22 is formed at least in a region inside the recess 30.

The platform 20 has a hole 24 formed therein. The pin 50 is inserted through the hole 24. Since the pin 50 is fixed around the end surface 46 of the optical fiber 40, the optical fiber 40 is fixed to the platform 20 by inserting the pin 50 into the hole 24. Thereby, the relative position of the optical fiber 40 with respect to the optical element 10 is fixed. In addition, the pin 50 is a guide portion used when aligning the optical fiber 40, and the hole 24 is a guided portion to which the guide portion is attached.

The hole 24 is formed in the recess 3 in which the optical element 10 is mounted.
It is formed avoiding 0. The planar outer shape of the hole 24 is not limited, but is preferably substantially the same as the outer shape of the pin 50. By doing so, the position of the optical fiber 40 can be fixed by inserting the pin 50 into the hole 24. A plurality of holes 24 may be formed in the platform 20. In that case, a plurality of pins 50 are prepared, and one hole 24 is provided.
, One pin 50 is inserted. Each hole 24 may be arranged at a position that is line-symmetric with respect to a straight line including the center point of the optical fiber 40. Alternatively, it may be arranged at a position surrounding the center point of the optical fiber 40 and connecting all of them with straight lines to draw a polygon of a triangle or more. The hole 24 may penetrate the platform 20 or may be a concave portion that does not penetrate.

The optical element 10 is mounted inside the recess 30 with the surface opposite to the surface having the optical portion 12 facing. The optical part 12 of the optical element 10 faces the opening direction of the recess 30. The concave portion 30 is formed so as to be recessed from the surface around the platform 20 and has a space in which the optical element 10 can be mounted inside. More specifically, the bottom surface of the recess 30 (the first bottom surface 32 in FIG. 1) is
Preferably, it has a profile approximately equal to the surface opposite to the surface having 2. By doing so, the optical element 10 can be
If it is inserted into the position 0, the positioning with respect to the platform 20 can be performed, so that it is not necessary to newly provide a positioning step. Therefore, the optical module is manufactured easily and at low cost. Further, it is preferable that the depth of the concave portion 30 is deeper than at least the thickness of the optical element 10. For example,
The recess 30 has a thickness of about 50 to 500 μm more than the thickness of the optical element 10.
m deep. As a result, the end surface 46 of the optical fiber 40 does not come into contact with the optical
Can be attached to the platform 20.

When a plurality of optical elements 10 are mounted on one platform 20, a plurality of recesses 30 are formed on one platform 20. And a plurality of optical fibers 40 are provided corresponding to each optical element 10.

The recess 30 may have a plurality of bottom surfaces (first and second bottom surfaces 32 and 34 in FIG. 1). In the first and second bottom surfaces 32 and 34, the concave portion 30 has a lowermost bottom surface (first
Are formed in a plurality of steps so as to widen from the bottom surface 32) in the opening direction. In the example shown in FIG.
Above 2, a second bottom surface 34 is provided. The step between the first and second bottom surfaces 32 and 34 is not limited, but may be, for example, about 1.0 mm or less. The first and second bottom surfaces 32 and 34 are preferably parallel to each other, and are also preferably parallel to the surface of the optical element 10. The surface connecting the first and second bottom surfaces (the wall surface of the concave portion 30) may be, for example, a wall surface perpendicular to the first bottom surface 32 or a tapered wall surface. Good. The wiring layer 22 is formed so as to reach the first and second bottom surfaces 32 and 34, and is also formed on a wall surface connecting the first and second bottom surfaces 32 and 34.

When a taper is provided, the taper may be a forward taper whose opening is narrowed in the depth direction, or may be a reverse taper. When a forward taper is provided, it becomes easy to insert the optical element 10 and passive components. Further, it becomes easy to form a pattern of the wiring layer 22 on a wall surface with a forward taper or on a corner portion where the wall surface is connected to another surface. That is, when a sputtering process, a photolithography process, or the like is used, the wiring layer 22 can be reliably formed in the recess 30. In the case of a forward taper, the wall surface of the concave portion 30 may be, for example, an inclined surface of about 5 to 45 degrees from a plane perpendicular to the first bottom surface 32. When a reverse taper is provided, even if a large number of die attach materials for bonding the optical element 10 to the first bottom surface 32 are provided, a pool can be formed. It is possible to prevent sneaking around.

The optical element 10 is mounted on the first bottom surface 32. The first bottom surface 32 is the lowermost bottom surface of the recess 30. Then, the second electrode 16 of the optical element 10 is electrically connected to a portion of the wiring layer 22 formed on the first bottom surface 32. Further, the optical element 10 may be bonded to the first bottom surface 32 with the adhesive 18. In this case, if the adhesive 18 is a conductive adhesive, electrical connection between the optical element 10 and the wiring layer 22 and mechanical connection between the optical element 10 and the platform 20 can be simultaneously established.

The first bottom surface 32 has a hole 36 (see FIG. 1).
May be formed. The hole 36 is formed inside the first bottom surface 32. By doing so, when the optical element 10 is bonded with the adhesive 18, the extra adhesive 18 enters the hole 36, so that the positional accuracy of the optical element 10 in the height direction can be improved. That is, the interface between the paste-like adhesive 18 and the optical element 10 is not uneven, and the optical element 10
Can be prevented from tilting with respect to the bottom surface 32. Hole 3
6 may be one or more grooves. Alternatively, it can be said that one or more projections are formed on the first bottom surface 32.

The optical element 10 may be electrically connected to the wiring layer 22 by wires 26. More specifically, the first electrode 14 of the optical element 10 is electrically connected to the wiring layer 22 by a wire 26. The wire 26 may be bonded to a portion of the wiring layer 22 formed inside the recess 30. In that case, the wire 26 is
It may be bonded to a portion formed on the second bottom surface 34. The top of the loop of the wire 26 is
It is arranged so as to be lower than the surface (virtual surface) where the opening end of the zero is located. By doing so, as shown in FIG. 3, even if the optical fiber 40 is attached to the platform 20, the wire 26 is not broken, and the reliability of the electrical connection is high. Note that the second bottom surface 34 may be at the same height as the surface of the optical element 10 having the optical portion 12, or may be lower or higher.

