JPS6265838U - - Google Patents
Info
- Publication number
- JPS6265838U JPS6265838U JP15804485U JP15804485U JPS6265838U JP S6265838 U JPS6265838 U JP S6265838U JP 15804485 U JP15804485 U JP 15804485U JP 15804485 U JP15804485 U JP 15804485U JP S6265838 U JPS6265838 U JP S6265838U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- wafer
- claw
- press
- fixing device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 210000000078 claw Anatomy 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
Description
第１図は本考案の一実施例の平面図、第２図は
第１図に示すウエーハ固定具のＡ―Ａ′線断面図
、第３図は従来のウエーハ固定具の第１の例を示
す断面図、第４図は従来のウエーハ固定具の第２
の例を示す断面図である。
１…半導体ウエーハ、２…ウエーハステージ、
３…固定部材、４…引張りコイルばね、６，７…
ウエーハ固定具、８，９…接着剤、１０…テープ
、１０１…オリエンテーシヨンフラツト、２０１
…ウエーハ搭載面、２０２…切込み溝、２０３…
軸、２０５…位置決めピン、３０１…爪、３０４
…押し部。
Fig. 1 is a plan view of one embodiment of the present invention, Fig. 2 is a sectional view taken along line A-A' of the wafer fixture shown in Fig. 1, and Fig. 3 is a first example of the conventional wafer fixture. The cross-sectional view shown in FIG. 4 is the second part of the conventional wafer fixture.
It is a sectional view showing an example. 1... Semiconductor wafer, 2... Wafer stage,
3...Fixing member, 4...Tension coil spring, 6, 7...
Wafer fixture, 8, 9...Adhesive, 10...Tape, 101...Orientation flat, 201
...Wafer mounting surface, 202... Cut groove, 203...
Shaft, 205... Positioning pin, 301... Claw, 304
...Push part.
Claims (1)
のオリエンテーシヨンフラツトに対しπ／４ｒａ
ｄ傾斜した位置を基準に外周を４等分する位置に
それぞれ切込み溝を設けたウエーハステージと、
それぞれの前記切込み溝の対面する壁に支持され
る軸と、該軸に回動可能に支持され前記半導体ウ
エーハ側の上端部に前記半導体ウエーハの上面の
外周縁部を押える爪を突設した固定部材と、一端
が前記ウエーハステージに他端が前記固定部材に
係止され前記爪を前記半導体ウエーハに圧接させ
る弾性体とを含むことを特徴とするウエーハ固定
具。 A semiconductor wafer is placed on the top surface, and π/4ra is set relative to the orientation flat of the semiconductor wafer.
d A wafer stage with grooves provided at positions dividing the outer periphery into four equal parts based on the inclined position;
A fixing device including a shaft supported by the facing wall of each of the cut grooves, and a claw that is rotatably supported by the shaft and protrudes from an upper end on the semiconductor wafer side to press the outer peripheral edge of the upper surface of the semiconductor wafer. A wafer fixing device comprising: a member; and an elastic body having one end latched to the wafer stage and the other end latched to the fixing member to press the claw into contact with the semiconductor wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15804485U JPS6265838U (en) | 1985-10-15 | 1985-10-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15804485U JPS6265838U (en) | 1985-10-15 | 1985-10-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6265838U true JPS6265838U (en) | 1987-04-23 |
Family
ID=31081163
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15804485U Pending JPS6265838U (en) | 1985-10-15 | 1985-10-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6265838U (en) |
-
1985
- 1985-10-15 JP JP15804485U patent/JPS6265838U/ja active Pending