JP2014006313A - Optical communication module - Google Patents

Optical communication module Download PDF

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JP2014006313A
JP2014006313A JP2012140393A JP2012140393A JP2014006313A JP 2014006313 A JP2014006313 A JP 2014006313A JP 2012140393 A JP2012140393 A JP 2012140393A JP 2012140393 A JP2012140393 A JP 2012140393A JP 2014006313 A JP2014006313 A JP 2014006313A
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communication module
light
optical coupling
optical
emitting element
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JP5999417B2 (en
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Hiroteru Kawai
裕輝 川合
Takuro Urushibata
卓朗 漆畑
Akimitsu Nakazono
晃充 中園
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Yazaki Corp
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Yazaki Corp
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Abstract

PROBLEM TO BE SOLVED: To provide an optical communication module that can be easily assembled.SOLUTION: An optical communication module 1 comprises: a light-emitting element 10 or a light-receiving element 11; an element mounting part 20 where the light-emitting element 10 or the light-receiving element 11 is mounted; and an optical coupling part 60 including optical coupling members 70, 70 for optically coupling the light-emitting element 10 or the light-receiving element 11 to optical fiber connectors 100, 100. The element mounting part 20 comprises: abutting faces 21, 21 where element-side end faces 70a, 70a of the optical coupling members 70, 70, which are end faces opposing to the light-emitting element 10 or the light-receiving element 11, are made to abut against; and element disposition recesses 30, 30 formed into recesses with respect to the abutting faces 21, 21, in which the light-emitting element 10 or the light-receiving element 11 is disposed on a bottom face 30a of the recess so as to oppose to the element-side end faces 70a, 70a leaving a predetermined gap for optical coupling.

Description

本発明は、発光素子、あるいは受光素子を有してなる光通信モジュールに関する。   The present invention relates to an optical communication module having a light emitting element or a light receiving element.

従来、発光素子、あるいは受光素子を有してなる光通信モジュールは、半導体レーザ等の発光素子、あるいはフォトダイオード等の受光素子と、発光素子あるいは受光素子が設けられる素子設置部と、発光素子あるいは受光素子を光ファイバコネクタに光学的に結合させる光結合部材を含む光結合部と、を有してなる。
このような光通信モジュールは、発光素子から出射された光信号が光結合部材を介して光ファイバコネクタに伝送され、あるいは光ファイバコネクタから出射された光信号が、光結合部材を介して受光素子に伝送されるようになっている。(例えば、特許文献1、特許文献2参照)。
Conventionally, an optical communication module having a light emitting element or a light receiving element includes a light emitting element such as a semiconductor laser, or a light receiving element such as a photodiode, an element installation portion provided with the light emitting element or the light receiving element, and a light emitting element or And an optical coupling part including an optical coupling member for optically coupling the light receiving element to the optical fiber connector.
In such an optical communication module, an optical signal emitted from the light emitting element is transmitted to the optical fiber connector via the optical coupling member, or an optical signal emitted from the optical fiber connector is received via the optical coupling member. To be transmitted. (For example, refer to Patent Document 1 and Patent Document 2).

平2−33115号公報Hei 2-333115 特開2009−192566号公報JP 2009-192666 A

しかしながら、特許文献1および2に記載の光通信モジュールは、発光素子、あるいは受光素子が実装されて保持される保持部品と、光結合部材が保持される保持部品とが別部品であり、発光素子あるいは受光素子と、光結合部材とを光結合効率の良い間隔に調整する場合、保持部品同士の位置を調整する必要があるため、組み付け作業が煩雑になってしまうという問題があった。   However, in the optical communication modules described in Patent Documents 1 and 2, the holding component on which the light emitting element or the light receiving element is mounted and held is different from the holding component on which the optical coupling member is held, and the light emitting element Or when adjusting a light receiving element and an optical coupling member to the space | interval with good optical coupling efficiency, since it was necessary to adjust the position of holding parts, there existed a problem that an assembly | attachment operation | work will become complicated.

本発明は、上記に鑑みてなされたものであって、容易に組み付けることができる光通信モジュールを提供することを目的とする。   The present invention has been made in view of the above, and an object thereof is to provide an optical communication module that can be easily assembled.

上述した課題を解決し、目的を達成するために、本発明の請求項1に係る光通信モジュールは、発光素子、あるいは受光素子と、前記発光素子、あるいは前記受光素子が実装される素子実装部と、前記発光素子、あるいは前記受光素子を光ファイバコネクタに光学的に結合させる光結合部材を含む光結合部と、を有してなる光通信モジュールにおいて、前記素子実装部は、前記光結合部材の前記発光素子あるいは前記受光素子と向かい合う側の端面である素子側端面が突き当てられる突き当て面と、前記突き当て面に対して凹み形状をなし、かつ底面に前記発光素子、あるいは前記受光素子が光結合のために定められた間隔をあけて前記素子側端面に向かい合うように配置される素子配置用凹部と、を有してなることを特徴とする。   In order to solve the above-described problems and achieve the object, an optical communication module according to claim 1 of the present invention includes a light emitting element or a light receiving element and an element mounting portion on which the light emitting element or the light receiving element is mounted. And an optical coupling module including an optical coupling member that optically couples the light emitting element or the light receiving element to an optical fiber connector, wherein the element mounting section includes the optical coupling member. A light-emitting element or a light-receiving element that faces the element-side end surface facing the light-emitting element or the light-receiving element, a concave shape with respect to the abutting surface, and the light-emitting element or the light-receiving element on the bottom surface And an element disposition recess disposed to face the element side end face with a predetermined interval for optical coupling.

また、本発明の請求項2に係る光通信モジュールは、上記の発明において、前記素子実装部は、前記突き当て面に対して突出され、かつ前記突き当て面に突き当てられた前記光結合部材の外周面に沿って設けられてなり、前記光結合部材の位置決め機能をなす位置決めガイド壁部を有してなることを特徴とする。   The optical communication module according to claim 2 of the present invention is the optical coupling member according to the above invention, wherein the element mounting portion protrudes from the abutting surface and abuts against the abutting surface. It is provided along the outer peripheral surface, and has a positioning guide wall part which performs the positioning function of the optical coupling member.

