JP6234036B2 - Optical communication device - Google Patents

Description

  The present invention relates to an optical communication apparatus.

  Conventionally, an IC (Integrated Circuit) chip mounting substrate in which a conductor circuit and an interlayer resin insulation layer are laminated on both sides of the substrate, an optical element is mounted, and an optical path for optical signal transmission is formed. There is an IC chip mounting substrate in which an optical element sealing layer is formed so as to be in contact with the outer periphery of the optical element (see, for example, Patent Document 1).

JP 2006091753 A

  By the way, when the sealing layer exists around the optical element, the optical characteristics are affected, and the reliability may be lowered.

  Therefore, an object of the present invention is to provide a highly reliable optical communication device.

An optical communication device according to an aspect of the present invention includes a substrate having a through hole and an optical terminal that receives or emits light, and the optical terminal is arranged on one side of the substrate so that the optical terminal faces one end of the through hole. An optical element mounted on a surface, a first lens that is integrally molded with a resin and facing the optical terminal, and protrudes from the one surface side of the substrate toward the optical element and surrounds the first lens. Light having an encircling portion that encloses and a guide portion that is disposed inside the through hole and guides light between the one end side and the other end side where the first lens and the enclosing portion are disposed. A guide member; and an optical waveguide member disposed on the other surface side of the substrate and having an optical waveguide optically connected to the other end side of the light guide member.

  A unique effect is obtained that a highly reliable optical communication device can be provided.

It is sectional drawing which shows the optical communication apparatus by a base technology. 1 is a diagram illustrating an optical communication device 100 according to a first embodiment. 6 is a diagram illustrating an optical communication apparatus 200 according to Embodiment 2. FIG. 6 is a diagram illustrating an optical communication device 300 according to a third embodiment. FIG. 6 is a diagram illustrating an optical communication device 400 according to a fourth embodiment. FIG. FIG. 10 is a diagram illustrating an optical communication device 500 according to a fifth embodiment. FIG. 10 shows an optical communication device 600 according to a sixth embodiment. FIG. 10 shows an optical communication apparatus 700 according to a seventh embodiment.

  First, the prerequisite technology of the optical communication apparatus of the present invention will be described with reference to FIG.

  FIG. 1 is a cross-sectional view showing an optical communication apparatus according to the base technology.

  The optical communication device 50 according to the base technology includes a substrate 10, an optical element 20, an optical waveguide member 30, and a lens 40.

  The substrate 10 is a member on which the optical element 20 is mounted and functions as a reinforcing layer for reinforcing the optical waveguide member 30. For example, an FPC (Flexible Circuit Board) can be used. The FPC may be a resin substrate such as polyimide, for example.

  On the upper surface of the substrate 10, wiring 12 for supplying power to the optical element 20, wiring 12 for transmitting an electrical signal output from the optical device 20, and the like are formed.

  The substrate 10 has a through hole 11, and the through hole 11 penetrates the substrate 10 in the thickness direction. The optical terminal 21 of the optical element 20 is located above the through hole 11, and the lens 40 is located below the through hole 11. In the through hole 11, an optical path indicated by an arrow is formed between the optical terminal 21 and the lens 40.

  The optical element 20 may be an element that emits light, such as a laser element, an element that receives light and converts it into an electrical signal, such as a photodiode, or an element that emits and receives light. The optical element 20 is flip-chip mounted on one surface (the upper surface in FIG. 1) of the substrate 10 with a bump 22 and a sealing resin 23.

  When the optical element 20 is flip-chip mounted on the substrate 10, the bumps 22 bonded to the terminals of the optical element 20 and the wiring 12 of the substrate 10 are electrically connected by ultrasonic bonding or the like. The optical element 20 is firmly bonded to the substrate 10 by flip chip mounting using the bumps 22 and the sealing resin 23 as described above. The optical element 20 generates heat when driven, and is connected to the substrate 10 due to expansion due to heat generation. This is because stress occurs in the portion. A plating layer 22 </ b> A is formed between the bump 22 and the wiring 12 of the substrate 10 by melting a part of the plating formed on the surface of the wiring 12.

  In addition to the optical element 20, an electronic component 20A may be mounted on the substrate 10.

  The optical waveguide member 30 is a sheet-like member and includes an optical waveguide 31 and a mirror 32. The optical waveguide 31 is a part that transmits light like an optical fiber, for example, and is realized by a core layer having a high refractive index and a cladding layer having a low refractive index. The mirror 32 is realized by forming a groove having a triangular cross section in the optical waveguide member 30.

