JPH01171035U

JPH01171035U -

Info

Publication number: JPH01171035U
Application number: JP6919088U
Authority: JP
Priority date: 1988-05-24
Filing date: 1988-05-24
Publication date: 1989-12-04

Description

[Brief explanation of drawings]

第１図ないし第４図は本考案に係り、第１図は
ウエハカセツトと、それに装着使用される本考案
の第１の実施例に係るフアセツト整列装置との断
面図、第２図は第１図のウエハカセツト内の半導
体ウエハとフアセツト整列装置の整列棒との側面
図、第３図はウエハカセツトと、それに装着使用
される本考案の第２の実施例に係るフアセツト整
列装置との断面図、第４図は第３図のウエハカセ
ツト内の半導体ウエハとフアセツト整列装置の整
列棒との側面図である。第５図はウエハカセツト
と、それに装着使用される従来例に係るフアセツ
ト整列装置との断面図である。２，２……側板、４，４……保持溝、６……半
導体ウエハ、８……開放面、１０……第１の整列
棒、１２……半導体ウエハのフアセツト、１４…
…第２の整列棒、１６……第２の整列棒における
凹部。図中、同一符号は同一部分または相当部分
を示している。 1 to 4 relate to the present invention; FIG. 1 is a cross-sectional view of a wafer cassette and a facet aligning device according to a first embodiment of the present invention, which is installed and used therein; FIG. FIG. 3 is a side view of the semiconductor wafers in the wafer cassette and the alignment rod of the facet alignment device, and FIG. 4 is a side view of the semiconductor wafer in the wafer cassette of FIG. 3 and the alignment rod of the facet alignment device. FIG. 5 is a cross-sectional view of a wafer cassette and a conventional facet alignment device mounted thereon. 2, 2... Side plate, 4, 4... Holding groove, 6... Semiconductor wafer, 8... Open surface, 10... First alignment rod, 12... Facet of semiconductor wafer, 14...
...Second alignment rod, 16...Recess in second alignment rod. In the drawings, the same reference numerals indicate the same or equivalent parts.

Claims

[Claims for Utility Model Registration] A semiconductor wafer is provided with a pair of side plates arranged opposite each other, and a peripheral edge of a semiconductor wafer is held in a holding groove formed in an inner circumferential surface of each of the pair of side plates facing each other. It is used by being attached to the open surface of a wafer cassette that stores and holds semiconductor wafers.
and a facet alignment device comprising a first alignment rod disposed at a position to rotationally drive the semiconductor wafer by contacting an end surface other than the facet of the semiconductor wafer facing the open surface in the mounted state, In the mounted state, a second alignment rod is provided so as to be disposed near the side plate of the wafer cassette and in contact with an end surface of the semiconductor wafer, and at least one of the two alignment rods is attached to the wafer cassette. A facet alignment device for semiconductor wafers, characterized in that one side is used for rotational drive and the other side is used for idler.