また、本発明の請求項3に係る光通信モジュールは、上記の発明において、前記素子実装部は、前記素子配置用凹部が前記発光素子および前記受光素子のそれぞれが配置されるように二箇所に設けられ、前記発光素子および前記受光素子のそれぞれに対応した前記光結合部材の前記位置決めガイド壁部が、各光結合部材が互いに向かい合う側の各光結合部材の外周面を囲うように設けられてなることを特徴とする。   The optical communication module according to claim 3 of the present invention is the optical communication module according to the invention, wherein the element mounting portion is provided at two locations so that the element placement recesses are arranged with the light emitting element and the light receiving element, respectively. The positioning guide wall portion of the optical coupling member corresponding to each of the light emitting element and the light receiving element is provided so as to surround the outer peripheral surface of each optical coupling member on the side where each optical coupling member faces each other. It is characterized by becoming.

また、本発明の請求項4に係る光通信モジュールは、上記の発明において、前記素子実装部は、回路基板であり、前記素子配置用凹部は、前記発光素子、あるいは前記受光素子以外に前記素子実装部に実装される電子部品が配置されることを特徴とする。   The optical communication module according to claim 4 of the present invention is the optical communication module according to the above invention, wherein the element mounting portion is a circuit board, and the element placement recess is the element other than the light emitting element or the light receiving element. Electronic components to be mounted on the mounting portion are arranged.

本発明の請求項1に係る光通信モジュールは、前記光結合部材を前記突き当て面に突き当てるだけで、前記発光素子あるいは前記受光素子と、前記光結合部材とを光結合効率の良い間隔に設定することができるので、容易に組み付けることができる。   In the optical communication module according to claim 1 of the present invention, the light-emitting element or the light-receiving element and the optical coupling member are spaced at a good optical coupling efficiency by simply abutting the optical coupling member against the abutting surface. Since it can be set, it can be assembled easily.

本発明の請求項2に係る光通信モジュールは、前記位置決めガイド壁部によって前記発光素子あるいは前記受光素子と、前記光結合部材との位置決めを容易に行うことができる。   The optical communication module according to claim 2 of the present invention can easily position the light emitting element or the light receiving element and the optical coupling member by the positioning guide wall portion.

本発明の請求項3に係る光通信モジュールは、前記発光素子、および前記受光素子のそれぞれの実装領域を前記光結合部材および前記位置決めガイド壁部によって囲い込むことによって、前記発光素子、および前記受光素子の実装領域のそれぞれにおける光漏れを抑制し、結果的に前記発光素子と前記受光素子との間の光のクロストークが抑制さる。しかも、前記発光素子と前記受光素子との間の光のクロストークが抑制できるので、前記発光素子と前記受光素子とを互いに近づけて配置することができ、結果的に当該光通信モジュールをコンパクト化することができる。   According to a third aspect of the present invention, there is provided the optical communication module, wherein the light emitting element and the light receiving element are surrounded by the optical coupling member and the positioning guide wall portion so as to surround the light emitting element and the light receiving element. Light leakage in each of the element mounting regions is suppressed, and as a result, light crosstalk between the light emitting element and the light receiving element is suppressed. In addition, since light crosstalk between the light emitting element and the light receiving element can be suppressed, the light emitting element and the light receiving element can be arranged close to each other, resulting in a compact optical communication module. can do.

本発明の請求項4に係る光通信モジュールは、前記発光素子、あるいは前記受光素子と、前記電子部品とがボンディングワイヤによって接続される場合、ボンディングワイヤを短尺化させることが可能となり、結果的に高周波特性を向上させることができる。   In the optical communication module according to claim 4 of the present invention, when the light emitting element or the light receiving element and the electronic component are connected by a bonding wire, the bonding wire can be shortened. High frequency characteristics can be improved.

図1は、本発明の実施例に係る光通信モジュールの分解斜視図である。FIG. 1 is an exploded perspective view of an optical communication module according to an embodiment of the present invention. 図2は、図1に示した光通信モジュールの斜視図である。2 is a perspective view of the optical communication module shown in FIG. 図3は、図1に示した素子実装部の拡大斜視図である。3 is an enlarged perspective view of the element mounting portion shown in FIG. 図4は、図1に示した素子実装部の突き当て面周辺を拡大した一部断面図である。FIG. 4 is a partial cross-sectional view in which the periphery of the abutting surface of the element mounting portion shown in FIG. 1 is enlarged. 図5は、図3に示した素子実装部のA−A線断面図である。5 is a cross-sectional view taken along line AA of the element mounting portion shown in FIG. 図6は、図1に示した素子実装部の各突き当て面に各光結合部材が突き当てられている状態を示した図である。FIG. 6 is a diagram illustrating a state in which each optical coupling member is abutted against each abutment surface of the element mounting portion illustrated in FIG. 1. 図7は、図6に示した一の光結合部材と、突き当て面周辺を断面で示した図である。FIG. 7 is a cross-sectional view of the one optical coupling member shown in FIG. 6 and the periphery of the abutting surface. 図8は、図1に示した光通信モジュールが相手接続基板に位置決めされながら取り付けされることを説明するための図である。FIG. 8 is a view for explaining that the optical communication module shown in FIG. 1 is attached to the counterpart connection board while being positioned. 図9は、光通信モジュールの組み付け手順を示した図である。FIG. 9 is a diagram showing an assembly procedure of the optical communication module. 図10は、本発明の実施例の変形例1の光通信モジュールの分解斜視図である。FIG. 10 is an exploded perspective view of the optical communication module according to Modification 1 of the embodiment of the present invention. 図11は、本発明の実施例の変形例2の光通信モジュールの分解斜視図である。FIG. 11 is an exploded perspective view of the optical communication module according to the second modification of the embodiment of the present invention. 図12は、本発明の実施例の変形例3の光通信モジュールの分解斜視図である。FIG. 12 is an exploded perspective view of an optical communication module according to Modification 3 of the embodiment of the present invention.

以下、図面を参照して、本発明に係る光通信モジュールの好適な実施例を詳細に説明する。   DESCRIPTION OF EMBODIMENTS Hereinafter, preferred embodiments of an optical communication module according to the present invention will be described in detail with reference to the drawings.