The optical fiber 40 includes a core 42 and a clad 44 concentrically surrounding the core 42. Light is reflected at the boundary between the core 42 and the clad 44, and the light is confined and propagated in the core 42. Is what you do. Optical fiber 40
May be formed of a material such as glass or plastic. Further, different materials may be used for the core 42 and the clad 44. In addition, the periphery of the clad 44 is often protected by a jacket (not shown), especially at a portion other than the end.

A pin 50 is provided around the end face 46 of the optical fiber 40. The pin 50 is connected to the optical fiber 40
Project from the end surface 46 of the optical fiber 40 in the axial direction. The pin 50 may extend in a direction parallel to the axial direction of the optical fiber 40. When the plurality of optical fibers 40 are aligned at the same time, the pins 50 may be respectively arranged on both sides of the group of optical fibers 40, avoiding each end face 46 of the plurality of optical fibers 40. The material of the pin 50 is not limited. The pin 50 may be referred to as a protrusion inserted into the hole 24.

As shown in FIG. 3, a fixing portion 52 for fixing the pin 50 to the optical fiber 40 is provided at an end of the optical fiber 40.
May be provided. The fixing part 52 may be provided so as to cover the periphery of the end part, avoiding the end face 46 of the optical fiber 40. As shown in FIG. 3, the fixing portion 52 may have a surface that is flush with the end surface 46 of the optical fiber 40. In this case, the surface of the fixed portion 52 that is flush with the end surface 46 of the optical fiber 40 may be in contact with the surface of the platform 20 outside the concave portion 30. That is, the fixing portion 52 may be used for axial positioning of the optical fiber 40. Further, the fixing portion 52 has a role as a stopper for keeping the end face 46 of the optical fiber 40 out of contact with the optical portion 12. The fixed part 52 and the platform 2
0 may be interposed between the adhesive.

The fixing section 52 is provided with one optical fiber 40.
One or a plurality of optical fibers 40 may be provided. The fixing part 52 may be formed of ceramic or the like. The fixing part 52 may be referred to as a ferrule. Further, a member is provided at the end of each optical fiber 40 so as to cover the periphery, and a plurality of optical fibers 40 are provided.
May be attached to one fixed part 52 collectively.

If necessary, a resin (not shown) may be provided in the recess 30 to seal the optical element 10. In this case, it is preferable to use a resin having a property of transmitting light at least between the optical portion 12 and the end face 46 of the optical fiber 40. The light transmitting resin is provided in close contact with the optical part 12 and the end face 46 of the optical fiber 40. Thereby, the loss of light transmission can be reduced, and the reliability of the electrical connection of the optical element 10 can be increased.

According to the optical module of the present embodiment, the optical fiber 40 is aligned with the optical element 10 by using the pins 50 provided at the ends of the optical fiber 40. According to this, since the pin 50 is inserted into the hole 24 and the optical fiber 40 is aligned, the handling of the optical fiber 40 is excellent. Therefore, the optical fiber 40
However, it is possible to provide an optical module aligned with the optical element 10 with high positional accuracy.

If the recess 30 is formed at a predetermined position and shape as described above, it is not necessary to align the optical element 10 with the platform 20.
An optical module is easily manufactured, and a low-cost optical module can be provided.

Further, since the wires 26 are used for the electrical connection between the optical element 10 and the wiring layer 22, the cost can be reduced. And the optical part 12
The optical fiber 40 faces the opening direction of the concave portion 30 and is provided close to the end face 46 of the optical fiber 40.
Are aligned with the optical part 12 with high positional accuracy.
Therefore, a low-cost and high-quality optical module can be provided.

The optical module according to the present embodiment is configured as described above, and its manufacturing method will be described below. The configuration, operation and effect described above are:
The following manufacturing methods can be applied as much as possible.

First, the optical device 10 and the platform 20 described above are prepared. The optical element 10 is mounted on a platform 20. More specifically, the optical element 10 is mounted with the surface opposite to the surface having the optical portion 12 facing the first bottom surface 32 of the recess 30. In this case, if the concave portion 30 is formed at a predetermined position and shape on the platform 20, it is not necessary to reposition the optical element 10 with respect to the platform 20. That is, the first bottom surface 32 of the concave portion 30 is connected to the optical portion 12 of the optical element 10.
Is formed with an outer shape substantially equal to the surface opposite to the surface having. Thus, the optical element 1 can be simply dropped by turning the optical element 10 toward the surface opposite to the surface having the optical portion 12.
0 can be aligned with the platform 20.

When the optical element 10 is bonded in the recess 30, the adhesive 18 may be provided on the optical element 10 side as shown in FIG. 1, or may be provided on the platform 20 side, or both. May be provided. In this case, the adhesive 18 may be in the form of a film or a paste at room temperature. When the second electrode 16 is formed on the surface of the optical element 10 opposite to the surface having the optical portion 12, the adhesive 18 preferably has conductivity.
Thereby, the mechanical connection of the optical element 10 and the wiring layer 22
Electrical connection to both. The conductive adhesive 18 may be, for example, a silver paste.

Then, the optical element 10 is pressed toward the recess 30. In that case, the optical element 10 may be heated. Then, the optical element 10 is fixed in the concave portion 30 by expressing the adhesive force of the adhesive 18. Part of the melted adhesive 18 is
Since the optical element 10 enters the hole 36 formed in the first bottom surface 32, the optical element 10 can be prevented from tilting with respect to the first bottom surface 32.