  As shown in FIG. 1, the optical waveguide member 30 has a surface formed at 45 degrees with respect to the optical waveguide 31, thereby totally reflecting the light transmitted through the optical waveguide 31 and changing the direction by 90 degrees. And transmitted to the lens 40.

  The optical waveguide member 30 is bonded to the lower surface of the substrate 10.

  The lens 40 includes a sheet portion 41 and a lens portion 42 formed at the center of the sheet portion 41. Since the lens 40 is located at the lower end of the through hole 11, the optical path between the lens 40 and the optical terminal 21 of the optical element 20 is the gap between the inside of the through hole 11 and the optical element 20 and the substrate 10. And is formed over the part.

  By the way, in the stage of manufacturing the optical communication device 50 of such a premise technology, when the optical device 20 is flip-chip mounted, the sealing resin 23 may flow into the through hole 11 from the upper end side of the through hole 11. There is.

  This is because there is no member for suppressing the inflow of the sealing resin 23 on the upper end side of the through hole 11.

  When the sealing resin 23 flows into the through hole 11 in this way, the optical path between the optical terminal 21 of the optical element 20 and the lens 40 may be blocked. If the optical path between the optical terminal 21 of the optical element 20 and the lens 40 is blocked by the sealing resin 23, the optical communication between the optical element 20 and the optical waveguide member 30 may be adversely affected. The reliability of 50 may be reduced.

  Since mounting of such an optical element 20 may require high precision alignment accuracy, mounting is performed using a high precision mounter. However, when the bonding process of the sealing resin 23 associated with the mounting is complicated, there is a risk that the reliability of the product is lowered because variations easily occur between products.

  For this reason, below, it aims at providing an optical communication apparatus with high reliability.

  Embodiments to which the optical communication apparatus of the present invention is applied will be described below.

<Embodiment 1>
FIG. 2 is a diagram illustrating the optical communication device 100 according to the first embodiment. In the following, the same components as those in the optical communication device 50 of the base technology are denoted by the same reference numerals, and the description thereof is omitted.

  As shown in FIG. 2A, the optical communication device 100 according to the first embodiment includes a substrate 10, an optical element 20, an optical waveguide member 30, and a lens 110.

  As shown in FIGS. 2B and 2C, the lens 110 includes a lens portion 111, a surrounding portion 112, and a guide portion 113. The lens 110 is an example of a light guide member.

  The lens part 111, the surrounding part 112, and the guide part 113 are made of, for example, resin such as polyimide, and are integrally formed. The lens 110 is inserted into and bonded to the through hole 11 of the substrate 10.

  The lens unit 111 is formed at one end (the upper end in FIG. 2) of the guide unit 113 and is surrounded by the surrounding unit 112.

  As shown in FIG. 2C, the surrounding portion 112 is formed at one end of the guide portion 113 so as to surround the lens portion 111. The surrounding portion 112 is a wall portion formed in a rectangular shape around the lens 111 in a plan view in a state of extending outward from the lens portion 111 and the guide portion 113 in a plan view.

  The height of the surrounding portion 112 is a height at which the upper end of the surrounding portion 112 does not contact the lower surface of the optical element 20 in a state where the lens 110 is installed on the substrate 10 as shown in FIGS. Is set to

  The guide part 113 is a cylindrical member in which the lens part 111 and the surrounding part 112 are formed on one end side. The diameter of the cylindrical shape of the guide portion 113 is the same as the diameter of the cylindrical through hole 11 formed in the substrate 10, so that the guide portion 113 is fitted into the through hole 11.

  The guide portion 113 is inserted into the through hole 11 of the substrate 10. The lower end of the guide portion 113 is aligned with the mirror 32 of the optical waveguide member 30 and forms an optical path between the lens portion 111 and the optical waveguide 31. The length of the guide portion 113 is set so that the lower end is flush with the lower surface of the substrate 10.

  Such an optical communication device 100 according to the first embodiment is similar to the optical communication device 50 of the base technology because the surrounding portion 112 blocks the sealing resin 23 when the optical element 20 is flip-chip mounted on the substrate 10. The sealing resin 23 is suppressed from flowing into the through hole 11.

  Therefore, according to the first embodiment, the optical path between the optical element 20 and the optical waveguide member 30 is prevented from being blocked by the sealing resin 23, and the highly reliable optical communication device 100 can be provided. .

  The lens 110 may be formed integrally with the substrate 10. When the lens 110 and the substrate 10 are formed integrally, the lens 110 and the substrate 10 may be formed of a transparent resin such as polyimide, for example. When the lens 110 and the substrate 10 are integrally molded as described above, steps such as alignment of the lens 110 or application of an adhesive, curing treatment, and separation of the separator accompanying the attachment of the lens 110 may be deleted. it can.