図1は、本発明の実施例に係る光通信モジュール1の分解斜視図である。
なお、図1には、光通信モジュールに接続される二つの光ファイバコネクタを追加して示している。
図2は、図1に示した光通信モジュール1の斜視図である。図3は、図1に示した素子実装部20の拡大斜視図である。図4は、図1に示した素子実装部20の突き当て面21周辺を拡大した一部断面図である。図5は、図3に示した素子実装部20のA−A線断面図である。図6は、図1に示した素子実装部20の各突き当て面21に各光結合部材70が突き当てられている状態を示した図である。図7は、図6に示した一の光結合部材70と、突き当て面21周辺を断面で示した図である。図8は、図1に示した光通信モジュール1が相手接続基板200に位置決めされながら取り付けされることを説明するための図である。
本発明の実施例に係る光通信モジュール1は、二つの光ファイバコネクタ100,100ぞれぞれと、発光素子10、あるいは受光素子11との間で光信号を光学的に接続するものである。
この光通信モジュール1は、発光素子10および受光素子11、発光素子10および受光素子11が実装される素子実装部20、発光素子10、および受光素子11のそれぞれを各光ファイバコネクタ100,100に光学的に結合させる二つの光結合部材70,70を含む光結合部60と、を有してなる。
FIG. 1 is an exploded perspective view of an optical communication module 1 according to an embodiment of the present invention.
In FIG. 1, two optical fiber connectors connected to the optical communication module are additionally shown.
FIG. 2 is a perspective view of the optical communication module 1 shown in FIG. FIG. 3 is an enlarged perspective view of the element mounting portion 20 shown in FIG. FIG. 4 is an enlarged partial cross-sectional view of the vicinity of the abutting surface 21 of the element mounting portion 20 shown in FIG. FIG. 5 is a cross-sectional view taken along line AA of the element mounting portion 20 shown in FIG. 6 is a view showing a state in which each optical coupling member 70 is abutted against each abutment surface 21 of the element mounting portion 20 shown in FIG. FIG. 7 is a cross-sectional view of the optical coupling member 70 shown in FIG. 6 and the periphery of the abutting surface 21. FIG. 8 is a view for explaining that the optical communication module 1 shown in FIG. 1 is attached to the counterpart connection board 200 while being positioned.
An optical communication module 1 according to an embodiment of the present invention optically connects an optical signal between two optical fiber connectors 100 and 100 and a light emitting element 10 or a light receiving element 11. .
The optical communication module 1 includes a light emitting element 10 and a light receiving element 11, an element mounting portion 20 on which the light emitting element 10 and the light receiving element 11 are mounted, the light emitting element 10, and the light receiving element 11. And an optical coupling portion 60 including two optical coupling members 70 and 70 to be optically coupled.

まず、発光素子10および受光素子11について説明する。
発光素子10は、レーザーダイオード等によって実現され、素子実装部20に実装される。この発光素子10は、素子実装部20を介して伝達された電気信号を光信号に変換し、変換された光信号として光を出射するものである。
受光素子11は、フォトダイオード等によって実現され、素子実装部20に実装される。この受光素子11は、一の光ファイバコネクタ100から光信号として一の光結合部材70に入射され、光結合部材70から出射された光を電気信号に変換するものである。
First, the light emitting element 10 and the light receiving element 11 will be described.
The light emitting element 10 is realized by a laser diode or the like and mounted on the element mounting unit 20. The light emitting element 10 converts an electrical signal transmitted via the element mounting unit 20 into an optical signal, and emits light as the converted optical signal.
The light receiving element 11 is realized by a photodiode or the like and mounted on the element mounting unit 20. The light receiving element 11 is incident on one optical coupling member 70 as an optical signal from one optical fiber connector 100, and converts the light emitted from the optical coupling member 70 into an electrical signal.

次に、素子実装部20について説明する。
素子実装部20は、プリント配線板等の回路基板によって実現され、発光素子10、および受光素子11、さらには光通信モジュール1の構成上必要な、集積回路(IC)、抵抗、コンデンサ等の電子部品12,12が実装されている。
この素子実装部20は、発光素子10、受光素子11のそれぞれに対応した各光結合部材70,70が突き当てされる突き当て面21,21と、発光素子10、および受光素子11のそれぞれが配置される素子配置用凹部30,30と、各光結合部材70,70の位置決め機能をなす位置決めガイド壁部40,40と、素子実装部20が相手接続基板200(図8参照)に対して面実装可能に形成されてなる相手基板接続用実装面50と、を有してなる。
Next, the element mounting unit 20 will be described.
The element mounting unit 20 is realized by a circuit board such as a printed wiring board, and is an electronic circuit such as an integrated circuit (IC), a resistor, or a capacitor necessary for the configuration of the light emitting element 10, the light receiving element 11, and the optical communication module 1. Components 12 and 12 are mounted.
The element mounting portion 20 includes abutting surfaces 21 and 21 on which the respective optical coupling members 70 and 70 corresponding to the light emitting element 10 and the light receiving element 11 are abutted, and the light emitting element 10 and the light receiving element 11 respectively. The element placement recesses 30, 30, the positioning guide wall portions 40, 40 that form the positioning function of the optical coupling members 70, and the element mounting portion 20 with respect to the mating connection substrate 200 (see FIG. 8). And a mating substrate connecting mounting surface 50 formed so as to be surface mountable.

各突き当て面21,21は、各光結合部材70,70の発光素子10、あるいは受光素子11と向かい合う側の端面である各素子側端面70a,70aが付き当てられる面である。   Each abutting surface 21, 21 is a surface to which each element-side end surface 70 a, 70 a, which is an end surface of each optical coupling member 70, 70 facing the light emitting element 10 or the light receiving element 11, is abutted.

素子配置用凹部30,30は、発光素子10および受光素子11のそれぞれが配置されるように二箇所に並んで設けられ、各突き当て面21,21に対して凹み形状をなし、かつ各底面30a,30aに発光素子10、および受光素子11のそれぞれが光結合のために定められた間隔をあけて各素子側端面70a,70aに向かい合うように配置される部分である。
より具体的には、各素子配置用凹部30,30は、発光素子10、あるいは受光素子11の周辺の上縁面が突き当て面21,21となり、その凹み深さが、発光素子10、あるいは受光素子11と、各光結合部材70,70との光結合効率を良くするために定められた間隔に等しくなるように設定されている。
The element placement recesses 30, 30 are provided side by side so that each of the light emitting element 10 and the light receiving element 11 is arranged, has a recessed shape with respect to each abutment surface 21, 21, and each bottom surface The light-emitting element 10 and the light-receiving element 11 are arranged at 30a and 30a so as to face the element-side end faces 70a and 70a with a predetermined interval for optical coupling.
More specifically, in each of the element placement recesses 30 and 30, the upper edge surface around the light emitting element 10 or the light receiving element 11 becomes the abutting surfaces 21 and 21, and the depth of the recess is the light emitting element 10 or It is set to be equal to a predetermined interval in order to improve the optical coupling efficiency between the light receiving element 11 and each of the optical coupling members 70 and 70.