As shown in FIG. 2, the first electrode 14 of the optical element 10 and the wiring layer 22 of the platform 20 are electrically connected by wires 26. The wire 26 may be bonded by a wire bonder used for manufacturing a semiconductor device. The wire 26 has a tip portion formed into a ball shape by electric discharge and is connected to the first electrode 14 or the wiring layer 2.
2 and then the intermediate portion is looped and bonded to the other, followed by cutting. Wire 26
May be bonded to the first electrode 14 of the optical device 10 first, or may be bonded to the wiring layer 22 of the platform 20.
May be bonded first. A bump 28 may be formed in advance on the side to be bonded later (the first electrode 14 or the wiring layer 22). The bump 28 may be formed of the same material as the wire 26. Forming the bumps 28 facilitates bonding. In particular, the first electrode 1
This is effective when the height of each bonding surface of the wiring layer 4 and the wiring layer 22 does not change much. In addition, the wire 26
The bonding may be performed by at least one of heat, pressure, and ultrasonic vibration, and the material may be made of, for example, gold or aluminum.

Next, the optical fiber 40 is connected to the optical portion 12.
Attach it to the position. Optical fiber 40
Is provided with a pin 50 at its end. Pin 50
Project in the axial direction of the optical fiber 40 from the end face of the optical fiber 40. In the example shown in FIG.
0 is fixed to a fixing portion 52 provided around the end of the optical fiber 40.

The alignment of the optical fiber 40 is performed by
Through the hole 24 of the platform 20. When a plurality of pins 50 are provided at the end of the optical fiber 40, a plurality of holes 2 are formed in the platform 20.
4 are provided. The hole 24 is provided so as to avoid the recess 30, and one pin 50 is inserted into one hole 24. Each hole 2
4 and each pin 50 are provided at a position such that the center axes of the core 42 of the optical fiber 40 and the optical portion 12 coincide with each other. The pins 50 may extend through the platform 20 or may be fastened inside the platform 20. Since the pin 50 projects in the axial direction of the optical fiber 40, the optical fiber 40 can be fixed at a position on a plane perpendicular to the axial direction by inserting the pin 50 into the hole 24.

The alignment of the optical fiber 40 in the axial direction is performed as follows.
This may be performed by bringing the side of the fixing portion 52 facing the platform 20 into contact with the platform 20. Specifically, the fixing portion 52 is brought into contact with the outer surface of the concave portion 30.
When the depth of the recess 30 is deeper than the height of the optical element 10, the optical fiber 40 can be prevented from contacting the optical part 12.

Before or after the alignment of the optical fiber 40, a resin (not shown) may be provided in the concave portion 30. In that case, the optical element 10 and the wire 26 may be sealed with a resin. When a resin is also provided above the optical portion 12, it is preferable to use a resin having a property of transmitting light at least between the optical portion 12 and the end surface 46 of the optical fiber 40. The fixing portion 52 may be bonded and fixed to the platform 20 by using a resin provided in the concave portion 30. Alternatively, the resin may be provided up to the outer surface of the recess 30.

It is preferable to polish the end face 46 before positioning the optical fiber 40. This step is
This is performed in a state where the fixing portion 52 is attached to the optical fiber 40. More specifically, the surface of the fixing portion 52 on the end surface 46 side of the optical fiber 40 is polished so that the end surface 46 of the optical fiber 40 is flush with the surface of the fixing portion 52. According to this, if the surface of the fixing portion 52 is polished, the end surface 46 of the optical fiber 40 is polished, so that the optical fiber 40 is easy to handle. Then, in a subsequent step, the positioning may be performed using the pin 50 while using the fixing portion 52 of the optical fiber 40 as it is.

According to the manufacturing method of the optical module according to the present embodiment, the pin 5 provided at the end of the optical fiber 40 is provided.
Using 0, the optical fiber 40 is aligned with the optical element 10. According to this, since the positioning of the optical fiber 40 can be performed by attaching the pin 50 to the hole 24, the handling of the optical fiber 40 is excellent. Therefore, the optical fiber 40 can be positioned with respect to the optical element 10 with high positional accuracy.

If the concave portion 30 is formed in a predetermined position and shape, it is not necessary to align the optical element 10 with the platform 20, so that an optical module can be easily manufactured.

(Second Embodiment) FIGS. 4 to 6 are views showing an optical module according to a second embodiment of the present invention and a method for manufacturing the same. In the following examples, the contents described in the other embodiments can be applied as much as possible.

As shown in FIG. 6, this optical module
The optical device 10 includes the optical device 10, the platform 120, and the optical fiber 40. The platform 120 is a wiring layer 1
22 and a concave portion 30 (see FIG. 4) that is recessed from the surrounding surface. The contents of the wiring layer 122 and the recess 30 are as described in the above embodiment. The relative position between the optical element 10 and the optical fiber 40 is determined by the guide 150.

The platform 120 has a depression 140
Are formed. The recess 140 is a guided portion to which the guide portion 150 is attached. As shown in FIG. 1, the depression 140 has the recess 30 inside. In other words, the recess 140 is formed above the recess 30 so as to communicate with the recess 30, and the outer periphery of the recess 140 is larger than the outer periphery of the recess 30. That is, the hole formed by the combination of the concave portion 30 and the concave portion 140 is formed from the first bottom surface 32 of the concave portion 30.
A plurality of steps are formed on the platform 120 in the direction of the opening 40. It is preferable that the outer shape of the depression 140 in a plan view from the opening side is substantially equal to the outer shape of the guide portion 150 in a plan view from the end face side of the optical fiber 40. By doing so, the guide portion 150 having the optical fiber 40 as the center is fitted into the recess 140 without a gap. Therefore, the core 42 and the optical part 12 are accurately aligned.
The depth of the recess 140 is not particularly limited.
May be fixed on a plane perpendicular to the axial direction of the optical fiber 40. In addition, the wall surface of the depression 140 may be a wall surface perpendicular to the bottom surface outside the concave portion 30, or may be tapered so that the opening is narrowed in the depth direction, for example.

The guide part 150 is fitted in the recess 140. Here, the guide part 150 is provided around the end face 46 of the optical fiber 40. More specifically, the guide portion 150 is provided so as to cover the periphery of the end, avoiding the end surface 46 of the optical fiber 40. One guide 150 may be provided for one optical fiber 40, or one guide may be provided for a plurality of optical fibers 40. The guide part 150 may be formed of ceramic or the like. The guide section 150 may be referred to as a ferrule. A member is provided at the end of each optical fiber 40 so as to cover the periphery,
The plurality of optical fibers 40 are combined into a guide portion 15.
0 may be attached. The surface of the guide portion 150 facing the optical element 10 is a flat surface, and the optical fiber 40
And may be flush with the end face of Also, the guide section 15
The surface facing the zero optical element 10 may be circular, rectangular or other polygonal.