<Embodiment 2>
FIG. 3 is a diagram illustrating the optical communication device 200 according to the second embodiment. In the following, the same components as those of the optical communication apparatus 100 of the first embodiment are denoted by the same reference numerals, and the description thereof is omitted.

  As shown in FIG. 3A, the optical communication apparatus 200 according to the second embodiment includes a substrate 10, an optical element 20, an optical waveguide member 30, and a lens 210. The optical communication device 200 according to the second embodiment is obtained by replacing the lens 110 of the optical communication device 100 according to the first embodiment with a lens 210.

  As shown in FIGS. 3B, 3 </ b> C, and 3 </ b> D, the lens 210 includes a lens portion 211, an enclosure portion 212, a guide portion 213, and a lens portion 214. The lens unit 211 and the surrounding unit 212 are the same as the lens unit 111 and the surrounding unit 112 of the lens 110 of the first embodiment.

  The guide part 213 has a lens part 214 formed at the lower end. The guide part 213 is formed by forming a lens part 214 similar to the lens part 111 at the lower end of the guide part 113 of the first embodiment. The lens portion 113 may be flush with the lower surface of the substrate 10 or may be offset inward from the lower surface of the substrate 10 as shown in FIGS.

  In such an optical communication device 200 according to the second embodiment, an optical path including the lens 210 having the lens portion 214 is formed between the optical element 20 and the optical waveguide member 30.

  In such an optical communication device 200 according to the second embodiment, when the optical element 20 is flip-chip mounted on the substrate 10, the surrounding portion 212 blocks the sealing resin 23, so that the optical communication device 50 of the base technology is used. The sealing resin 23 is suppressed from flowing into the through hole 11.

  Therefore, according to the second embodiment, the optical path between the optical element 20 and the optical waveguide member 30 is prevented from being blocked by the sealing resin 23, and the optical communication device 200 with high reliability can be provided. .

<Embodiment 3>
FIG. 4 is a diagram illustrating the optical communication device 300 according to the third embodiment. In the following, the same components as those of the optical communication apparatus 100 of the first embodiment are denoted by the same reference numerals, and the description thereof is omitted.

  As shown in FIG. 4A, the optical communication apparatus 300 according to the third embodiment includes a substrate 10, an optical element 20, an optical waveguide member 30, and a lens 310. The optical communication device 300 according to the third embodiment is obtained by replacing the lens 110 of the optical communication device 100 according to the first embodiment with a lens 310.

  As shown in FIGS. 4B and 4C, the lens 310 includes a lens portion 311, a surrounding portion 312, and a guide portion 313. The lens unit 311 is the same as the lens unit 111 of the lens 110 of the first embodiment.

  The surrounding portion 312 of the lens 310 of Embodiment 3 has the same size as the guide portion 313 in plan view. The surrounding portion 312 has a shape such that the outer peripheral portion of the cylindrical guide portion 313 extends around the lens portion 311. That is, the surrounding portion 312 has a cylindrical wall portion surrounding the periphery of the lens portion 311. The height of the surrounding portion 312 is the same as the height of the surrounding portion 112 of the first embodiment.

  In such an optical communication device 300 according to Embodiment 3, an optical path including the lens 310 is formed between the optical element 20 and the optical waveguide member 30.

  In such an optical communication device 300 according to the third embodiment, when the optical element 20 is flip-chip mounted on the substrate 10, the surrounding portion 312 blocks the sealing resin 23. The sealing resin 23 is suppressed from flowing into the through hole 11.

  Therefore, according to the third embodiment, the optical path between the optical element 20 and the optical waveguide member 30 is prevented from being blocked by the sealing resin 23, and the highly reliable optical communication device 300 can be provided. .

<Embodiment 4>
FIG. 5 shows an optical communication apparatus 400 according to the fourth embodiment. In the following, the same components as those of the optical communication apparatus 300 according to the third embodiment are denoted by the same reference numerals, and the description thereof is omitted.

  As shown in FIG. 5A, the optical communication device 400 of the fourth embodiment includes a substrate 10, an optical element 20, an optical waveguide member 30, and a lens 410. The optical communication apparatus 400 according to the fourth embodiment is obtained by replacing the lens 310 of the optical communication apparatus 300 according to the third embodiment with a lens 410.

  As shown in FIGS. 5B, 5 </ b> C, and 5 </ b> D, the lens 410 includes a lens portion 411, an enclosure portion 412, a guide portion 413, a lens portion 414, and an enclosure portion 415. The lens unit 411, the surrounding unit 412, and the guide unit 413 are the same as the lens unit 311, the surrounding unit 312, and the guide unit 313 of the lens 310 of the third embodiment.