また、各素子配置用凹部30,30には、ジャンクションコーティングレジン(JCR)等の光透過性樹脂31が充填されている。このように光透過性樹脂31が充填されることによって、光透過性樹脂31が発光素子10と、受光素子11と、電子部品12とを外気から保護するようになっている。このような光透過性樹脂31は、凹部に充填されることによって、充填必要箇所以外に流れ出ることなく各素子配置用凹部30,30に封入される。   In addition, each of the element placement recesses 30 is filled with a light transmissive resin 31 such as a junction coating resin (JCR). By filling the light transmissive resin 31 in this way, the light transmissive resin 31 protects the light emitting element 10, the light receiving element 11, and the electronic component 12 from the outside air. Such a light-transmitting resin 31 is filled in the recesses 30 and 30 for element arrangement without filling the recesses and without flowing out to places other than the place where filling is necessary.

なお、光透過性樹脂31は、各突き当て面21,21に面一になるように、あるいは各突き当て面21,21に対して突出されないように各素子配置用凹部30,30に充填されることによって、各突き当て面21,21の機能を妨げないようになっている。   The light-transmitting resin 31 is filled in each of the element placement recesses 30 and 30 so as to be flush with the abutting surfaces 21 and 21 or so as not to protrude from the abutting surfaces 21 and 21. Thus, the functions of the abutting surfaces 21 and 21 are not disturbed.

各位置決めガイド壁部40,40は、各突き当て面21,21に対して突出され、かつ各突き当て面21,21に突き当てられた各光結合部材70,70の外周面70b,70bに沿って設けられてなり、素子実装部20に対する各光結合部材70,70の位置決め機能をなすものである。
より具体的には、各位置決めガイド壁部40,40は、各光結合部材70,70の外周面70b,70bに対応した円周状に立設された壁であり、各光結合部材70,70が上端部40a,40aから各突き当て面21,21に向けて調芯されながら差しこまれるようになっている。
The positioning guide walls 40 and 40 protrude from the abutting surfaces 21 and 21 and are arranged on the outer peripheral surfaces 70b and 70b of the optical coupling members 70 and 70 abutted against the abutting surfaces 21 and 21. The optical coupling members 70 and 70 are positioned with respect to the element mounting portion 20.
More specifically, each positioning guide wall portion 40, 40 is a wall erected in a circumferential shape corresponding to the outer peripheral surface 70b, 70b of each optical coupling member 70, 70, and each optical coupling member 70, 70 is inserted while being aligned from the upper end portions 40a, 40a toward the abutting surfaces 21, 21.

また、各光結合部材70,70に対応した位置決めガイド壁部40,40は、各光結合部材70,70が互いに向かい合う側の各光結合部材70,70の各外周面70b,70bを囲うように設けられてなる。このように発光素子10、および受光素子11の実装領域を光結合部材70,70および位置決めガイド壁部40,40によって囲い込むことによって、発光素子10、および受光素子11の実装領域における光漏れを抑制し、結果的に発光素子10と受光素子11との間の光のクロストークが抑制されるようになっている。   Further, the positioning guide walls 40 and 40 corresponding to the respective optical coupling members 70 and 70 surround the outer peripheral surfaces 70b and 70b of the respective optical coupling members 70 and 70 on the side where the respective optical coupling members 70 and 70 face each other. It is provided. As described above, the light emitting element 10 and the light receiving element 11 are enclosed by the optical coupling members 70 and 70 and the positioning guide wall portions 40 and 40 so that light leakage in the light emitting element 10 and the light receiving element 11 is prevented from leaking. As a result, crosstalk of light between the light emitting element 10 and the light receiving element 11 is suppressed.

相手基板接続用実装面50は、図3に示すように、相手接続基板200との電気的接続がなされる電気接続パッド51と、相手接続基板200に形成された3つの位置決め穴201に嵌入されるように突出されてなる3つの位置決め突部52とを含み、かつ相手接続基板200に対して面実装可能に形成されてなる。
この相手基板接続用実装面50は、素子実装部20の基板端20aが直角に屈曲されることによって形成された端縁面である。すなわち、素子実装部20は、図8に示すように、発光素子10および受光素子11が実装される実装面が相手接続基板200の接続面200aに対して直交するようにして相手接続基板200に接続される。
As shown in FIG. 3, the mating substrate connection mounting surface 50 is fitted into an electrical connection pad 51 that is electrically connected to the mating connection substrate 200 and three positioning holes 201 formed in the mating connection substrate 200. And the three positioning protrusions 52 that are projected so as to be surface-mountable with respect to the mating connection board 200.
The mating substrate connecting mounting surface 50 is an edge surface formed by bending the substrate end 20a of the element mounting portion 20 at a right angle. That is, as shown in FIG. 8, the element mounting unit 20 is mounted on the mating connection substrate 200 such that the mounting surface on which the light emitting element 10 and the light receiving element 11 are mounted is orthogonal to the connection surface 200 a of the mating connection substrate 200. Connected.

なお、この実施例では、相手接続基板200に3つの位置決め穴201が形成され、素子実装部20が3つの位置決め穴201に対応して設けられた3つの位置決め突部52を含むものを例示したが、これに限らず、相手接続基板200に1以上の位置決め穴201が形成され、素子実装部20が位置決め穴201に対応して数だけ設けられた位置決め突部52を含むようになっていればよい。   In this embodiment, three positioning holes 201 are formed in the mating connection board 200 and the element mounting portion 20 includes three positioning protrusions 52 provided corresponding to the three positioning holes 201. However, the present invention is not limited thereto, and one or more positioning holes 201 are formed in the mating connection substrate 200, and the element mounting portion 20 includes positioning protrusions 52 provided in a number corresponding to the positioning holes 201. That's fine.

次に、光結合部60について説明する。
光結合部60は、発光素子10および受光素子11のそれぞれに対応した二つの光結合部材70,70と、各光結合部材70,70が割スリーブ80に取り付けされた状態で収容される結合部材収容部90と、を有してなる。
Next, the optical coupling unit 60 will be described.
The optical coupling unit 60 includes two optical coupling members 70 and 70 corresponding to the light emitting element 10 and the light receiving element 11, and a coupling member that is accommodated in a state where the optical coupling members 70 and 70 are attached to the split sleeve 80. And an accommodating portion 90.

各光結合部材70,70は、いわゆる光ファイバスタブによって実現される。より具体的には、各光結合部材70,70は、セラミック材等からなる円柱状の光ファイバ保持部61の軸心に貫通孔61aが形成され、この貫通孔61a内に光ファイバ62が挿通され、かつ固定されてなる。   Each optical coupling member 70 is realized by a so-called optical fiber stub. More specifically, each of the optical coupling members 70, 70 has a through hole 61a formed in the axial center of a cylindrical optical fiber holding portion 61 made of a ceramic material or the like, and the optical fiber 62 is inserted into the through hole 61a. And fixed.