The end face 4 of the optical fiber 40 of the guide section 150
The surface which is flush with the inside of the recess 140 is
It may be in contact with the outer surface of 0. That is, the guide portion 150 may be positioned so as to be in contact with the platform 120, and the optical fiber 40 may be positioned in the axial direction. Further, the guide part 150 has a role as a stopper for keeping the end face 46 of the optical fiber 40 out of contact with the optical part 12. Note that an adhesive (not shown) may be interposed between the guide unit 150 and the platform 120.

Next, a method of manufacturing the optical module according to the present embodiment will be described. The configuration, operation, and effect described above can be applied to the following manufacturing method as much as possible.

As shown in FIG. 4, an optical element 10 and a platform 120 are prepared. Platform 120
Is formed with a recess 140 having the recess 30 inside. In other words, the recess 140 communicates with the recess 30 above the recess 30 and has an outer periphery that is larger than the outer periphery of the recess 30. The optical element 10 is mounted on the first bottom surface 32 of the recess 30.

As shown in FIG. 5 and FIG.
0 is mounted in alignment with the optical part 12. Specifically, the guide unit 150 is connected to the platform 1
It fits into the depression 140 of 20. The outer shape in plan view from the opening side of the recess 140 is the optical fiber 4 of the guide portion 150.
When the outer shape of the optical fiber 40 is substantially equal to the outer shape in a plan view from the end surface side of the optical fiber 40, the optical fiber 40 can be aligned with the optical part 12 only by fitting the guide part 150 into the recess 140. The alignment of the optical fiber 40 in the axial direction is performed by bringing the surface of the guide portion 150, which is flush with the end surface 46 of the optical fiber 40, into contact with the surface inside the recess 140 and outside the recess 30. Is also good.

The end face 46 of the optical fiber 40 is
Polishing may be carried out in a state having 50. If necessary, a resin may be provided in the recess 30. For these, the contents described in the above embodiment can be applied.

In the method of manufacturing the optical module according to the present embodiment, the guide 150 provided to cover the periphery of the end of the optical fiber 40 is fitted into the recess 140 of the
Align. Since the guide 150 is merely fitted into the recess 140, the optical fiber 40 can be easily positioned.

(Third Embodiment) FIGS. 7 to 9 are views showing an optical module according to a third embodiment of the present invention and a method of manufacturing the same. In the following examples, the contents described in the other embodiments can be applied as much as possible.

As shown in FIG. 9, this optical module
The optical device includes an optical element 10, at least one electronic component (for example, a semiconductor chip 110), a platform 220, and an optical fiber 40. The platform 220 has a wiring layer 222 and a plurality of recesses 3 recessed from the surrounding surface.
It has 0,60. The optical element 10 and the optical fiber 40
The relative position is determined by fitting the guide portion 250 into the recess 240.

In the present embodiment, the platform 22
A plurality of recesses (for example, the recesses 30 and 60 in FIG. 7) are formed in 0. The optical element 10 is mounted in the concave portion 30, and the electronic component (for example, the semiconductor chip 11
0) is mounted. Here, the electronic components are a semiconductor chip, a resistor, a capacitor, a coil, a transmitter, a filter, a temperature sensor, a thermistor, a varistor, a volume,
It may be a fuse, a heat sink, a Peltier element, a heat pipe, or the like. The electronic component may be a surface mount type or an insert mount type. The electronic component may be mounted face-down with the surface having the electrodes facing the first bottom surface of the concave portion of the platform 220, or may be mounted face-up toward the opening side of the concave portion.
The electrical connection between the electronic components or between the electronic component and the wiring layer 222 can be performed using a wire, a conductive adhesive, a bump, or the like.

The plurality of recesses (for example, recesses 30 and 60)
The number may be determined according to the number of optical elements 10 and electronic components mounted on the platform 220. One electronic component may be arranged in one recess,
Alternatively, two or more electronic components may be arranged in one recess. In the latter case, two or more electronic components may be stacked and arranged. It is preferable that the lowermost first bottom surface (for example, the first bottom surface 62) of the concave portion for mounting the electronic component has an outer shape substantially equal to the planar outer shape of the electronic component. In this way, the positioning with respect to the platform 220 can be performed only by dropping the electronic component into the recess.

In the example shown in FIG. 9, the concave portion 30 (see FIG. 7)
The optical element 10 is mounted on the semiconductor device, and the semiconductor chip 110 is mounted on the concave portion 60 (see FIG. 7). Each recess 30, 60
May have the form described above, and have first and second bottom surfaces 32, 34, 62, 64 (see FIG. 7) forming a plurality of steps so that the concave portion becomes wider in the opening direction. May be. Then, the lowermost first bottom surface 3 of each of the concave portions 30 and 60
The optical element 10 or the semiconductor chip 110 is mounted on 2, 62.

The platform 220 has a depression 240
Are formed. The recess 240 is a guided portion to which the guide portion 250 is attached. As shown in FIG. 7, the depression 240 has recesses 30 and 60 inside. In other words, the depression 240 has an outer periphery of a size including the plurality of depressions 30, 60 and is formed so as to communicate with each of the depressions 30, 60. It is preferable that the outline of the recess 240 viewed from the opening side in plan view is substantially equal to the outline of the guide portion 250 viewed from the end surface side of the optical fiber 40 in plan view. By doing so, the guide portion 2 having the optical fiber 40 at the center is formed in the recess 240.
50 can be fitted without any gap. Therefore, the core 42 and the optical part 12 are accurately aligned. The depth of the depression 240 is not particularly limited as long as the guide 250 can be fixed on a plane perpendicular to the axial direction of the optical fiber 40.