  In the lens 410 according to the fourth embodiment, a lens portion 414 similar to the lens portion 311 is formed at the lower end of the guide portion 313 of the lens 310 according to the third embodiment, and an surrounding portion 415 is formed around the lens portion 414. Is.

  In such a lens 410, the lens portion 411 and the surrounding portion 412 on the upper end side, and the lens portion 414 and the surrounding portion 415 on the lower end side have the same shape. That is, the lens 410 has a shape in which one end side (upper end side) and the other end side (lower end side) of the cylindrical central axis are symmetrical.

  Therefore, the lens 410 can be mounted in the through hole 11 of the substrate 10 without distinguishing between the upper end side and the lower end side.

  In such an optical communication device 400 of the fourth embodiment, an optical path including the lens 410 is formed between the optical element 20 and the optical waveguide member 30.

  In such an optical communication device 400 of the fourth embodiment, when the optical element 20 is flip-chip mounted on the substrate 10, the surrounding portion 412 blocks the sealing resin 23, so that the optical communication device 50 of the base technology is used. The sealing resin 23 is suppressed from flowing into the through hole 11.

  Further, even when the lens 410 is mounted upside down on the through hole 11 of the substrate 10, the surrounding portion 415 blocks the sealing resin 23, so that the sealing resin 23 is prevented from flowing into the through hole 11. The

  Therefore, according to the fourth embodiment, the optical path between the optical element 20 and the optical waveguide member 30 is suppressed from being blocked by the sealing resin 23, and the highly reliable optical communication device 400 can be provided. .

  Further, since the lens 410 has a symmetrical shape in the top-and-bottom direction, handling when mounted in the through hole 11 of the substrate 10 is very easy.

<Embodiment 5>
FIG. 6 is a diagram illustrating an optical communication apparatus 500 according to the fifth embodiment. In the following, the same components as those of the optical communication apparatus 400 of the fourth embodiment are denoted by the same reference numerals, and the description thereof is omitted.

  As shown in FIG. 6A, the optical communication device 500 of the fifth embodiment includes a substrate 10, an optical element 20, an optical waveguide member 30, a lens 410, and a plate 550. The optical communication device 500 according to the fifth embodiment is obtained by adding a plate 550 between the substrate 10 and the optical waveguide member 30 of the optical communication device 400 according to the fourth embodiment.

  The plate 550 is a plate member made of resin or metal and has a through hole 551. The opening diameter of the through hole 551 is equal to the opening diameter of the through hole 11 of the substrate 10.

  The plate 550 is provided between the substrate 10 and the optical waveguide member 30 and bonded to the substrate 10 and the optical waveguide member 30.

  In the fifth embodiment, the lens 410 is extended in the central axis direction by adding the plate 550. In Embodiment 5, the surrounding portion 415 on the lower end side of the lens 410 is fitted into the through hole 551 of the plate 550.

  For this reason, the optical communication apparatus 500 of Embodiment 5 can hold | maintain the board | substrate 10, the optical waveguide member 30, and the lens 410 in a more stable state.

  When assembling such an optical communication device 500 of the fifth embodiment, for example, as shown in FIG. 6C, the lens 410 may be fitted in the through hole 551 of the plate 550 in advance. This facilitates assembly.

  In the optical communication device 500 according to the fifth embodiment, as in the optical communication device 400 according to the fourth embodiment, when the optical element 20 is flip-chip mounted on the substrate 10, the surrounding portion 412 blocks the sealing resin 23. Therefore, the sealing resin 23 is suppressed from flowing into the through hole 11.

  Therefore, according to the fifth embodiment, the optical path between the optical element 20 and the optical waveguide member 30 is suppressed from being blocked by the sealing resin 23, and a highly reliable optical communication device 500 can be provided. .

  In addition, it is possible to realize a configuration that can hold the substrate 10, the optical waveguide member 30, and the lens 410 in a more stable state, and it is possible to easily assemble.

<Embodiment 6>
FIG. 7 is a diagram showing an optical communication apparatus 600 according to the sixth embodiment. In the following, the same components as those of the optical communication apparatus 600 according to the sixth embodiment are denoted by the same reference numerals, and the description thereof is omitted.

  As shown in FIG. 7A, the optical communication device 600 of the sixth embodiment includes a substrate 10, an optical element 20, an optical waveguide member 30, and a lens 610. The optical communication apparatus 600 according to the sixth embodiment is obtained by replacing the lens 410 of the optical communication apparatus 500 according to the fifth embodiment with a lens 610.

