JPH0521949A - Surface-mounted part positioning device - Google Patents
Surface-mounted part positioning deviceInfo
- Publication number
- JPH0521949A JPH0521949A JP3173641A JP17364191A JPH0521949A JP H0521949 A JPH0521949 A JP H0521949A JP 3173641 A JP3173641 A JP 3173641A JP 17364191 A JP17364191 A JP 17364191A JP H0521949 A JPH0521949 A JP H0521949A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- wiring board
- surface mount
- positioning device
- mount component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、プリント配線板と狭ピ
ッチの表面実装部品の実装において熱圧着時、表面実装
部品のリードが容易に位置決め可能とされる表面実装部
品位置決め装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mount component positioning device which allows the leads of the surface mount component to be easily positioned during thermocompression bonding when mounting a printed wiring board and a narrow pitch surface mount component.
【０００２】[0002]
【従来の技術】従来、熱圧着方法としては、配線板のパ
ッドにあらかじめはんだを塗布しておき、配線板と表面
実装部品のリードはスリットのない平坦な熱圧着ヘッド
を使用した表面実装部品位置決め装置がある。2. Description of the Related Art Conventionally, as a thermocompression bonding method, solder is applied to the pads of a wiring board in advance, and the leads of the wiring board and the surface mounting components use a flat thermocompression bonding head without slits to position the surface mounting components. There is a device.
【０００３】[0003]
【発明が解決しようとする課題】ところが、前記のよう
な従来技術においては部品圧着時に部品のリードがずれ
パッド間に落ち込むという問題がある。そこで本発明の
目的は、配線板のパッドを基準にし表面実装部品のリー
ドを矯正し熱圧着が出来る表面実装部品位置決め装置を
提供することにある。However, in the above-mentioned prior art, there is a problem that the lead of the component shifts during the crimping of the component and falls between the pads. SUMMARY OF THE INVENTION It is an object of the present invention to provide a surface mount component positioning device capable of correcting the leads of the surface mount component and performing thermocompression bonding based on the pads of the wiring board.
【０００４】[0004]
【課題を解決するための手段】本発明のうち代表的なも
のの概要を簡単に説明すれば下記のとうりである。すな
わち本発明の表面実装部品位置決め装置は熱圧着板にス
リットを形成させ位置ずれを矯正させるようにしたもの
である。The outline of a typical one of the present invention will be briefly described as follows. That is, the surface mount component positioning apparatus of the present invention is one in which a slit is formed in the thermocompression bonding plate to correct the positional deviation.
【０００５】[0005]
【作用】前記した表面実装部品位置決め装置によれば、
リードは熱圧着板のスリット側面の壁に押され配線板の
パッド中心位置に矯正され、接合時のズレ、落下をなく
すことが出来る。According to the surface mounting component positioning device described above,
The leads are pressed against the side wall of the slit of the thermocompression bonding plate and are corrected to the center position of the pad of the wiring board, so that misalignment and drop at the time of bonding can be eliminated.
【０００６】[0006]
【実施例】図１は本発明の一実施例である表面実装部品
位置決め装置の断面図。図２は表面実装部品位置決め装
置の加熱ヘッド兼リード押えの加工方法。図３は表面実
装部品位置決め装置を用いた部品の搭載状態を示す説明
図。図４は表面実装部品位置決め装置の位置合わせ状態
図を示す。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a sectional view of a surface mount component positioning apparatus according to an embodiment of the present invention. FIG. 2 shows a method of processing the heating head and lead retainer of the surface mount component positioning device. FIG. 3 is an explanatory view showing a mounted state of components using the surface mount component positioning device. FIG. 4 shows a positioning state diagram of the surface mount component positioning device.
【０００７】まず、図１及び図２により本実施例の表面
実装部品位置決め装置の構成を説明する。本実施例の表
面実装部品位置決め装置はスリットを備えた加熱ヘッド
兼リード押え１とされ、熱伝導率の良い材質モリブデン
より形成されている。スリットピッチは表面実装部品リ
ード２のピッチと同一寸法で形成されている。First, the construction of the surface mount component positioning apparatus of this embodiment will be described with reference to FIGS. 1 and 2. The surface mount component positioning apparatus of this embodiment is a heating head and lead retainer 1 having a slit, and is made of molybdenum, which has a high thermal conductivity. The slit pitch is formed in the same size as the pitch of the surface mount component leads 2.
【０００８】スリットの加工方法としては、第１ダイヤ
モンドカッタ１ａで溝処理を行い第２ダイヤモンドカッ
タ１ｂにてテーパ処理を行う。As a method of processing the slit, a groove treatment is performed by the first diamond cutter 1a and a taper treatment is performed by the second diamond cutter 1b.
【０００９】次に本実施例について図３、図４により説
明する。Next, this embodiment will be described with reference to FIGS.