The guide 250 is fitted in the recess 240. That is, the guide portion 250 is provided with the plurality of recesses 3.
It is attached to the platform 220 so as to block 0 and 60. The surface of the guide 250 facing the depression 240 may be a flat surface. The surface may be flush with the end surface 46 of the optical fiber 40 and the depression 240
May be in contact with the outer surface of each of the recesses 30 and 60. That is, the guide portion 250 is positioned so as to be in contact with the platform 220, and the optical fiber 4
Zero position alignment may be performed. A member is provided at the end of each optical fiber 40 so as to cover the periphery,
The plurality of optical fibers 40 are combined into a guide portion 15.
0 may be attached.

As shown in FIG. 9, the first electrode 14 of the optical element 10 and the first electrode 112 of the semiconductor chip 110 are directly electrically connected by the wire 70. Specifically, one end of the wire 70 is connected to the optical element 1
0 is bonded to the first electrode 14, and the other end is bonded to the first electrode 112 of the semiconductor chip 110. The semiconductor chip 110 is used to drive the optical device 10. By directly joining the optical element 10 and the semiconductor chip 110 with the wires 70, the number of connection points can be reduced, so that poor electrical connection between them can be reduced. Further, since the connection is made directly by the wire 70, the wiring length can be shortened and the signal transmission loss can be reduced.

As shown in FIG. 9, when the portion between the concave portion 30 and the concave portion 60 is formed high up to the surface of the guide portion 250, a part thereof communicates with each of the concave portions 30 and 60. It is preferable to form the groove so as to form the groove. Since the groove is closed by the guide portion 250, the groove becomes a through hole communicating with each of the concave portions 30 and 60. According to this, the optical element 10 arranged in each of the recesses 30 and 60 and the semiconductor chip 110 can be electrically connected by passing the wire 70 above the groove (inside the through hole). Therefore, each recess 30, 6
The optical element 10 and the electronic component can be directly connected by the wire 70 while the guide portion 250 is stably supported by raising the portion between 0.

In the method of manufacturing an optical module according to the present embodiment, as shown in FIG. 7, the optical element 10 is mounted in the concave portion 30 and the semiconductor chip 110 is mounted in the concave portion 60. Then, as shown in FIG.
0 and the semiconductor chip 110 are electrically connected, and the wires 7
2, the semiconductor chip 110 and the wiring layer 222 are electrically connected. Thereafter, as shown in FIG.
The guide part 250 is attached to the platform 220 so as to cover 0 and 60.

According to this, the recess 6 for mounting an electronic component is provided.
If 0 is formed in a predetermined position and shape, the electronic component does not need to be aligned with the platform 220, and therefore, its manufacture is easy. Further, since the plurality of recesses 30 and 60 can be closed by the guide portion 250, the optical element 10 and the electronic components are not exposed to the outside. Therefore, it is hard to receive the influence from the outside (for example, invasion of moisture), and it is possible to manufacture a highly reliable optical module.

(Fourth Embodiment) FIG. 10 to FIG.
It is a figure showing an optical module concerning a 4th embodiment to which the present invention is applied, and a manufacturing method for the same. In the example below,
The contents described in the other embodiments can be applied as much as possible.

As shown in FIG. 12, the optical module comprises an optical element 10, at least one electronic component (for example, a semiconductor chip 110), a platform 320,
An optical fiber 40 is included.

The platform 320 has the wiring 322 and a plurality of recesses 130 and 160 recessed from the surrounding surface.
Having. The optical element 10 is mounted on the first bottom surface 132 of the concave portion 130, and the first bottom surface 1
A semiconductor chip 110 is mounted on 62. Adhesives 18, 1 are provided on respective first bottom surfaces 132, 162.
Holes 136 and 166 into which 16 enters may be formed.
The relative position between the optical element 10 and the optical fiber 40 is determined by fitting the guide portion 350 into the recess 340, and the electronic component is electrically connected to the wiring layer 322 by the conductive film 352 formed on the guide portion 350. Connected.

A conductive film 352 is formed on the guide portion 350 on the side facing the depression 340. For example, a conductive film 352 may be formed on a surface of the guide portion 350 facing the depression 340. The conductive film 352 may be formed of the same material as the wiring layer 322 of the platform 320. The conductive film 352 may have a wiring pattern as needed. Then, the conductive film 352 electrically connects both the wiring layer 322 and the first electrode 14 of the optical element 10. In addition, the conductive film 352 includes the wiring layer 322 and the electrodes of the semiconductor chip 110 (the first and second electrodes 12,
14) may be electrically connected. Conductive film 352
Is preferably formed on a flat surface to prevent the disconnection, but may be formed on a plurality of surfaces of the guide portion 350 instead of being flat. When the conductive film 352 is formed on a flat surface, as shown in FIG.
The surface having the first electrode 14 is preferably arranged at substantially the same height as the surface (virtual surface) where the opening end of the concave portion 30 is located. This is the same for the semiconductor chip 110.

In addition, the conductive film 352 is directly
0 may be connected to both the first electrode 14 and the electrode of the semiconductor chip 110 (for example, the first electrode 12). Note that the conductive film 352 may be bonded to the above-described electrode or wiring layer 322 through a conductive adhesive. Alternatively, bonding may be performed via conductive protrusions such as bumps.

In the example shown in FIG. 12, the depression 340 is formed in a plurality of steps in the opening direction. According to this,
By forming the guide portion 350 in a shape corresponding to the depression 340, the contact area between the guide portion 350 and the platform 320 can be increased, and both can be reliably mechanically fixed. Thereby, the conductive film 35
2 can securely adhere the optical element 10 or the electronic component to the wiring layer 322, so that the electrical connection reliability of the optical module can be improved.

In the method of manufacturing an optical module according to the present embodiment, as shown in FIG. 10, the optical element 10 is mounted in the concave portion 30 and the semiconductor chip 110 is mounted in the concave portion 60. Then, as shown in FIG. 11 and FIG.
Are aligned with the recesses 340 and each recess 30, 6
Attach to the platform 320 so as to cover the “0”.
Electrical connection of the optical element 10 and the semiconductor chip 110 to the wiring layer 320 is achieved by a conductive film 352 formed on the guide portion 350.

