JPH0116623B2 - - Google Patents

Info

Publication number
JPH0116623B2
JPH0116623B2 JP56042281A JP4228181A JPH0116623B2 JP H0116623 B2 JPH0116623 B2 JP H0116623B2 JP 56042281 A JP56042281 A JP 56042281A JP 4228181 A JP4228181 A JP 4228181A JP H0116623 B2 JPH0116623 B2 JP H0116623B2
Authority
JP
Japan
Prior art keywords
magnetic
magnetic field
fluid
abrasive grains
workpiece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56042281A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57163057A (en
Inventor
Toshiji Kurobe
Osamu Imanaka
Eiju Hatano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TOYO KENMAZAI KOGYO KK
Original Assignee
TOYO KENMAZAI KOGYO KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TOYO KENMAZAI KOGYO KK filed Critical TOYO KENMAZAI KOGYO KK
Priority to JP56042281A priority Critical patent/JPS57163057A/ja
Publication of JPS57163057A publication Critical patent/JPS57163057A/ja
Publication of JPH0116623B2 publication Critical patent/JPH0116623B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B31/00Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor
    • B24B31/10Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor involving other means for tumbling of work
    • B24B31/102Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor involving other means for tumbling of work using an alternating magnetic field

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP56042281A 1981-03-25 1981-03-25 Surface polishing method Granted JPS57163057A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56042281A JPS57163057A (en) 1981-03-25 1981-03-25 Surface polishing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56042281A JPS57163057A (en) 1981-03-25 1981-03-25 Surface polishing method

Publications (2)

Publication Number Publication Date
JPS57163057A JPS57163057A (en) 1982-10-07
JPH0116623B2 true JPH0116623B2 (enrdf_load_stackoverflow) 1989-03-27

Family

ID=12631661

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56042281A Granted JPS57163057A (en) 1981-03-25 1981-03-25 Surface polishing method

Country Status (1)

Country Link
JP (1) JPS57163057A (enrdf_load_stackoverflow)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59102569A (ja) * 1982-11-30 1984-06-13 Taihoo Kogyo Kk 磁性流体を使用した研磨方法
JPS6034264A (ja) * 1983-08-06 1985-02-21 Toubu M X Kk 磁気研摩仕上装置
JPS6067057A (ja) * 1983-09-21 1985-04-17 Taihoo Kogyo Kk 研磨方法
JPS60118466A (ja) * 1983-11-29 1985-06-25 Taihoo Kogyo Kk 磁性流体による研磨方法
JPS63272457A (ja) * 1987-05-01 1988-11-09 Seibu Electric & Mach Co Ltd 工作物の研磨方法
JP2682260B2 (ja) * 1991-05-09 1997-11-26 松下電器産業株式会社 微小研磨方法及び微小研磨工具
JP2007021660A (ja) * 2005-07-15 2007-02-01 Fdk Corp 複雑形状体の鏡面研磨方法および鏡面研磨装置
KR100861775B1 (ko) 2007-07-20 2008-10-08 중앙대학교 산학협력단 순환식 자기유변유체 연마장치
CN104842224B (zh) * 2015-04-14 2017-09-19 辽宁科技大学 一种锥体零件的磁力研磨光整方法及其装置
JP6601909B2 (ja) * 2015-12-08 2019-11-06 国立大学法人宇都宮大学 磁気研磨装置及び磁気研磨方法
CN106584218B (zh) * 2017-01-03 2019-01-01 山东理工大学 一种微细结构化表面光整加工方法、介质及装置

Also Published As

Publication number Publication date
JPS57163057A (en) 1982-10-07

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