【００１０】始めに表面実装部品を吸着ノズル８で吸着
し配線板上のパッド４に仮搭載をする。次に加熱ヘッド
１を降下させると、もしリード２に位置ずれがある場
合、傾斜をつけたスリット側面の壁に押され該スリット
の平坦な底部まで移動する。このようにして、リードに
変形、位置ずれがあっても、これを正規の位置に矯正で
きるのでリード２は配線板５のパッド４上に位置合わせ
が行える。次にヒータブロック７を加熱ヘッド１の上に
密着させヒータ６より熱を伝導させはんだ３を溶かし配
線板のパッドと表面実装部品のリード２をはんだ付け接
続を行う。First, the surface mount component is sucked by the suction nozzle 8 and temporarily mounted on the pad 4 on the wiring board. Next, when the heating head 1 is lowered, if the lead 2 is misaligned, it is pushed by the inclined side wall of the slit and moves to the flat bottom of the slit. In this way, even if the lead is deformed or misaligned, it can be corrected to the normal position, so that the lead 2 can be aligned with the pad 4 of the wiring board 5. Next, the heater block 7 is brought into close contact with the heating head 1 to conduct heat from the heater 6 to melt the solder 3, and the pad of the wiring board and the lead 2 of the surface mount component are connected by soldering.
【００１１】[0011]
【発明の効果】本発明の効果を説明すれば、下記のとう
りである。The effects of the present invention will be described below.
【００１２】表面実装部品位置決め装置によれば、位置
合わせは配線板のパッド間隔に熱圧着板を落し込むこと
により配線板のパッド中心に表面実装部品のリード中心
を合わせることが出き又接合時のズレ、落下をなくすこ
とが出来る。According to the surface mount component positioning apparatus, the position of the lead of the surface mount component can be aligned with the pad center of the wiring board by dropping the thermocompression bonding plate into the pad spacing of the wiring board for the alignment. It is possible to eliminate slippage and fall.
【図１】本発明の一実施例である表面実装部品位置決め
装置の説明図である。FIG. 1 is an explanatory diagram of a surface mount component positioning device according to an embodiment of the present invention.
【図２】表面実装部品位置決め装置の加熱ヘッド兼リー
ド押えの加工方法を示す図である。FIG. 2 is a diagram showing a method of processing a heating head and lead retainer of a surface mount component positioning device.
【図３】表面実装部品位置決め装置を用いた部品の搭載
状態を示す説明図である。FIG. 3 is an explanatory diagram showing a mounted state of components using a surface mount component positioning device.
【図４】表面実装部品位置決め装置の位置合わせ状態図
である。FIG. 4 is a positioning state diagram of the surface mount component positioning device.
１…加熱ヘッド兼リード押え、 １ａ，１ｂ…ダイヤモンドカッタ、 ２…表面実装部品リード、 ３…はんだ、 ４…配線板上のリードパッド、 ５…配線板、 ６…ヒータ、 ７…ヒータブロック、 ８…吸着ノズル。 1 ... Heating head and lead retainer, 1a, 1b ... Diamond cutter, 2 ... Surface mount component lead, 3 ... Solder, 4 ... Lead pad on wiring board, 5 ... Wiring board, 6 ... Heater, 7 ... Heater block, 8 … Suction nozzle.
Claims (1)
のリードおよび、熱圧着を行う熱伝導体において、熱伝
導体の表面にスリットを形成させリードの中心位置に自
動的に位置決めさせるようにしたことを特徴とする表面
実装部品位置決め装置。Claim: What is claimed is: 1. A pad of a printed wiring board, a lead of a surface mount component, and a heat conductor for thermocompression bonding, wherein a slit is formed on the surface of the heat conductor to automatically locate the center of the lead. A surface mounting component positioning device characterized in that it is positioned mechanically.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3173641A JPH0521949A (en) | 1991-07-15 | 1991-07-15 | Surface-mounted part positioning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3173641A JPH0521949A (en) | 1991-07-15 | 1991-07-15 | Surface-mounted part positioning device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0521949A true JPH0521949A (en) | 1993-01-29 |
Family
ID=15964379
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3173641A Pending JPH0521949A (en) | 1991-07-15 | 1991-07-15 | Surface-mounted part positioning device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0521949A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130255079A1 (en) * | 2010-10-14 | 2013-10-03 | Stora Enso Oyj | Method and arrangement for attaching a chip to a printed conductive surface |
-
1991
- 1991-07-15 JP JP3173641A patent/JPH0521949A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130255079A1 (en) * | 2010-10-14 | 2013-10-03 | Stora Enso Oyj | Method and arrangement for attaching a chip to a printed conductive surface |
| US9629255B2 (en) * | 2010-10-14 | 2017-04-18 | Stora Enso Oyj | Method and arrangement for attaching a chip to a printed conductive surface |
| USRE48018E1 (en) * | 2010-10-14 | 2020-05-26 | Stora Enso Oyj | Method and arrangement for attaching a chip to a printed conductive surface |
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