各割スリーブ80,80は、各光結合部60,60を結合部材収容部90の後述する各筒状部92,92内の所定位置に固定するための部材である。
この割スリーブ80,80は、金属性の薄板を筒状に形成され、軸方向に形成されたスリット80a,80aによって径方向に弾性収縮可能な筒状金属部材である。このような割スリーブ80,80は、筒内に光結合部材70,70の一部を挿入された状態でその外周面が後述する筒状部92,92の内面に当接されることによって光結合部材70,70を筒状部92の所定位置に固定するようになっている。
The split sleeves 80 and 80 are members for fixing the optical coupling portions 60 and 60 at predetermined positions in the cylindrical portions 92 and 92 (to be described later) of the coupling member accommodating portion 90.
The split sleeves 80 and 80 are cylindrical metal members that are formed of a metallic thin plate in a cylindrical shape and elastically shrinkable in the radial direction by slits 80a and 80a formed in the axial direction. Such split sleeves 80, 80 are arranged such that the outer peripheral surfaces of the split sleeves 80, 70 are in contact with the inner surfaces of cylindrical portions 92, 92 described later in a state where a part of the optical coupling members 70, 70 is inserted into the cylinders. The coupling members 70 are fixed to a predetermined position of the cylindrical portion 92.

結合部材収容部90は、直方体形状をなし、かつ素子実装部20に取り付けされる側の取り付け面91aを有してなる基部91と、基部91の長手方向に並ぶようにして二箇所に設けられた筒状部92,92とを有してなる。
各筒状部92,92は、筒の内径が各割スリーブ80,80に取り付けされた各光結合部材70,70を収容可能な大きさに設定されている。
また、各筒状部92,92は、筒状に突出された端部が各光ファイバコネクタ100,100の挿入口92aになっており、各割スリーブ80,80内に先端部分が挿入された各光ファイバコネクタ100,100が各光結合部材70,70に当接されることによって、各光ファイバコネクタ100,100と各光結合部材70,70とが接続されるようになっている。
また、結合部材収容部90と素子実装部20とは、例えば、取り付け面91aに塗布された接着剤を介して固定させる。あるいは、結合部材収容部90と素子実装部20とは、例えば、不図示の係合部によって固定される。
The coupling member accommodating portion 90 has a rectangular parallelepiped shape and is provided at two locations so as to be aligned in the longitudinal direction of the base portion 91 and a base portion 91 having a mounting surface 91a on the side attached to the element mounting portion 20. And cylindrical portions 92, 92.
Each of the cylindrical portions 92 and 92 is set so that the inner diameter of the cylinder can accommodate the optical coupling members 70 and 70 attached to the split sleeves 80 and 80.
In addition, each cylindrical portion 92, 92 has an end protruding in a cylindrical shape serving as an insertion port 92a of each optical fiber connector 100, 100, and a distal end portion is inserted into each split sleeve 80, 80. The optical fiber connectors 100 and 100 are brought into contact with the optical coupling members 70 and 70 so that the optical fiber connectors 100 and 100 and the optical coupling members 70 and 70 are connected to each other.
Further, the coupling member accommodating portion 90 and the element mounting portion 20 are fixed through an adhesive applied to the attachment surface 91a, for example. Or the coupling member accommodating part 90 and the element mounting part 20 are fixed by the engaging part not shown, for example.

このような光通信モジュール1は、各光結合部材70,70が、素子側端面70a,70aを突き当て面21,21に突き当てられながら素子実装部20に取り付けられた場合、各光結合部材70,70は、発光素子10、あるいは受光素子11に対して光結合のために定められた間隔をあけて配置される。
このため、各光ファイバコネクタ100,100が各挿入口92a,92aに挿入され、各光結合部材70,70の素子側端面70a,70aとは逆側の端面に当接されることによって、各光ファイバコネクタ100,100と、発光素子10あるいは受光素子11とが光結合される。
In such an optical communication module 1, each optical coupling member 70, 70 is attached to the element mounting portion 20 while the element side end faces 70a, 70a are abutted against the abutting surfaces 21, 21, respectively. 70 and 70 are arranged at a predetermined interval with respect to the light emitting element 10 or the light receiving element 11 for optical coupling.
For this reason, each optical fiber connector 100,100 is inserted in each insertion port 92a, 92a, and contact | abuts to the end surface on the opposite side to element side end surface 70a, 70a of each optical coupling member 70,70, The optical fiber connectors 100 and 100 and the light emitting element 10 or the light receiving element 11 are optically coupled.

ここで、図9を用いて光通信モジュール1の組み付け手順について説明する。図9は、光通信モジュール1の組み付け手順を示した図である。なお、この組み付け作業は、自動組み立て装置等を用いても構わない。
まず、作業者は、各光結合部材70,70を各割スリーブ80,80に取り付けた状態で、結合部材収容部90の各筒状部92,92内に仮セットする(図9(a)参照)。ここで仮セットとは、各光結合部材70,70の素子側端面70aが結合部材収容部90の取り付け面91aに対して突出された状態で保持されるようにすることである。この仮セット状態では、各光結合部材70,70の素子側端面70aが押圧されることによって、各光結合部材70,70が各筒状部92,92内の取り付け完了位置まで押し込み可能な状態になっている。
Here, the assembly procedure of the optical communication module 1 will be described with reference to FIG. FIG. 9 is a diagram showing an assembling procedure of the optical communication module 1. For this assembling work, an automatic assembling apparatus or the like may be used.
First, the worker temporarily sets the optical coupling members 70 and 70 in the cylindrical portions 92 and 92 of the coupling member accommodating portion 90 in a state where the optical coupling members 70 and 70 are attached to the split sleeves 80 and 80 (FIG. 9A). reference). Here, the temporary setting means that the element-side end surface 70a of each of the optical coupling members 70 and 70 is held in a state of protruding with respect to the mounting surface 91a of the coupling member accommodating portion 90. In this temporarily set state, the element-side end surface 70a of each optical coupling member 70, 70 is pressed, so that each optical coupling member 70, 70 can be pushed to the installation completion position in each cylindrical portion 92, 92. It has become.

その後、作業者は、仮セットされた各光結合部材70,70を各位置決めガイド壁部40,40によってガイドさせながら、各突き当て面21,21に突き当てる(図9(b)参照)。これにより、各光結合部材70,70が、発光素子10、あるいは受光素子11に対して光結合のために定められた間隔をあけて配置される。   Thereafter, the operator abuts against the abutting surfaces 21 and 21 while guiding the optically coupled members 70 and 70 temporarily set by the positioning guide wall portions 40 and 40 (see FIG. 9B). As a result, the optical coupling members 70 are arranged with a predetermined interval for optical coupling with respect to the light emitting element 10 or the light receiving element 11.