According to this, the conductive film 3 is
By forming 52, the optical fiber 40 can be aligned and the optical element 10 can be electrically connected to the wiring layer 322, for example. Therefore, the optical element 1
Since there is no need to provide a step of electrically connecting 0 to the wiring layer 322, an optical module can be manufactured with a small number of steps.

(Fifth Embodiment) FIG. 13 to FIG.
It is a figure showing the optical module concerning a 5th embodiment to which the present invention is applied, and its manufacturing method. In the example below,
The contents described in the other embodiments can be applied as much as possible.

As shown in FIG. 15, the optical module includes an optical element 10, at least one electronic component (for example, a capacitor 210), a platform 420, and an optical fiber 40. Platform 420
It has a wiring layer 422 and has a plurality of recesses 230 and 260 (see FIG. 13) that are recessed from the surrounding surface. The optical element 10 is mounted in the concave portion 230, and the vertical capacitor 210 is mounted in the concave portion 260. And the optical element 1
The relative positions of the optical fiber 40 and the optical fiber 40 are determined by inserting a pin 450 into a hole 424 formed in the platform 420.

The concave portion 230 has first to third bottom surfaces 232,
234 and 238 (see FIG. 13). The first to third bottom surfaces 232, 234, 238 are provided by forming a plurality of steps so that the concave portion 230 becomes wider in the opening direction. Specifically, the first bottom surface 232 is the lowermost bottom surface, the second bottom surface 234 is provided above the first bottom surface 232,
A third bottom surface 238 is further provided above the bottom surface 234 of FIG. A hole 236 into which the adhesive 18 enters is formed in the first bottom surface 232, and the optical element 10 is mounted. Then, the first electrode 14 of the optical element 10 is connected to the wiring layer 4 formed on the second bottom surface 234 by the wire 74.
22 is electrically connected. The second bottom surface 234 may be formed around the first bottom surface 232 in a plan view from the opening side of the concave portion 30 as shown in FIG. It may be formed only on the electrode 14 side.

The lens section 80 is provided inside the concave section 230 of the platform 420. Lens section 80
Is located above the optical part 12. Lens section 80
The shape of is not limited, but may be, for example, a plate-like shape having a convex shape at the center thereof. In that case, the central part of the lens part 80 is arranged above the optical part 12. The light intensity distribution of the optical part 12 and the light intensity distribution of the core 42 of the optical fiber 40 can be matched by the lens unit 80. In particular, when a plastic fiber is used as the optical fiber 40, since the diameter of the core 42 is large, it is preferable to provide the lens unit 80 on the light receiving element side.

In the example shown in FIG. 15, the end of the lens portion 80 is placed on the third bottom surface 238 (see FIG. 13), so that the central portion of the lens portion 80 is disposed above the optical portion 12. I have. Here, the third bottom surface 238 is
It may be formed around the first and second bottom surfaces 232 and 234 in a plan view from the opening side of 0. In that case,
The lens unit 80 may be placed on the third bottom surface 238 so as to cover the recess 230. Alternatively, the lens unit 80
The recess 230 may be placed on the third bottom surface 238 so as not to be blocked. Note that the third bottom surface 238 is preferably a surface parallel to the surface having the optical portion 12 of the optical element 10. If necessary, a resin (not shown) may be provided in the concave portion 230, and the lens portion 80 may be bonded and fixed to the platform 420 by the resin.

As shown in FIG. 15, a fixing portion 452 for fixing the pin 450 is formed at the end of the optical fiber 40. And the fixing part 452 is the platform 4
20 is fitted into the depression 440 formed in the same.
Here, the depression 440 has a plurality of recesses 230 and 260 inside. In other words, the depression 440 has an outer periphery sized to include the plurality of recesses 230 and 260, and each recess 23
0, 260 are formed. The depression 440 is
It may be the same as the form used as the guided part shown in the above-described embodiment. That is, the fixing portion 45
2 may be attached to the depression 440 serving as a guided portion as the guide portion shown in the above-described embodiment.

In the fixing portion 452, a conductive film 454 may be formed on the side facing the depression 440. The conductive film 454 is as described in the above embodiment, and is formed as a wiring pattern as necessary. Figure 1
In the example shown in FIG. 5, the conductive film 454 makes the capacitor 2
The ten first electrodes 212 and the wiring layer 422 are both electrically connected. If the conductive film 454 is formed on the flat surface of the fixing portion 452, the conductive film 454 is not easily disconnected. When the lens element 80 is not provided in the optical element 10, via the conductive film 454 formed in the fixing part 452
The first electrode 14 of the optical element 10 and the wiring layer 422 may be electrically connected.

The second electrode 214 is formed on the surface of the capacitor 210 facing the bottom of the recess 260, and is electrically connected to the wiring layer 422 formed on the bottom of the recess 260. ing. The provision of the capacitor 210 can prevent the value of the power supply voltage for driving the optical element 10 from changing due to noise.

In the method for manufacturing an optical module according to the present embodiment, as shown in FIG. 13, the optical element 10 is mounted in the concave portion 230, and the capacitor 210 is mounted in the concave portion 260. Then, as shown in FIG.
Above the optical portion 12 of the optical fiber 4 and the pin 450 is inserted through the hole 424 of the
0 is aligned with the optical part 12. Further, as shown in FIG.
It may be fitted into the depression 440 so as to cover the 60. In the example shown in FIG. 15, the electrical connection between the first electrode 212 of the capacitor 210 and the wiring layer 320 is
2 is achieved by the conductive film 454 formed in the second conductive film.

(Sixth Embodiment) FIG. 16 is a view showing an optical transmission device according to a sixth embodiment to which the present invention is applied. The light transmission device 500 includes the form of the above-described optical module, and the optical element 10 is provided on each end face 46 of the optical fiber 40 with the optical part 12 facing. Specifically, a light-emitting element is provided on one end face of the optical fiber 40 with the light-emitting portion facing the light-receiving element, and a light-receiving element is provided on the other end face of the optical fiber 40 with the light-receiving section facing the light. And the light emitting element is the first
The light receiving element is mounted in the concave portion formed in the second platform, and the light receiving element is mounted in the concave portion formed in the second platform. Further, as described above, the optical fiber 40 and the optical element 10 (light emitting element or light receiving element) are configured such that the guide provided at the end of the optical fiber 40 is attached to the guided part provided on the platform. Are aligned.

