JPH01165675U - - Google Patents
Info
- Publication number
- JPH01165675U JPH01165675U JP6260388U JP6260388U JPH01165675U JP H01165675 U JPH01165675 U JP H01165675U JP 6260388 U JP6260388 U JP 6260388U JP 6260388 U JP6260388 U JP 6260388U JP H01165675 U JPH01165675 U JP H01165675U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- rectangular pads
- boards
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009751 slip forming Methods 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Description
第１図ａ〜ｄは、本考案を適用した２枚のプリ
ント基板を示し、ａは平面図、ｂはａの側面図、
ｃは平面図、ｄはｃの側面図、第２図ａは本考案
を適用した２枚の基板の接続した状態の側面図、
ｂは本考案を適用した２枚の基板の接続状態の斜
視図である。
１，１′……本考案を適用したプリント基板、
２，２′，２″，５，５′……凹形部分、３，３
′，４，４′，４″……凸形部分、６……はんだ
、ａ，ａ′，ｂ，ｃ，ｄ，ｄ′，ｅ，ｆ，ｇ，ｇ
′……本考案を適用したプリント基板の回路のパ
ツド、ｈ，ｉ，ｊ，ｊ′，ｋ，ｌ，ｍ，ｍ′，ｎ
，ｐ……本考案を適用したもう一方のプリント基
板の回路のパツド。
Figures 1 a to d show two printed circuit boards to which the present invention is applied, where a is a plan view, b is a side view of a,
c is a plan view, d is a side view of c, and Figure 2 a is a side view of two boards connected to each other to which the present invention is applied.
b is a perspective view of a connected state of two boards to which the present invention is applied. 1,1'...Printed circuit board to which the present invention is applied,
2, 2', 2'', 5, 5'...Concave portion, 3, 3
', 4, 4', 4''... Convex portion, 6... Solder, a, a', b, c, d, d', e, f, g, g
'... Pads of the circuit of the printed circuit board to which the present invention is applied, h, i, j, j', k, l, m, m', n
, p... Circuit pad of the other printed circuit board to which the present invention is applied.
Claims (1)
連続した凹凸な形状を複数個形成し、かつ、その
各凸部の先端部と根本部、及び凹部にプリント基
板内の回路に接続した矩形のパツドを設けた２枚
の基板を、その連続して形成された凹凸の形状の
部分を互いに交叉して組み合わせて、その矩形の
パツドにはんだ付けすることにより接続する構造
を有する直接接続プリント基板。 In a double-sided printed circuit board, a plurality of continuous uneven shapes are formed at the end of one side, and rectangular pads connected to the circuit inside the printed circuit board are placed at the tip and base of each convex part and at the concave part. A direct connection printed circuit board having a structure in which two boards are connected by intersecting the continuously formed uneven parts and soldering to the rectangular pads.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6260388U JPH01165675U (en) | 1988-05-11 | 1988-05-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6260388U JPH01165675U (en) | 1988-05-11 | 1988-05-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01165675U true JPH01165675U (en) | 1989-11-20 |
Family
ID=31288206
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6260388U Pending JPH01165675U (en) | 1988-05-11 | 1988-05-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01165675U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016156893A (en) * | 2015-02-23 | 2016-09-01 | 富士通オプティカルコンポーネンツ株式会社 | Optical module |
-
1988
- 1988-05-11 JP JP6260388U patent/JPH01165675U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016156893A (en) * | 2015-02-23 | 2016-09-01 | 富士通オプティカルコンポーネンツ株式会社 | Optical module |