その後、作業者は、結合部材収容部90の取り付け面91aが、素子実装部20に当接されるように素子実装部20と結合部材収容部90とを固定させる(図9(c)参照)。これにより、各光結合部材70,70が各筒状部92,92内の所定位置に配置され、光通信モジュール1の組み付けが完了される。
なお、光通信モジュール1への各光ファイバコネクタ100,100の接続、および相手接続基板200の取り付け作業は、この光通信モジュール1の組み付け作業の前に行ってもよいし、この光通信モジュール1の組み付け作業が完了した後に行ってもよい。
Thereafter, the operator fixes the element mounting portion 20 and the coupling member accommodating portion 90 so that the mounting surface 91a of the coupling member accommodating portion 90 is in contact with the element mounting portion 20 (see FIG. 9C). . Thereby, each optical coupling member 70 and 70 is arrange | positioned in the predetermined position in each cylindrical part 92 and 92, and the assembly | attachment of the optical communication module 1 is completed.
The connection of the optical fiber connectors 100 and 100 to the optical communication module 1 and the attachment work of the mating connection board 200 may be performed before the assembly work of the optical communication module 1 or the optical communication module 1. It may be performed after the assembly work is completed.

本発明の実施例に係る光通信モジュール1は、各光結合部材70,70を各突き当て面21,21に突き当てるだけで、発光素子10および受光素子11のそれぞれと、各光結合部材70,70とを光結合効率の良い間隔に設定することができるので、容易に組み付けることができる。   In the optical communication module 1 according to the embodiment of the present invention, each of the light coupling element 70 and the light receiving element 11 and each of the optical coupling members 70 can be obtained simply by abutting the optical coupling members 70 and 70 against the abutting surfaces 21 and 21. , 70 can be set at intervals with good optical coupling efficiency, and can be easily assembled.

また、本発明の実施例に係る光通信モジュール1は、各位置決めガイド壁部40,40によって発光素子10および受光素子11のそれぞれと、各光結合部材70,70との位置決めを容易に行うことができる。   In addition, the optical communication module 1 according to the embodiment of the present invention can easily position the light emitting element 10 and the light receiving element 11 and the optical coupling members 70 and 70 by the positioning guide walls 40 and 40, respectively. Can do.

また、本発明の実施例に係る光通信モジュール1は、発光素子10、および受光素子11のそれぞれの実装領域を光結合部材70,70および位置決めガイド壁部40,40によって囲い込むことによって、発光素子10、および受光素子11のそれぞれの実装領域における光漏れを抑制し、結果的に発光素子10と受光素子11との間の光のクロストークが抑制さる。しかも、発光素子10と受光素子11との間の光のクロストークが抑制できるので、発光素子10と受光素子11とを互いに近づけて配置することができ、結果的に光通信モジュール1をコンパクト化することができる。   Further, the optical communication module 1 according to the embodiment of the present invention emits light by enclosing the mounting regions of the light emitting element 10 and the light receiving element 11 with the optical coupling members 70 and 70 and the positioning guide wall portions 40 and 40, respectively. Light leakage in the respective mounting regions of the element 10 and the light receiving element 11 is suppressed, and as a result, light crosstalk between the light emitting element 10 and the light receiving element 11 is suppressed. In addition, since light crosstalk between the light emitting element 10 and the light receiving element 11 can be suppressed, the light emitting element 10 and the light receiving element 11 can be disposed close to each other, resulting in a compact optical communication module 1. can do.

また、本発明の実施例に係る光通信モジュール1は、発光素子10、あるいは受光素子11と、電子部品12とがボンディングワイヤによって接続される場合、ボンディングワイヤを短尺化させることが可能となり、結果的に高周波特性を向上させることができる。   In addition, the optical communication module 1 according to the embodiment of the present invention can shorten the bonding wire when the light emitting element 10 or the light receiving element 11 and the electronic component 12 are connected by the bonding wire. In particular, the high frequency characteristics can be improved.

また、本発明の実施例に係る光通信モジュール1は、位置決め穴201と、位置決め突部52との嵌合によって、素子実装部20と、相手接続基板200との保持強度を高めることができるので、各光ファイバコネクタ100の挿抜時の応力に対して素子実装部20と、相手接続基板200との保持強度を向上させることができる。   Further, the optical communication module 1 according to the embodiment of the present invention can increase the holding strength between the element mounting portion 20 and the mating connection substrate 200 by fitting the positioning hole 201 and the positioning protrusion 52. The holding strength between the element mounting portion 20 and the mating connection substrate 200 can be improved against the stress when the optical fiber connectors 100 are inserted and removed.

また、本発明の実施例に係る光通信モジュール1は、光透過性樹脂31が各素子配置用凹部30,30に充填されることによって、各素子配置用凹部30,30に配置された発光素子10、受光素子11、あるいは電子部品12が光透過性樹脂31によって覆われるので、発光素子10、受光素子11、あるいは電子部品12を光透過性樹脂31によって保護することができる。しかも、光透過性樹脂31は、凹部に充填されるため、光透過性樹脂31が充填必要箇所以外に流れ出ることを防止することができる。   In addition, the optical communication module 1 according to the embodiment of the present invention includes a light emitting element arranged in each element arrangement recess 30, 30 by filling the element arrangement depressions 30, 30 with the light transmitting resin 31. 10, since the light receiving element 11 or the electronic component 12 is covered with the light transmitting resin 31, the light emitting element 10, the light receiving element 11, or the electronic component 12 can be protected by the light transmitting resin 31. In addition, since the light-transmitting resin 31 is filled in the recesses, the light-transmitting resin 31 can be prevented from flowing out to places other than the place where filling is required.

(変形例1)
次に、図10を用いて本発明の実施例の光通信モジュール1の変形例1について説明する。図10は、本発明の実施例の変形例1の光通信モジュール2の分解斜視図である。
なお、図10には、光通信モジュール2に接続される二つの光ファイバコネクタ100,100を追加して示している。
この変形例1の光通信モジュール2は、発光素子10と、受光素子11とが別体の素子実装部22,23に設けられている点で実施例の光通信モジュール1と異なる。
なお、その他の構成は実施例と同様であり、実施例と同一構成部分には同一符号を付している。
(Modification 1)
Next, Modification 1 of the optical communication module 1 according to the embodiment of the present invention will be described with reference to FIG. FIG. 10 is an exploded perspective view of the optical communication module 2 according to the first modification of the embodiment of the present invention.
In FIG. 10, two optical fiber connectors 100 and 100 connected to the optical communication module 2 are additionally shown.
The optical communication module 2 of Modification 1 is different from the optical communication module 1 of the embodiment in that the light emitting element 10 and the light receiving element 11 are provided in separate element mounting portions 22 and 23.
Other configurations are the same as those in the embodiment, and the same components as those in the embodiment are denoted by the same reference numerals.