The light transmission device 500 interconnects electronic devices 502 such as a computer, a display, a storage device, and a printer. The electronic device 502 may be an information communication device. The optical transmission device 500 includes a cable 5
04 may be provided with plugs 506 at both ends. The cable 504 has one or more optical fibers 4
Contains 0. The plug 506 may incorporate the platform described in the above embodiment. Plug 506 is
Electronic components may be incorporated.

[0142] An electric signal output from one electronic device 502 is converted into an optical signal by the optical element 10 which is a light emitting element. The optical signal travels through the optical fiber 40 and is input to the other optical element 10. The optical element 10 is a light receiving element, and converts an input optical signal into an electric signal. The electric signal is input to the other electronic device 502. Thus, according to optical transmission device 500 according to the present embodiment, information transmission of electronic device 502 can be performed by an optical signal.

(Seventh Embodiment) FIG. 17 is a diagram showing a use form of an optical transmission device according to a seventh embodiment to which the present invention is applied. The light transmission device 512 includes the electronic device 510.
Connect between. As the electronic device 510, a liquid crystal display monitor or a digital CRT (sometimes used in the fields of finance, mail order, medical care, and education), a liquid crystal projector, a plasma display panel (PDP), a digital TV, and a retailer Checkout (POS (Pointof Sale S
canning), video, tuner, game machine, printer, and the like.

[Brief description of the drawings]

FIG. 1 is a diagram illustrating a method for manufacturing an optical module according to a first embodiment to which the present invention is applied.

FIG. 2 is a diagram illustrating a method for manufacturing an optical module according to a first embodiment to which the present invention is applied.

FIG. 3 is a diagram illustrating an optical module according to a first embodiment to which the present invention is applied.

FIG. 4 is a diagram illustrating a method for manufacturing an optical module according to a second embodiment to which the present invention is applied.

FIG. 5 is a diagram illustrating a method for manufacturing an optical module according to a second embodiment to which the present invention is applied.

FIG. 6 is a diagram illustrating an optical module according to a second embodiment to which the present invention is applied.

FIG. 7 is a diagram illustrating a method for manufacturing an optical module according to a third embodiment to which the present invention is applied.

FIG. 8 is a diagram illustrating a method of manufacturing an optical module according to a third embodiment to which the present invention is applied.

FIG. 9 is a diagram illustrating an optical module according to a third embodiment to which the present invention is applied.

FIG. 10 is a diagram illustrating a method of manufacturing an optical module according to a fourth embodiment to which the present invention is applied.

FIG. 11 is a diagram showing a method for manufacturing an optical module according to a fourth embodiment to which the present invention is applied.

FIG. 12 is a diagram showing an optical module according to a fourth embodiment to which the present invention is applied.

FIG. 13 is a diagram illustrating a method of manufacturing an optical module according to a fifth embodiment to which the present invention is applied.

FIG. 14 is a diagram illustrating a method of manufacturing an optical module according to a fifth embodiment to which the present invention is applied.

FIG. 15 is a diagram showing an optical module according to a fifth embodiment to which the present invention is applied.

FIG. 16 is a diagram illustrating a light transmission device according to a sixth embodiment to which the present invention has been applied.

FIG. 17 is a diagram showing a usage form of a light transmission device according to a seventh embodiment to which the present invention is applied.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Optical element 12 Optical part 14 1st electrode 16 2nd electrode 18 Adhesive 20 Platform 22 Wiring layer 24 Hole 30 Depression 32 1st bottom surface 34 2nd bottom surface 36 Hole 40 Optical fiber 50 Pin 52 Fixing part 60 Concave portion 62 First bottom surface 64 Second bottom surface 66 Hole 70 Wire 72 Wire 74 Wire 80 Lens portion 110 Semiconductor chip 120 Platform 122 Wiring layer 130 Concave portion 132 First bottom surface 134 Second bottom surface 136 Hole 140 Depression 150 Guide portion 160 Recess 162 first bottom surface 166 hole 220 platform 222 wiring layer 230 recess 232 first bottom surface 234 second bottom surface 236 hole 238 third bottom surface 240 recess 250 guide portion 260 recess 320 platform 322 wiring layer 340 recess 350 g Id part 352 Conductive film 420 Platform 422 Wiring layer 424 Hole 440 Depression 450 Pin 452 Fixed part 454 Conductive film 500 Light transmission device 506 Plug 512 Light transmission device

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2H036 NA01 QA01 QA49 2H037 AA01 BA02 BA11 DA03 DA04 DA06 DA11 5F041 AA39 AA41 DA02 DA07 EE02 FF14 5F073 AB17 AB27 AB28 BA01 FA06 FA13 FA23 FA27 5F088 BA12 JA04 JA12 JA04

Claims (31)