  The lens 610 includes a lens portion 611, a surrounding portion 612, a guide portion 613, a lens portion 614, and a pedestal portion 615.

  The lens unit 611, the surrounding unit 612, the guide unit 613, and the lens unit 614 correspond to the lens unit 511, the surrounding unit 512, the guide unit 513, and the lens unit 514 of the fifth embodiment, but in the sixth embodiment, the surrounding unit 612 and the guide part 613 are rectangular.

  The pedestal portion 615 is obtained by integrating the plate 550 and the surrounding portion 415 of Embodiment 5 as a pedestal for the lens 610.

  In addition, the shape of the through-hole 11 of the board | substrate 10 is also changed into the square column shape by making the guide part 613 into the square column shape.

  As described above, by including the pedestal portion 615, a stable structure can be formed between the substrate 10 and the optical waveguide member 30 as in the case where the plate 550 of the fifth embodiment is used.

  Moreover, the lens 610 can be installed in a more stable state with respect to the substrate 10 by forming the guide portion 613 and the through hole 11 of the substrate 10 into a quadrangular prism shape.

  Since the sealing resin 23 is blocked by the surrounding portion 612 of the lens 610, it is the same as in the other embodiments that the sealing resin 23 is prevented from flowing into the through hole 11.

  Here, the case where the guide part 513 and the through hole 11 of the substrate 10 have a quadrangular prism shape has been described. However, the guide part 513 and the through hole 11 of the substrate 10 have a triangular shape, a pentagonal shape, or a hexagonal shape in plan view. It may be a polygon such as.

<Embodiment 7>
FIG. 8 shows an optical communication apparatus 700 according to the seventh embodiment. In the following, the same components as those of the optical communication apparatus 100 of the first embodiment are denoted by the same reference numerals, and the description thereof is omitted.

  As shown in FIG. 8A, the optical communication device 700 according to the seventh embodiment includes a substrate 10, an optical element 20, an optical waveguide member 30, and a lens 710. The optical communication device 700 according to the seventh embodiment is obtained by replacing the lens 110 of the optical communication device 100 according to the first embodiment with a lens 710.

  As shown in FIGS. 8B and 8C, the lens 710 includes a lens portion 711, a surrounding portion 712, and a guide portion 713.

  The lens 710 is offset so that the lens portion 111 of the lens 110 according to the first embodiment fits inside the through hole 11 of the substrate 10.

  In such an optical communication device 700 according to the seventh embodiment, an optical path including the lens 710 is formed between the optical element 20 and the optical waveguide member 30.

  In such an optical communication device 700 according to the seventh embodiment, when the optical element 20 is flip-chip mounted on the substrate 10, the surrounding portion 712 blocks the sealing resin 23. The sealing resin 23 is suppressed from flowing into the through hole 11.

  Therefore, according to the seventh embodiment, the optical path between the optical element 20 and the optical waveguide member 30 is suppressed from being blocked by the sealing resin 23, and a highly reliable optical communication device 700 can be provided. .

  The optical communication device according to the exemplary embodiment of the present invention has been described above. However, the present invention is not limited to the specifically disclosed embodiment, and does not depart from the scope of the claims. Various modifications and changes are possible.

100, 200, 300, 400, 500, 600, 700 Optical communication device 10 Substrate 11 Through hole 20 Optical element 30 Optical waveguide member 110, 210, 310, 410, 610, 710 Lens

Claims (6)

A substrate having a through hole;
An optical element that receives or emits light, and is mounted on one surface of the substrate so that the optical terminal faces one end of the through hole;
A first lens integrally molded with resin and facing the optical terminal; a surrounding portion projecting from the one surface side of the substrate toward the optical element; and surrounding the periphery of the first lens; and the through hole A light guide member having a guide portion for guiding light between the one end side and the other end side where the first lens and the surrounding portion are disposed;
An optical communication device comprising: an optical waveguide member having an optical waveguide disposed on the other surface side of the substrate and optically connected to the other end side of the light guide member.   The optical communication device according to claim 1, wherein the surrounding portion has a height at which a gap is formed between the surrounding portion and the optical element.   The optical communication device according to claim 1, wherein the surrounding portion extends outward from the through hole in a plan view and contacts one surface of the substrate.   The optical communication device according to claim 1, wherein the surrounding portion has a size equal to that of the guide portion in plan view.   5. The optical communication device according to claim 1, wherein the light guide member further includes a second lens disposed on the other end side and optically connected to the optical waveguide member. 6.   The optical communication device according to claim 1, wherein the optical guide member and the substrate are integrally molded.

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