この変形例1の光通信モジュール2は、実施例の光通信モジュール1と同様な効果を奏することができる。   The optical communication module 2 of this modification 1 can have the same effects as the optical communication module 1 of the embodiment.

(変形例2)
次に、図11を用いて本発明の実施例の光通信モジュール1の変形例2について説明する。図11は、本発明の実施例の変形例2の光通信モジュール3の分解斜視図である。
なお、図11には、光通信モジュール3に接続される二つの光ファイバコネクタ100,100を追加して示している。
この変形例2の光通信モジュール3は、光ファイバスタブに代わって、屈折率分布型レンズ、いわゆるGRIN(Graded Index)レンズを光結合部材71,71として用いている点で実施例の光通信モジュール1と異なる。
なお、その他の構成は実施例と同様であり、実施例と同一構成部分には同一符号を付している。
(Modification 2)
Next, Modification 2 of the optical communication module 1 according to the embodiment of the present invention will be described with reference to FIG. FIG. 11 is an exploded perspective view of the optical communication module 3 according to the second modification of the embodiment of the present invention.
In FIG. 11, two optical fiber connectors 100 and 100 connected to the optical communication module 3 are additionally shown.
The optical communication module 3 of this modification 2 is an optical communication module of the embodiment in that instead of the optical fiber stub, a refractive index distribution type lens, a so-called GRIN (Graded Index) lens is used as the optical coupling members 71, 71. Different from 1.
Other configurations are the same as those in the embodiment, and the same components as those in the embodiment are denoted by the same reference numerals.

各光結合部材71,71は、実施例の光結合部材70,70と同形状の円柱状をなし、発光素子10、および受光素子11のそれぞれを各光ファイバコネクタ100,100に光学的に結合させる機能をなしている。   Each of the optical coupling members 71 and 71 has a cylindrical shape that is the same shape as the optical coupling members 70 and 70 of the embodiment, and optically couples the light emitting element 10 and the light receiving element 11 to the optical fiber connectors 100 and 100, respectively. It has a function to let you.

この変形例2の光通信モジュール3は、実施例の光通信モジュール1と同様な効果を奏することができる。   The optical communication module 3 of this modification 2 can have the same effects as the optical communication module 1 of the embodiment.

(変形例3)
次に、図12を用いて本発明の実施例の光通信モジュール1の変形例3について説明する。図12は、本発明の実施例の変形例3の光通信モジュール4の分解斜視図である。
なお、図12には、光通信モジュール4に接続される二つの光ファイバコネクタを追加して示している。
この変形例3の光通信モジュール4は、素子実装部20がリードフレーム53を介して、相手接続基板200に接続される点で実施例の光通信モジュール1と異なる。
なお、その他の構成は実施例と同様であり、実施例と同一構成部分には同一符号を付している。
(Modification 3)
Next, Modification 3 of the optical communication module 1 according to the embodiment of the present invention will be described with reference to FIG. FIG. 12 is an exploded perspective view of the optical communication module 4 according to the third modification of the embodiment of the present invention.
In FIG. 12, two optical fiber connectors connected to the optical communication module 4 are additionally shown.
The optical communication module 4 of the third modification differs from the optical communication module 1 of the embodiment in that the element mounting portion 20 is connected to the mating connection board 200 via the lead frame 53.
Other configurations are the same as those in the embodiment, and the same components as those in the embodiment are denoted by the same reference numerals.

この変形例3の光通信モジュール4は、実施例の光通信モジュール1と同様に、各光結合部材70,70を各突き当て面21,21に突き当てるだけで、発光素子10および受光素子11のそれぞれと、各光結合部材70,70とを光結合効率の良い間隔に設定することができるので、容易に組み付けることができる。   Similar to the optical communication module 1 of the embodiment, the optical communication module 4 of the third modification has the light emitting element 10 and the light receiving element 11 only by abutting the optical coupling members 70 and 70 against the abutting surfaces 21 and 21. Since each of the optical coupling members 70 and 70 can be set at an interval with good optical coupling efficiency, they can be assembled easily.

なお、本発明の実施の実施例に係る光通信モジュール1,2,3,4は、素子実装部20,22,23が位置決めガイド壁部40,40を有してなるものを例示したが、これに限らず、素子実装部20,22,23が位置決めガイド壁部40,40を有しない構造であっても構わない。この場合、結合部材収容部90,93,94と素子実装部20,22,23との間に各光結合部材70,70が各突き当て面21,21に位置決めされるように位置決め機能を持たせるとよい。   In addition, although the optical communication modules 1, 2, 3, and 4 which concern on the Example of implementation of this invention illustrated what the element mounting parts 20, 22, and 23 have the positioning guide wall parts 40 and 40, Not limited to this, the element mounting portions 20, 22, and 23 may have a structure that does not include the positioning guide wall portions 40 and 40. In this case, a positioning function is provided so that the optical coupling members 70 and 70 are positioned on the abutting surfaces 21 and 21 between the coupling member accommodating portions 90, 93 and 94 and the element mounting portions 20, 22 and 23. It is good to make it.

また、本発明の実施例に係る光通信モジュール1,2,3,4は、素子実装部20,22,23が回路基板であるものを例示したが、これに限らず、発光素子10、あるいは受光素子11が実装されるものであればその他のものであっても構わない。例えば、素子実装部が絶縁性の板状部材であり、リード線を介して相手接続基板200に接続されるようにしてもよい。   Moreover, although the optical communication modules 1, 2, 3, and 4 which concern on the Example of this invention illustrated what the element mounting parts 20, 22, and 23 are circuit boards, not only this but the light emitting element 10, or Other devices may be used as long as the light receiving element 11 is mounted. For example, the element mounting portion may be an insulating plate-like member, and may be connected to the mating connection substrate 200 via a lead wire.

また、本発明の実施例に係る光通信モジュール1,2,3,4は、素子配置用凹部30,30に、発光素子10、あるいは受光素子11以外にその他電子部品12が配置されるものを例示したがこれに限らず、素子配置用凹部30,30には発光素子10、あるいは受光素子11が配置されていればよい。   The optical communication modules 1, 2, 3, and 4 according to the embodiments of the present invention are those in which other electronic components 12 are arranged in addition to the light emitting element 10 or the light receiving element 11 in the element arranging recesses 30 and 30. Although it illustrated, it is not restricted to this, The light emitting element 10 or the light receiving element 11 should just be arrange | positioned in the recessed parts 30 and 30 for element arrangement | positioning.