[Claims] 1. A method for manufacturing an optical module using a platform having a concave portion, an optical device having an optical portion on one surface, and an optical waveguide, wherein the optical device is provided in the concave portion. A first step of mounting the one surface so as to face the opening side of the concave portion; fitting a guide portion provided around an end surface of the optical waveguide with a guided portion provided on the platform; And positioning the optical waveguide on the platform such that the end face of the optical waveguide and the optical portion face each other. 2. The method of manufacturing an optical module according to claim 1, wherein the guide portion is a pin that protrudes in an axial direction of the optical waveguide from an end surface of the optical waveguide, and the guided portion is A method of manufacturing an optical module, wherein the hole is formed so as to avoid a recess, and the second step is performed by inserting the pin into the hole. 3. The method for manufacturing an optical module according to claim 2, wherein the optical waveguide includes a fixing portion for fixing the pin around the end face. 4. The method of manufacturing an optical module according to claim 1, wherein the guided portion is a depression, and the recess is formed inside the depression, and the guide is fitted into the depression. An optical module manufacturing method for performing the second step. 5. The method for manufacturing an optical module according to claim 3, wherein a conductive film is formed on the fixing portion on a side facing the platform, and a wiring layer is formed on the platform, wherein the second step is performed. 3. The method of manufacturing an optical module according to claim 1, wherein the wiring layer and the optical element are brought into contact with the conductive film to electrically connect the optical element and the wiring layer. 6. The method for manufacturing an optical module according to claim 4, wherein a conductive film is formed on the guide portion on a side facing the platform, a wiring layer is formed on the platform, and the second step is performed. 3. The method of manufacturing an optical module according to claim 1, wherein the wiring layer and the optical element are brought into contact with the conductive film to electrically connect the optical element and the wiring layer. 7. The method for manufacturing an optical module according to claim 1, wherein the optical element has an electrode on a surface having the optical portion, and the platform has a recess. A method for manufacturing an optical module, further comprising: electrically connecting a wiring layer formed inside the concave portion and the electrode with a wire, wherein the wiring layer is formed in a region including: 8. The method for manufacturing an optical module according to claim 1, wherein a lens portion is provided inside the concave portion of the platform and on the one surface side of the optical portion. A method for manufacturing an optical module, further comprising providing. 9. The method for manufacturing an optical module according to claim 1, wherein the concave portion has a plurality of bottom surfaces forming a plurality of steps, and is widened in the opening direction from the lowest bottom surface. The manufacturing method of the optical module formed so that it may become. 10. The method for manufacturing an optical module according to claim 9, wherein one end of the wire is connected to the wiring layer on a bottom surface of the bottom surface above the bottom surface on which the optical element is mounted. A method for manufacturing an optical module to be bonded. 11. The method for manufacturing an optical module according to claim 9, wherein an end of said lens portion is placed on a bottom surface of each bottom surface above a bottom surface on which said optical element is mounted. Module manufacturing method. 12. The method of manufacturing an optical module according to claim 9, further comprising: bonding the optical element to the lowermost bottom surface with an adhesive. , A method for manufacturing an optical module, wherein a hole for allowing the adhesive to enter is formed. 13. The method for manufacturing an optical module according to claim 1, wherein the platform has a second concave portion, and an electronic component is mounted in the second concave portion. The manufacturing method of the optical module which further contains. 14. The method of manufacturing an optical module according to claim 13, wherein the recess has the concave portion and the second concave portion inside, and the guide portion has the concave portion and the second concave portion. A method of manufacturing an optical module, wherein the optical module is fitted into the recess so as to cover the opening of the second recess. 15. An optical module manufactured by the method for manufacturing an optical module according to claim 1. Description: 16. A platform having a concave portion, an optical element having an optical portion on one surface, and being arranged with the one surface facing the opening side of the concave portion, and an end surface provided on the optical portion. An optical waveguide disposed toward the optical waveguide; a guide portion for alignment provided around the end face of the optical waveguide; and a guided portion provided on the platform and fitted with the guide portion. Optical module. 17. The optical module according to claim 16, wherein the guide portion is a pin protruding in an axial direction of the optical waveguide from an end surface of the optical waveguide, and the guided portion avoids the concave portion. An optical module, wherein the pin is inserted through the hole. 18. The optical module according to claim 17, wherein the optical waveguide has a fixing portion for fixing the pin around the end face. 19. The optical module according to claim 16, wherein the guided portion is a depression, the concave portion is formed inside the depression, and the guide portion is fitted into the depression. 20. The optical module according to claim 18, wherein a conductive film is formed on the fixing portion on a side facing the platform, a wiring layer is formed on the platform, and the wiring layer and the optical element are provided. An optical module in which the optical element is electrically connected to the wiring layer by contacting the conductive film with the conductive film. 21. The optical module according to claim 19, wherein a conductive film is formed on the guide portion on a side facing the platform, a wiring layer is formed on the platform, and the wiring layer and the optical element are provided. An optical module in which the optical element is electrically connected to the wiring layer by contacting the conductive film with the conductive film. 22. The optical module according to claim 16, wherein the optical element has an electrode on a surface having the optical portion, and the platform has a region including the concave portion. An optical module, wherein a wiring layer is formed on the wiring layer, and the wiring layer formed inside the concave portion and the electrode are electrically connected by a wire. 23. The optical module according to claim 16, wherein a lens portion provided inside the concave portion of the platform and on the one surface side of the optical portion is provided. Optical module further including. 24. The optical module according to claim 16, wherein the recess has a plurality of bottom surfaces forming a plurality of steps, and is widened from the bottom surface in the opening direction. An optical module formed. 25. The optical module according to claim 24, wherein the wire is bonded to the wiring layer on a bottom surface of each of the bottom surfaces above a bottom surface on which the optical element is mounted. Optical module. 26. The optical module according to claim 24, wherein an end of the lens portion is mounted on a bottom surface of each of the bottom surfaces above a bottom surface on which the optical element is mounted. Optical module. 27. The optical module according to claim 24, wherein the optical element is bonded to the lowermost bottom surface with an adhesive, and the adhesive is bonded to the lowermost bottom surface. An optical module in which a hole into which is inserted is formed. 28. The optical module according to claim 16, wherein the platform has a second recess, and further includes an electronic component mounted in the second recess. . 29. The optical module according to claim 28, wherein the recess has the concave portion and the second concave portion inside, and the guide portion has the concave portion and the second concave portion. An optical module which is fitted into the recess so as to cover the opening of the recess. 30. A first and a second platform having a concave portion, a light emitting element mounted with a light emitting portion facing an opening side of the concave portion of the first platform, and the second platform. A light-receiving element mounted on the opening side of the concave portion with a surface having a light-receiving section facing the light-receiving element; one light-receiving element disposed with the one end face facing the light-emitting section; A waveguide, a positioning guide portion provided around both end faces of the optical waveguide, and a guided portion provided on the first and second platforms and having one of the guide portions attached thereto. An optical transmission device comprising: 31. The light transmission device according to claim 30, further comprising: a plug connected to the light receiving element; and a plug connected to the light emitting element.