以上、本発明者によってなされた発明を、上述した発明の実施例に基づき具体的に説明したが、本発明は、上述した発明の実施例に限定されるものではなく、その要旨を逸脱しない範囲において種々変更可能である。   The invention made by the present inventor has been specifically described based on the above-described embodiments of the invention. However, the present invention is not limited to the above-described embodiments of the invention and does not depart from the gist thereof. Various changes can be made.

1,2,3,4 光通信モジュール
10 発光素子
11 受光素子
12 電子部品
20,22,23 素子実装部
20a 基板端
21 突き当て面
30 素子配置用凹部
30a 底面
31 光透過性樹脂
40 位置決めガイド壁部
40a 上端部
50 相手基板接続用実装面
51 電気接続パッド
52 位置決め突部
53 リードフレーム
60 光結合部
61 光ファイバ保持部
61a 貫通孔
62 光ファイバ
70,71 光結合部材
70a,71a 素子側端面
70b,71b 外周面
80 割スリーブ
80a スリット
90,93,94 結合部材収容部
91 基部
91a 取り付け面
92 筒状部
92a 挿入口
100 光ファイバコネクタ
200 相手接続基板
200a 接続面
201 位置決め穴
DESCRIPTION OF SYMBOLS 1, 2, 3, 4 Optical communication module 10 Light emitting element 11 Light receiving element 12 Electronic component 20, 22, 23 Element mounting part 20a Board | substrate edge 21 Abutting surface 30 Element arrangement | positioning recessed part 30a Bottom face 31 Light-transmitting resin 40 Positioning guide wall Portion 40a Upper end 50 Mounting surface for connecting to the other substrate 51 Electrical connection pad 52 Positioning projection 53 Lead frame 60 Optical coupling portion 61 Optical fiber holding portion 61a Through hole 62 Optical fiber 70, 71 Optical coupling member 70a, 71a Element side end surface 70b , 71b Outer peripheral surface 80 Split sleeve 80a Slit 90, 93, 94 Coupling member accommodating portion 91 Base portion 91a Mounting surface 92 Cylindrical portion 92a Insertion port 100 Optical fiber connector 200 Mating connection substrate 200a Connection surface 201 Positioning hole

Claims (4)

発光素子、あるいは受光素子と、前記発光素子、あるいは前記受光素子が実装される素子実装部と、前記発光素子、あるいは前記受光素子を光ファイバコネクタに光学的に結合させる光結合部材を含む光結合部と、を有してなる光通信モジュールにおいて、
前記素子実装部は、
前記光結合部材の前記発光素子あるいは前記受光素子と向かい合う側の端面である素子側端面が突き当てられる突き当て面と、
前記突き当て面に対して凹み形状をなし、かつ底面に前記発光素子、あるいは前記受光素子が光結合のために定められた間隔をあけて前記素子側端面に向かい合うように配置される素子配置用凹部と、
を有してなることを特徴とする光通信モジュール。
An optical coupling including a light emitting element or a light receiving element, an element mounting portion on which the light emitting element or the light receiving element is mounted, and an optical coupling member for optically coupling the light emitting element or the light receiving element to an optical fiber connector. An optical communication module comprising:
The element mounting part is
An abutting surface against which an element side end surface that is an end surface facing the light emitting element or the light receiving element of the optical coupling member is abutted;
For element arrangement in which a concave shape is formed with respect to the abutting surface, and the light emitting element or the light receiving element is arranged on the bottom surface so as to face the element side end face with a predetermined interval for optical coupling. A recess,
An optical communication module comprising:
前記素子実装部は、
前記突き当て面に対して突出され、かつ前記突き当て面に突き当てられた前記光結合部材の外周面に沿って設けられてなり、前記光結合部材の位置決め機能をなす位置決めガイド壁部を有してなることを特徴とする請求項1に記載の光通信モジュール。
The element mounting part is
A positioning guide wall portion that protrudes from the abutting surface and is provided along the outer peripheral surface of the optical coupling member that is abutted against the abutting surface and that functions to position the optical coupling member. The optical communication module according to claim 1, wherein
前記素子実装部は、
前記素子配置用凹部が前記発光素子および前記受光素子のそれぞれが配置されるように二箇所に設けられ、
前記発光素子および前記受光素子のそれぞれに対応した前記光結合部材の前記位置決めガイド壁部が、各光結合部材が互いに向かい合う側の各光結合部材の外周面を囲うように設けられてなることを特徴とする請求項2に記載の光通信モジュール。
The element mounting part is
The element placement recess is provided at two locations so that each of the light emitting element and the light receiving element is disposed,
The positioning guide wall portion of the optical coupling member corresponding to each of the light emitting element and the light receiving element is provided so as to surround the outer peripheral surface of each optical coupling member on the side where each optical coupling member faces each other. The optical communication module according to claim 2.
前記素子実装部は、
回路基板であり、
前記素子配置用凹部は、
前記発光素子、あるいは前記受光素子以外に前記素子実装部に実装される電子部品が配置されることを特徴とする請求項1、2または3に記載の光通信モジュール。
The element mounting part is
Circuit board,
The recess for element arrangement is
4. The optical communication module according to claim 1, wherein an electronic component mounted on the element mounting portion is disposed in addition to the light emitting element or the light receiving element.
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7484230B2 (en) 2020-03-04 2024-05-16 富士通オプティカルコンポーネンツ株式会社 Optical Modules

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001337249A (en) * 2000-05-24 2001-12-07 Matsushita Electric Works Ltd Receptacle for optical communication
JP2002267893A (en) * 2001-03-13 2002-09-18 Seiko Epson Corp Optical module, method for manufacturing the same, and optical transmitter
JP2003279806A (en) * 2002-03-20 2003-10-02 Matsushita Electric Works Ltd Optical connector

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001337249A (en) * 2000-05-24 2001-12-07 Matsushita Electric Works Ltd Receptacle for optical communication
JP2002267893A (en) * 2001-03-13 2002-09-18 Seiko Epson Corp Optical module, method for manufacturing the same, and optical transmitter
JP2003279806A (en) * 2002-03-20 2003-10-02 Matsushita Electric Works Ltd Optical connector

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7484230B2 (en) 2020-03-04 2024-05-16 富士通オプティカルコンポーネンツ株式会社 Optical Modules

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